MW5IC970N NXP | Alldatasheet
Document overview
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- PDF pages: 14
Technical content
Features
- Characterized with Series Equivalent Large-Signal Impedance Parameters
- Integrated Quiescent Current Temperature Compensation with Enable/Disable Function
- On-Chip Current Mirror g m Reference FET for Self Biasing Application (1)
- Integrated ESD Protection
- 200°C Capable Plastic Package
- RoHS Compliant
- In Tape and Reel. R1 Suffix = 500 Units per 44 mm, 13 inch Reel.
Figure 1. Functional Block Diagram Figure 2. Pin Connections © Freescale Semiconductor, Inc., 2006, 2008, 2010. All rights reserved.
Table 1. Maximum Ratings Table 2. Thermal Characteristics Table 3. ESD Protection Characteristics Table 4. Moisture Sensitivity Level Table 5. Electrical Characteristics (TA = 25°C unless otherwise noted) Select Documentation/Application Notes - AN1955.
Figure 3. MW5IC970NBR1(GNBR1) Test Circuit Schematic Table 6. MW5IC970NBR1(GNBR1) Test Circuit Component Designations and Values
Figure 4. MW5IC970NBR1(GNBR1) Test Circuit Component Layout
Figure 10. Power Gain versus Output Power
MW5IC970NBR1 MW5IC970GNBR1 RF Device Data Freescale Semiconductor PACKAGE DIMENSIONS
MW5IC970NBR1 MW5IC970GNBR1
MW5IC970NBR1 MW5IC970GNBR1 RF Device Data Freescale Semiconductor
MW5IC970NBR1 MW5IC970GNBR1
MW5IC970NBR1 MW5IC970GNBR1 RF Device Data Freescale Semiconductor
MW5IC970NBR1 MW5IC970GNBR1
MW5IC970NBR1 MW5IC970GNBR1 RF Device Data Freescale Semiconductor PRODUCT DOCUMENTATION Refer to the following documents to aid your design process. Application Notes
- AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages
- AN1955: Thermal Measurement Methodology of RF Power Amplifiers
- AN1977: Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family
- AN1987: Quiescent Current Control for the RF Integrated Circuit Device Family
- AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over-Molded Plastic Packages
- AN3789: Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages Engineering Bulletins
- EB212: Using Data Sheet Impedances for RF LDMOS Devices
REVISION HISTORY
The following table summarizes revisions to this document. Revision Date Description 2 Apr. 2008 • Document Number changed from MW5IC970NBR1 to MW5IC970N with the addition of the MW5IC970GNBR1 part number. Revision history sequencing maintained from first release of data sheet, p. 1
- Added Case Operating Temperature limit to the Maximum Ratings table and set limit to 150°C, p. 2
- Updated Part Numbers in Table 6, Component Designations and Values, to RoHS compliant part numbers, p. 3
- Replaced Case Outline 1329-09, Issue L, with 1329-09, Issue M, p. 1, 7-9. Added pin numbers 1 through 17.
- Added Case Outline 1329A-04, Issue F, p. 1, 10-12
- Added Product Documentation and Revision History, p. 13 3 Jan. 2010 • Changed Storage Temperature Range in Max Ratings table from -65 to +200 to -65 to +150 for standardization across products, p. 2
MW5IC970NBR1 MW5IC970GNBR1 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale/C0116 and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006, 2008, 2010. All rights reserved. How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516
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