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Dual 3 MHz, 800 mA Buck Regulators with Two 300 mA LDOs Data Sheet ADP5037 Rev. D Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. Tel: 781.329.4700 ©2011–2013 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com
FEATURES
Main input voltage range: 2.3 V to 5.5 V Two 800 mA buck regulators and two 300 mA LDOs 24-lead, 4 mm × 4 mm LFCSP package Regulator accuracy: ±1.8% Factory programmable or external adjustable VOUTx
3 MHz buck operation with forced PWM and auto PWM/PSM
BUCK1/BUCK2: output voltage range from 0.8 V to 3.8 V LDO1/LDO2: output voltage range from 0.8 V to 5.2 V LDO1/LDO2: input supply voltage from 1.7 V to 5.5 V LDO1/LDO2: high PSRR and low output noise
APPLICATIONS
Power for processors, ASICS, FPGAs, and RF chipsets Portable instrumentation and medical devices Space constrained devices GENERAL DESCRIPTION The ADP5037 combines two high performance buck regulators and two low dropout (LDO) regulators in a small, 24-lead 4 mm × 4 mm LFCSP to meet demanding performance and board space requirements. The high switching frequency of the buck regulators enables tiny multilayer external components and minimizes the board space. When the MODE pin is set high, the buck regulators operate in forced PWM mode. When the MODE pin is set low and the load is above a predefined threshold, the buck regulators operate in PWM mode. When the load current falls below a predefined threshold, the regulator operates in power save mode (PSM), improving the light-load efficiency. Table 1. Family Models
2 EN pins
high as 10 kHz while operating with a low headroom voltage. of preset values in the fixed voltage version.
Rev. D | Page 2 of 28 TABLE OF CONTENTS Input and Output Capacitor, Recommended Specifications .. 5
REVISION HISTORY
5/13—Rev. C to Rev. D 1/13—Rev. B to Rev. C 8/12—Rev. A to Rev. B Changes to Output Voltage Accuracy, Table 2 and Voltage Changes to Output Voltage Accuracy, Table 3 and Voltage Moved Power Dissipation and Thermal Considerations 1/12—Rev. 0 to Rev. A 8/11—Revision 0: Initial Version
Rev. D | Page 3 of 28 SPECIFICATIONS GENERAL SPECIFICATIONS VAVIN = VIN1 = VIN2 = 2.3 V to 5.5 V; VIN3 = VIN4 = 1.7 V to 5.5 V; TJ = −40°C to +125°C for minimum/maximum specifications, and TA = 25°C for typical specifications, unless otherwise noted. Table 2. Parameter Symbol Test Conditions/Comments Min Typ Max Unit INPUT VOLTAGE RANGE VAVIN, VIN1, VIN2 2.3 5.5 V THERMAL SHUTDOWN Threshold TSSD TJ rising 150 °C Hysteresis TSSD-HYS 20 °C START-UP TIME1 BUCK1, LDO1, LDO2 tSTART1 250 µs BUCK2 tSTART2 300 µs EN1, EN2, EN3, EN4, MODE INPUTS Input Logic High VIH 1.1 V Input Logic Low VIL 0.4 V Input Leakage Current VI-LEAKAGE 0.05 1 µA INPUT CURRENT All Channels Enabled ISTBY-NOSW No load, no buck switching 108 175 µA All Channels Disabled ISHUTDOWN TJ = −40°C to +85°C 0.3 1 µA VIN1 UNDERVOLTAGE LOCKOUT High UVLO Input Voltage Rising UVLOVIN1RISE 3.9 V High UVLO Input Voltage Falling UVLOV IN1 FAL L 3.1 V Low UVLO Input Voltage Rising UVLOVIN1RISE 2.275 V Low UVLO Input Voltage Falling UVLOVIN1FAL L 1.95 V 1 Start-up time is defined as the time from EN1 = EN2 = EN3 = EN4 from 0 V to VAVIN to VOUT1, VOUT2, VOUT3, and VOUT4 reaching 90% of their nominal level. Start-up times are shorter for individual channels if another channel is already enabled. See the Typical Performance Characteristics section for more information.
Rev. D | Page 4 of 28 BUCK1 AND BUCK2 SPECIFICATIONS VAVIN = VIN1 = VIN2 = 2.3 V to 5.5 V; TJ = −40°C to +125°C for minimum/maximum specifications, and TA = 25°C for typical specifications, unless otherwise noted.1 Table 3. Parameter Symbol Test Conditions/Comments Min Typ Max Unit OUTPUT CHARACTERISTICS Output Voltage Accuracy ΔVOUT1/VOUT1, ΔVOUT2/VOUT2 PWM mode; ILOAD1 = ILOAD2 = 0 mA −1.8 +1.8 % Line Regulation (∆VOUT1/VOUT1)/∆VIN1, (∆VOUT2/VOUT2)/∆VIN2 PWM mode −0.05 %/V Load Regulation (∆VOUT1/VOUT1)/∆IOUT1, (∆VOUT2/VOUT2)/∆IOUT2 ILOAD = 0 mA to 800 mA, PWM mode −0.1 %/A VOLTAGE FEEDBACK VFB1, VFB2 Models with adjustable outputs 0.491 0.5 0.509 V OPERATING SUPPLY CURRENT MODE = ground BUCK1 Only IIN ILOAD1 = 0 mA, device not switching, all other channels disabled 44 μA BUCK2 Only IIN ILOAD2 = 0 mA, device not switching, all other channels disabled 55 μA BUCK1 and BUCK2 IIN ILOAD1 = ILOAD2 = 0 mA, device not switching, LDO channels disabled 67 μA PSM CURRENT THRESHOLD IPSM PSM to PWM operation 100 mA SW CHARACTERISTICS SW On Resistance RNFET VIN1 = VIN2 = 3.6 V 155 240 mΩ RPFET VIN1 = VIN2 = 3.6 V 205 310 mΩ RNFET VIN1 = VIN2 = 5.5 V 137 204 mΩ RPFET VIN1 = VIN2 = 5.5 V 162 243 mΩ Current Limit ILIMIT1, ILIMIT2 pFET switch peak current limit 1200 1550 1900 mA ACTIVE PULL-DOWN RPDWN-B Channel disabled 75 Ω OSCILLATOR FREQUENCY fSW 2.5 3.0 3.5 MHz 1 All limits at temperature extremes are guaranteed via correlation using standard statistical quality control (SQC). LDO1 AND LDO2 SPECIFICATIONS 1 µF; TJ = −40°C to +125°C for minimum/maximum specifications, and TA = 25°C for typical specifications, unless otherwise noted.1 Table 4. Parameter Symbol Test Conditions/Comments Min Typ Max Unit INPUT VOLTAGE RANGE VIN3, VIN4 1.7 5.5 V OPERATING SUPPLY CURRENT Bias Current per LDO2 IVIN3BIAS/IVIN4BIAS IOUT3 = IOUT4 = 0 µA 10 30 µA IOUT3 = IOUT4 = 10 mA 60 100 µA IOUT3 = IOUT4 = 300 mA 165 245 µA Total System Input Current IIN Includes all current into AVIN, VIN1, VIN2, VIN3, and VIN4 LDO1 or LDO2 Only IOUT3 = IOUT4 = 0 µA, all other channels disabled 53 µA LDO1 and LDO2 Only IOUT3 = IOUT4 = 0 µA, buck channels disabled 74 µA OUTPUT CHARACTERISTICS Output Voltage Accuracy ΔVOUT3/VOUT3, ΔVOUT4/VOUT4 100 µA < IOUT3 < 300 mA, 100 µA < IOUT4 < 300 mA −1.8 +1.8 % Line Regulation (∆VOUT3/VOUT3)/∆VIN3, (∆VOUT4/VOUT4)/∆VIN4 IOUT3 = IOUT4 = 1 mA −0.03 +0.03 %/V Load Regulation3 (∆VOUT3/VOUT3)/∆IOUT3, (∆VOUT4/VOUT4)/∆IOUT4 IOUT3 = IOUT4 = 1 mA to 300 mA 0.001 0.003 %/mA
Rev. D | Page 5 of 28 Parameter Symbol Test Conditions/Comments Min Typ Max Unit VOLTAGE FEEDBACK VFB3, VFB4 0.491 0.5 0.509 V DROPOUT VOL TAGE4 VDROPOUT VOUT3 = VOUT4 = 5.2 V, IOUT3 = IOUT4 = 300 mA 50 mV VOUT3 = VOUT4 = 3.3 V, IOUT3 = IOUT4 = 300 mA 75 140 mV VOUT3 = VOUT4 = 2.5 V, IOUT3 = IOUT4 = 300 mA 100 mV VOUT3 = VOUT4 = 1.8 V, IOUT3 = IOUT4 = 300 mA 180 mV CURRENT-LIMIT THRESHOLD5 ILIMIT3, ILIMIT4 335 600 mA ACTIVE PULL-DOWN RPDWN-L Channel disabled 600 Ω OUTPUT NOISE Regulator LDO1 NOISELDO1 10 Hz to 100 kHz, VIN3 = 5 V, VOUT3 = 2.8 V 100 µV rms Regulator LDO2 NOISELDO2 10 Hz to 100 kHz, VIN4 = 5 V, VOUT4 = 1.2 V 60 µV rms POWER SUPPLY REJECTION RATIO PSRR Regulator LDO1 10 kHz, VIN3 = 3.3 V, VOUT3 = 2.8 V, IOUT3 = 1 mA 60 dB 100 kHz, VIN3 = 3.3 V, VOUT3 = 2.8 V, IOUT3 = 1 mA 62 dB 1 MHz, VIN3 = 3.3 V, VOUT3 = 2.8 V, IOUT3 = 1 mA 63 dB Regulator LDO2 10 kHz, VIN4 = 1.8 V, VOUT4 = 1.2 V, IOUT4 = 1 mA 54 dB 100 kHz, VIN4 = 1.8 V, VOUT4 = 1.2 V, IOUT4 = 1 mA 57 dB 1 MHz, VIN4 = 1.8 V, VOUT4 = 1.2 V, IOUT4 = 1 mA 64 dB 1 All limits at temperature extremes are guaranteed via correlation using standard statistical quality control (SQC). 2 This is the input current into VIN3/VIN4, which is not delivered to the output load. 3 Based on an endpoint calculation using 1 mA and 300 mA loads. 4 Dropout voltage is defined as the input-to-output voltage differential when the input voltage is set to the nominal output voltage. This applies only to output voltages above 1.7 V. 5 Current-limit threshold is defined as the current at which the output voltage drops to 90% of the specified typical value. For example, the current limit for a 3.0 V output voltage is defined as the current that causes the output voltage to drop to 90% of 3.0 V, or 2.7 V. INPUT AND OUTPUT CAPACITOR, RECOMMENDED SPECIFICATIONS TA = −40°C to +125°C, unless otherwise specified. Table 5. Parameter Symbol Min Typ Max Unit NOMINAL INPUT AND OUTPUT CAPACITOR RATINGS BUCK1, BUCK2 Input Capacitor Ratings CMIN1, CMIN2 4.7 40 µF BUCK1, BUCK2 Output Capacitor Ratings CMIN1, CMIN2 10 40 µF LDO1 Input and Output Capacitor Ratings CMIN3, CMIN4 1.0 µF CAPACITOR ESR RESR 0.001 1 Ω 1 The minimum input and output capacitance should be greater than 0.70 µF over the full range of operating conditions. The full range of operating conditions in the application must be considered during device selection to ensure that the minimum capacitance specification is met. X7R- and X5R-type capacitors are recommended; Y5V and Z5U capacitors are not recommended for use because of their poor temperature and dc bias characteristics.
Dissipation and Thermal Considerations section. soldered in a circuit board for surface-mount packages. Table 7. Thermal Resistance
- NC = NOT INTERNALLY CONNECTED.
- IT IS RECOMMENDED THAT THE EXPOSED PAD
BE SOLDERED TO THE GROUND PLANE. Figure 2. Pin Configuration—View from the Top of the Die Table 8. Pin Function Descriptions 2 EN4 LDO2 Enable Pin. High level turns on this regulator, and low level turns it off. 3 VIN2 BUCK2 Input Supply (2.3 V to 5.5 V). Connect VIN2 to VIN1 and AVIN. 5 PGND2 Dedicated Power Ground for BUCK2. 6 NC No Connect. Leave this pin unconnected or connect to ground. 7 EN2 BUCK2 Enable Pin. High level turns on this regulator, and low level turns it off. BUCK2 resistor divider. For device models with fixed output voltage, leave this pin unconnected. 9 VOUT2 BUCK2 Output Voltage Sensing Input. Connect VOUT2 to the top of the capacitor on VOUT2. 10 VOUT1 BUCK1 Output Voltage Sensing Input. Connect VOUT1 to the top of the capacitor on VOUT1. BUCK1 resistor divider. For device models with fixed output voltage, leave this pin unconnected. 12 EN1 BUCK1 Enable Pin. High level turns on this regulator, and low level turns it off. 13 MODE BUCK1/BUCK2 Operating Mode. MODE = high: forced PWM operation. MODE = low: auto PWM/PSM operation. 14 PGND1 Dedicated Power Ground for BUCK1. 15 SW1 BUCK1 Switching Node. 16 VIN1 BUCK1 Input Supply (2.3 V to 5.5 V). Connect VIN1 to VIN2 and AVIN. 17 AVIN Analog Input Supply (2.3 V to 5.5 V). Connect AVIN to VIN1 and VIN2. 20 VOUT3 LDO1 Output Voltage. 21 VIN3 LDO1 Input Supply (1.7 V to 5.5 V). 22 EN3 LDO1 Enable Pin. High level turns on this regulator, and low level turns it off. 23 VIN4 LDO2 Input Supply (1.7 V to 5.5 V). 24 VOUT4 LDO2 Output Voltage. EPAD (EP) Exposed Pad. It is recommended that the exposed pad be soldered to the ground plane.
Figure 45. Functional Block Diagram function of the current load and the output capacitor value. values (see the Ordering Guide section). current due to the charging of the output capacitors.
connected to the output capacitor. FB1 is 0.5 V. Figure 47. BUCK1 External Output Voltage Setting enters an idle mode, which improves conversion efficiency. output voltage by adjusting the peak inductor current threshold. to make the output voltage rise again to the upper threshold. low sets the bucks to operate in auto PSM/PWM. switching frequency when both bucks are in PWM mode. discharge, preventing a runaway of output current. to the input of the converter. current from reversing direction and flowing out of the load.
overshoot on the output voltage. pull-downs during regulator activation and deactivation. makes the LDO ideal for battery-operated portable equipment. Figure 48. LDO1 External Output Voltage Setting with only a small 1 µF ceramic input and output capacitor. used in applications where noise performance is critical.
large load variation when working in PSM mode (see Figure 50). a low ESR capacitor is recommended. Table 10. Suggested 10 μF Capacitors Table 11. Suggested 4.7 μF Capacitors Table 12. Suggested 1.0 μF Capacitors Figure 50. Processor System Power Management with PSM/PWM Control
Rev. D | Page 22 of 28 POWER DISSIPATION AND THERMAL CONSIDERATIONS The ADP5037 is a highly efficient µPMU, and, in most cases, the power dissipated in the device is not a concern. However, if the device operates at high ambient temperatures and maximum loading condition, the junction temperature can reach the maximum allowable operating limit (125°C). When the temperature exceeds 150°C, the ADP5037 turns off all the regulators, allowing the device to cool down. When the die temperature falls below 130°C, the ADP5037 resumes normal operation. This section provides guidelines to calculate the power dissipated in the device and ensure that the ADP5037 operates below the maximum allowable junction temperature. The efficiency for each regulator on the ADP5037 is given by 100%×= IN OUT P Pη (1) where: η is the efficiency. PIN is the input power. POUT is the output power. Power loss is given by PLOSS = PIN − POUT (2a) or PLOSS = POUT (1− η)/η (2b) Power dissipation can be calculated in several ways. The most intuitive and practical is to measure the power dissipated at the input and all the outputs. Pe rform the measurements at the worst-case conditions (voltages, currents, and temperature). The difference between input and output power is dissipated in the device and the inductor. Use Equation 4 to derive the power lost in the inductor and, from this, use Equation 3 to calculate the power dissipation in the ADP5037 buck converter. A second method to estimate the power dissipation uses the efficiency curves provided for the buck regulator, and the power lost on each LDO can be calculated using Equation 12. When the buck efficiency is known, use Equation 2b to derive the total power lost in the buck regulator and inductor, use Equation 4 to derive the power lost in the inductor, and then calculate the power dissipation in the buck converter using Equation 3. Add the power dissipated in the buck and in the two LDOs to find the total dissipated power. Note that the buck efficiency curves are typical values and may not be provided for all possible combinations of V IN, VOUT, and IO U T. To account for these variations, it is necessary to include a safety margin when calculating the power dissipated in the buck. A third way to estimate the power dissipation is analytical and involves modeling the losses in the buck circuit provided by Equation 8 to Equation 11 and the losses in the LDO provided by Equation 12. BUCK REGULATOR POWER DISSIPATION The power loss of the buck regulator is approximated by PLOSS = PDBUCK + PL (3) where: PDBUCK is the power dissipation on one of the ADP5037 buck regulators. PL is the inductor power losses. The inductor losses are external to the device, and they do not have any effect on the die temperature. The inductor losses are estimated (without core losses) by PL ≈ IOUT1(RMS)2 × DCRL (4) where: DCRL is the inductor series resistance. IOUT1(RMS) is the rms load current of the buck regulator. 12+1)(1 rII OUT1RMSOUT ×= (5) where r is the normalized inductor ripple current. r = VOUT1 × (1 − D)/(IOUT1 × L × fSW) (6) where: L is the inductance. fSW is the switching frequency. D is the duty cycle. D = VOUT1/VIN1 (7) The ADP5037 buck regulator power dissipation, PDBUCK, includes the power switch conductive losses, the switch losses, and the transition losses of each channel. There are other sources of loss, but these are generally less significant at high output load currents, where the thermal limit of the application is. Equation 8 captures the calculation that must be made to estimate the power dissipation in the buck regulator. P DBUCK = PCOND + PSW + PTRAN (8) The power switch conductive losses are due to the output current, IOUT1, flowing through the P-MOSFET and the N-MOSFET power switches that have internal resistance, RDSON-P and RDSON-N. The amount of conductive power loss is found by PCOND = [RDSON-P × D + RDSON-N × (1 − D)] × IOUT1(RMS)2 (9) where RDSON-P is approximately 0.2 Ω, and RDSON-N is approxi- mately 0.16 Ω at 25°C junction temperature and VIN1 = VIN2 = 3.6 V. At VIN1 = VIN2 = 2.3 V , these values change to 0.31 Ω and 0.21 Ω, respectively, and at VIN1 = VIN2 = 5.5 V , the values are 0.16 Ω and 0.14 Ω, respectively.
Rev. D | Page 23 of 28 Switching losses are associated with the current drawn by the driver to turn on and turn off the power devices at the switching frequency. The amount of switching power loss is given by PSW = (CGATE-P + CGATE-N) × VIN12 × fSW (10) where: CGATE-P is the P-MOSFET gate capacitance. CGATE-N is the N-MOSFET gate capacitance. For the ADP5037, the total of (CGATE-P + CGATE-N) is approximately 150 pF . The transition losses occur because the P-channel power MOSFET cannot be turned on or off instantaneously, and the SW node takes some time to slew from near ground to near V OUT1 (and from VOUT1 to ground). The amount of transition loss is calculated by PTRAN = VIN1 × IOUT1 × (tRISE + tFALL) × fSW (11) where tRISE and tFALL are the rise time and the fall time of the switching node, SW . For the ADP5037, the rise and fall times of SW are in the order of 5 ns. If the preceding equations and parameters are used for estimat- ing the converter efficiency, it must be noted that the equations do not describe all of the converter losses, and the parameter values given are typical numbers. The converter performance also depends on the choice of passive components and board layout; therefore, a sufficient safety margin should be included in the estimate. LDO Regulator Power Dissipation The power loss of a LDO regulator is given by PDLDO = [(VIN − VOUT) × ILOAD] + (VIN × IGND) (12) where: ILOAD is the load current of the LDO regulator. VIN and VOUT are input and output voltages of the LDO, respectively. IGND is the ground current of the LDO regulator. Power dissipation due to the ground current is small and it can be ignored. The total power dissipation in the ADP5037 simplifies to PD = PDBUCK1 + PDBUCK2 + PDLDO1 + PDLDO2 (13) JUNCTION TEMPERATURE In cases where the board temperature, TA, is known, the thermal resistance parameter, θJA, can be used to estimate the junction temperature rise. TJ is calculated from TA and PD using the formula TJ = TA + (PD × θJA) (14) The typical θJA value for the 24-lead, 4 mm × 4 mm LFCSP is 35°C/W (see Table 7). A very important factor to consider is that θJA is based on a 4-layer 4 in × 3 in, 2.5 oz copper, as per JEDEC standard, and real applications may use different sizes and layers. It is important to maximize the copper used to remove the heat from the device. Copper exposed to air dissipates heat better than copper used in the inner layers. The exposed pad should be connected to the ground plane with several vias. If the case temperature can be measured, the junction temperature is calculated by T J = TC + (PD × θJC) (15) where TC is the case temperature and θJC is the junction-to-case thermal resistance provided in Table 7. When designing an application for a particular ambient temperature range, calculate the expected ADP5037 power dissipation (P D) due to the losses of all channels by using the Equation 8 to Equation 13. From this power calculation, the junction temperature, TJ, can be estimated using Equation 14. The reliable operation of the converter and the two LDO regulators can be achieved only if the estimated die junction temperature of the ADP5037 (Equation 14) is less than 125°C. Reliability and mean time between failures (MTBF) are highly affected by increas- ing the junction temperature. Additional information about product reliability can be found from the ADI Reliability Handbook, which can be found at www.analog.com/reliability_handbook.
Rev. D | Page 24 of 28 PCB LAYOUT GUIDELINES Poor layout can affect ADP5037 performance, causing electro- magnetic interference (EMI) and electromagnetic compatibility (EMC) problems, ground bounce, and voltage losses. Poor layout can also affect regulation and stability. A good layout is implemented using the following guidelines.
- Place the inductor, input capacitor, and output capacitor close to the IC using short tracks. These components carry high switching frequencies, and large tracks act as antennas.
- Route the output voltage path away from the inductor and SW node to minimize noise and magnetic interference.
- Maximize the size of ground metal on the component side to help with thermal dissipation.
- Use a ground plane with several vias connecting to the component side ground to further reduce noise interference on sensitive circuit nodes.
- Connect VIN1, VIN2, and AVIN together close to the IC using short tracks. In addition, refer to the UG-271 User Guide.
Rev. D | Page 26 of 28 BILL OF MATERIALS Table 13. Reference Value Part Number Vendor Package or Dimension (mm) CAVIN 0.1 µF, X5R, 6.3 V JMK105BJ104MV-F Taiyo-Yuden 0402 C3, C4, C7, C8 1 µF, X5R, 6.3 V LMK105BJ105MV-F Taiyo-Yuden 0402 C1, C2 4.7 µF, X5R, 6.3 V ECJ-0EB0J475M Panasonic-ECG 0402 C5, C6 10 µF, X5R, 6.3 V JMK107BJ106MA-T Taiyo-Yuden 0603 L1, L2 1 µH, 0.18 Ω, 850 mA BRC1608T1R0M Taiyo-Yuden 0603 1 µH, 0.085 Ω, 1400 mA LQM2MPN1R0NG0B Murata 2.0 × 1.6 × 0.9 1 µH, 0.059 Ω, 900 mA EPL2014-102ML Coilcraft 2.0 × 2.0 × 1.4 1 µH, 0.086 Ω, 1350 mA MDT2520-CN Toko 2.5 × 2.0 × 1.2 IC1 Four-regulator micro PMU ADP5037 Analog Devices 24-lead LFCSP
COMPLIANT TOJEDEC STANDARDS MO-220-WGGD-8.
0.20 REF
0.25 MIN
0.05 MAX
0.02 NOM
Figure 54. 24-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 4 BUCK1, BUCK2, and both LDO1 and LDO2: active pull-down resistor is programmable to be either enabled or disabled.
Rev. D | Page 28 of 28 NOTES ©2011–2013 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D09887-0-5/13(D)