ECC204-RBVCZ-T

Microchip Technology

ECC204 CryptoAuthentication™ Summary Data Sheet Revision A March 2023

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ECC204 MICROCHIP | Alldatasheet

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Technical content

Features

Cryptographic Authentication Device with Secure Hardware-Based Key Storage: – Protected storage for private key, certificates, symmetric key or user data
Hardware Support for the Asymmetric Sign: – ECDSA: FIPS186-4 Elliptic Curve Digital Signature – NIST standard P-256 Elliptic Curve Support
Hardware Support for SHA-256 and HMAC
Internal Asymmetric Key Generation
Internal High-Quality NIST SP 800-90A/B/C Random Number Generator (RNG)
Joint Interpretation Laboratory (JIL) Score for Resistance to Attackers with Attack Potential – High – Evaluated to the standard “Jil-Application-Of-Attack-Potential-To-Smartcards-V3.1” – Achieved through tamper-resistant countermeasures to resist environmental, non-invasive and invasive Fault attacks
FIPS 140-3 Compliance Mode Configuration Option
Field-Programmable EEPROM: – Single ECC private key – One device certificate and one CA signer certificate – Single symmetric secret key – 64-byte user memory – >40-year data retention at +55 ℃
Monotonic Counter with the Maximum Count Value of 10,000
Unique 72-bit Serial Number
Two Interface Options Available:
125 kbps Pulse-Width Modulated (PWM) single-wire serial interface (SWI)
Parasitic power support for single-wire interface with External Capacitor
400 kHz Fast mode I 2C interface
130 nA Nominal Sleep Current
Extended Industrial Temperature of -40 ℃ to +105℃ Ambient Operating Range
Human Body Model (HBM) ESD: I 2C Devices: >4 kV; SWI Devices >7 kV
Packaging Options:
8-pad UDFN (2 mm x 3mm), 8-lead SOIC, 3-lead Contact

Ecosystem Control Through asymmetric authentication / PKI
Disposables and Accessory Authentication
Disposable applications with limited use through programmable usage counter
Symmetric Authentication through use of an HMAC Key Pin Configuration and Pinouts

Table 1. Pin Configuration

4 Ground GND GND 2 Ground GND

5 Serial I/O SDA SI/O 3 Supply VCC

6 Serial Clock SCL NC — — —

8 Supply VCC VCC — — —

Figure 1. Pinouts(1)

Exposed backside paddle of the UDFN package is recommended to be connected to GND.

1.1 Use Cases

The ECC204 is a member of the Microchip CryptoAuthentication family of high-security cryptographic devices that combine world-class hardware-based key storage with hardware cryptographic accelerators to implement authentication. The ECC204 device has a command set that allows for its usage in many applications. The primary uses include the following:

Disposables and Accessory Authentication Authenticates that add-on accessories are authorized for use with a given host system. Both asymmetric and symmetric options can be implemented. Usage can be limited through the monotonic counter built into the device.
Ecosystem Control and Anti-Counterfeiting Validates that a system or component is authentic and comes from the OEM shown on the nameplate Tip: The use cases shown are examples of what can be implemented with the ECC204 but is not exhaustive. Contact Microchip Technical Support to determine if a use case outside of these can be implemented.

1.2 Device Features

The ECC204 includes an EEPROM array that can be used to store one private ECC P-256 key, two encoded certificates, one symmetric secret key, miscellaneous read/write data, consumption logging and security configurations. Write access to the various Data zone slots and configuration subzones of memory can be restricted. The device comes in one of two possible serial interfaces. The I2C version of the device supports a standard I2C interface at speeds of up to 400 kHz. The interface is compatible with the Standard and Fast modes I2C interface specifications. The device also supports a Microchip proprietary PWM Single-Wire Interface (SWI), which can reduce the number of GPIOs required on the system processor and/or reduce the number of pins on connectors. When in SWI mode, the ECC204 can be operated in Parasitic Power mode, reducing the pin count to just two pins. Each ECC204 unit is shipped with a unique 72-bit serial number. The ECC204 also features a wide array of defense mechanisms specifically designed to prevent physical attacks on the device itself or logical attacks on the data transmitted between the device and the system. Hardware restrictions on how a key is used or generated provide further defense against certain styles of attack. For those users interested in a higher level of security, a Compliance mode bit is available in the Configuration zone. If the Compliance bit is set, compliance with various aspects of FIPS 140-3 is enforced by the device. The ECC204 also has a monotonic counter that can be attached to either the ECC P-256 private key or the HMAC key to limit the use of one of these keys. If so desired, the monotonic counter can also be used by the host system.

1.3 Cryptographic Operation

The ECC204 device implements a complete asymmetric (public/private) key cryptographic signature solution based upon Elliptic Curve Cryptography and the ECDSA signature protocol. The device features hardware acceleration for the NIST standard P-256 prime curve and supports high-quality private key generation and ECDSA signature generation. The hardware accelerator can implement asymmetric cryptographic operations faster than software running on standard microcontrollers without the usual high risk of key exposure, which is endemic to standard microcontrollers.

© 2023 Microchip Technology Inc. and its subsidiaries Summary Data Sheet DS40002436A-page 6 The ECC204 also implements SHA-256 and its derivative HMAC hash. SHA-256 can be used to facilitate message hashing for ECDSA signature generation. The device is designed to securely store a private key along with its associated public keys and certificates. Random private key generation is done internally within the device to ensure that the private key can never be known outside of the device. The public key corresponding to a stored private key is always returned when the key is generated and can also be requested at a future point in time. The ECC204 can generate high-quality random numbers using its internal physical random number generator. This sophisticated function includes run-time health testing designed to ensure that values generated from the internal noise source contain sufficient entropy at the time of use. The RNG is designed to meet the requirements documented in the NIST SP800-90A, SP800-90B and SP800-90C documents. These random numbers can be employed for any purpose, including for use as part of the device’s cryptographic protocols. Each random number is assured to be essentially unique from all numbers ever generated on this or any other device; therefore, their inclusion in the protocol calculation ensures that replay attacks (i.e., re-transmitting a previously-successful transaction) will always fail. Related Links 2.1. Cryptographic Standards

2.1 Cryptographic Standards

ECC204 follows various industry standards for the computation of cryptographic results. These reference documents are described in the following sections. See the Microchip website for further documentation on NIST CAVP certification of these cryptographic functions.

2.1.1 SHA-256

The ECC204 computes the SHA-256 digest based on the algorithm documented here:

2.1.2 HMAC/SHA-256

ECC204 can compute an HMAC digest based upon SHA-256 using a key stored in the EEPROM as documented below: http://csrc.nist.gov/publications/fips/fips198-1/FIPS-198-1_final.pdf

2.1.3 Elliptic Curve Digital Signature Algorithm (ECDSA)

ECC204 computes the Elliptic Curve signatures according to the algorithm documented in:

ANSI X9.62-2005 www.ansi.org/

2.2 Security Features

2.2.1 Physical Security

The ECC204 incorporates a number of physical security features designed to protect the EEPROM contents from unauthorized exposure.

2.2.2 Random Number Generator (RNG)

The ECC204 device includes a high-quality cryptographic RNG implemented according to the NIST standards SP800-90A/B/C.

2.2.3 Compliance Mode

For enhanced security, a Compliance mode is included in the ECC204 device. This mode is enabled through use of a configuration bit. If the Compliance bit is set, compliance with various aspects of FIPS140-3 is enforced by the device.

Electrical Characteristics

3.1 Absolute Maximum Ratings

Operating Temperature -40°C to +105°C Storage Temperature -65°C to +150°C Maximum Operating Voltage 6.0V DC Output Low Current 20 mA Voltage on any Pin -0.5V to (VCC + 0.5V) -0.5V to (VCC + 0.5V) ESD Ratings: Human Body Model (HBM) ESD I2C Devices >4 kV Human Body Model (HBM) ESD SWI Devices >7 kV Charge Device Model (CDM) ESD >2 kV Note: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification are not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

3.2 DC Parameters

3.2.1 DC Parameters: All I/O Interfaces

Table 3-1. DC Parameters on All I/O Interfaces with VCC Power Applied Unless otherwise indicated, these values are applicable over the specified operating range from TA = -40°C to +105°C, VCC = +1.65V to +5.5V. Parameter Sym. Min. Typ. Max. Units Conditions Ambient Operating Temperature TA -40 — +105 °C — VCC Ramp Rate(4) VRISE — — 0.1 V/µs — Output Low Voltage VOL — — 0.4 V When the device is in Active mode, VCC = 1.65V to 3.6V for output-low current = 4.0 mA Input Low Threshold VIL1 -0.5 — 0.3*VCC V Device is active and CMOSEnable = 1 Input High Threshold VIH1 0.7*VCC — VCC+0.5 V Device is active and CMOSEnable = 1 Input Low Threshold(1, 2) VIL0 -0.5 — 0.5 V Device is active and CMOSEnable = 0 Input High Threshold(1, 2) VIH0 1.2 — VCC+0.5 V Device is active and CMOSEnable = 0 Input Leakage (I2C Signals) IIN -200 — 200 nA VIN = VCC or GND

© 2023 Microchip Technology Inc. and its subsidiaries Summary Data Sheet DS40002436A-page 9 Parameter Sym. Min. Typ. Max. Units Conditions Sleep Current(3) ISLEEP — 130 325(4) nA When the device is in Sleep mode, VCC ≤ 3.6V, I/O at either GND or VCC TA ≤ +55°C — 130 500 nA VCC ≤ 3.6V, I/O at either GND or VCC Full temperature Range — 130 1000 nA When the device is in Sleep mode Over full VCC and temperature range Current Consumption in I/O Mode II/O — 60 250 µA Waiting for I/O Theta JA ƟJA — 166 — °C/W 8-lead SOIC — 173 — °C/W 8-pad UDFN — 146 — °C/W 3-lead Contact Notes: 1. CMOSen = 0 must only be used when VCC is between 2.0V and 5.5V and the host is running on a lower supply voltage than the client. In this mode, the input buffers are referenced to an internal supply and VIL and VIH levels are independent of the external VCC supply over this range. For voltages lower than 2.0V, CMOSen must always be set to ‘1’. 2. CMOSen = 0 must not be used when SWI Parasitic Power mode is used. 3. The lowest system current will be achieved if the inputs are driven to V CC or allowed to be pulled up to VCC by the pull-up resistors on the signal lines. 4. This condition is characterized but not production tested.

3.2.2 DC Parameters: Single-Wire Interface

Table 3-2. DC Parameters on Single-Wire Interface(1) Unless otherwise indicated, these values are applicable over the specified operating range from TA = -40℃ to +105℃, VCC = +1.65V to +5.5V. Parameter Sym. Min. Typ. Max. Units Conditions Power Supply Voltage VCC 1.65V — 5.5V V — Output Low Voltage VOL — — 0.4 V When the device is in Active mode, VCC = 1.65V to 3.6V for output-low current = 8.0 mA Input High Leakage IIH — 1.0 2.0 uA VIN = VCC Input Low Leakage IIL -200 — 200 nA VIN = GND Bus Capacitance CBUS — — 500 pF —

© 2023 Microchip Technology Inc. and its subsidiaries Summary Data Sheet DS40002436A-page 10 Notes: 1. All specifications not shown can be found in the All I/O Interfaces Table 3-1. 2. The Single-Wire voltage must never be greater than V CC. 3. This condition is characterized but not production tested. 4. Operation over the C BUS range is ensured by design and is not production tested.

3.2.3 DC Parameters: Single-Wire Interface – Parasitic Power Mode

Table 3-3. DC Parameters on Parasitic Single-Wire Interface Unless otherwise indicated, these values are applicable over the specified operating range from TA = -40℃ to +105℃, CMOSen = '1' Parameter Sym. Min. Typ. Max. Units Conditions Max. I/O Voltage(2) VPUP 2.5 — 5.5 V — Output Low Voltage VOL — — 0.4 V When the device is in Active mode, VPUP = 2.5V to 3.6V for output-low current = 8.0 mA Input Low Leakage(4) IIL -200 — 200 nA VIN = GND, VCC_DVC ≥ 1.65V Input Low Threshold VIL1 -0.5 — 0.3*VPUP V — Input High Threshold VIH1 0.7*VPUP — VPUP+0.5 V — Bus Capacitance CBUS — — 500 pF — Notes: 1. All specifications not shown can be found in the All I/O Interfaces Table 3-1. 2. Single-Wire voltage (V PUP) must never be greater than the maximum VPUP operating voltage. 3. For the lowest system current, the SI/O signal must be driven to V PUP by the host or allowed to be pulled up by the pull-up resistors. 4. Input High leakage cannot be measured in parasitic power mode because the device and decoupling capacitor are charged via the SI/O signal. Low leakage is valid provided device was charged to be within the operational range. 5. Operation over the C BUS range is ensured by design and is not production tested.

ECC204 Trust Platform Variants and Provisioning Se... © 2023 Microchip Technology Inc. and its subsidiaries Summary Data Sheet DS40002436A-page 11 4. ECC204 Trust Platform Variants and Provisioning Services Microchip offers secure provisioning services for the ECC204 through the Trust Platform. It leverages the Trust Platform Design Suite set of tools (TPDS) and currently offers 3 provisioning flows:

Trust&GO: Pre-configured and pre-provisioned Secure Elements for fix-function use cases
TrustFLEX: Pre-configured & provisioned Secure Element with customer-unique credentials
TrustCUSTOM: Fully customizable Secure Element including configuration and provisioning with customer- unique credentials The Trust&GO flow provides pre-configured and pre-provisioned secure elements. These products are defined to meet common use case applications for customers that do not require unique credentials. These devices are provided as is and can be ordered directly from Microchip as easily as any standard product. The TrustFLEX flow leverages the TrustFLEX configurator to input unique customer credentials into a pre-defined configuration and generate a Secure Exchange Package. This package is, then, deployed via the Microchip Secure Provisioning System to enable device ordering. Then, only the customer designated in the Secure Exchange Package can order these devices. The TrustCUSTOM flow leverages the TrustCUSTOM configurator and provides the ability to fully configure the ECC204 device to meet the security requirements for a given application. At the end of the process, a Secure Exchange Package is generated that is deployed to the Microchip Secure Provisioning System. Then, only the customer designated in the Secure Exchange Package can order these devices. Important: The Microchip Secure Provisioning System is based on Hardware Security Modules (HSMs). ECC204 Trust Platform Products For the ECC204, only TrustFLEX and TrustCUSTOM variants of the products are currently available. The following devices are currently released versions of ECC204 Trust products. Additional products may be added in the future. ECC204-TFLXWPC
The ECC204-TFLXWPC was developed to meet the authentication requirements for Power Transmitters developed for the Wireless Power Consortium. Microchip is an authorized manufacturing CA of the Wireless Power Consortium. ECC204-TFLXAUTH
The ECC204-TFLXAUTH was developed to meet the authentication requirements for disposable and accessory applications. The devices provide the ability to do either asymmetric or symmetric authentication. Table 4-1. ECC204 Trust Platform Ordering Codes(1) Trust Platform Type Production Ordering Code Package Type Temperature Range TrustFLEX(2) ECC204-TFLXWPCU 8-Pad UDFN Extended Industrial. -40℃ to +105℃ ECC204-TFLXWPCS 8-Pin SOIC Extended Industrial. -40℃ to +105℃ ECC204-TFLXAUTHU 8-Pad UDFN Extended Industrial. -40℃ to +105℃ ECC204-TFLXAUTHS 8-Pin SOIC Extended Industrial. -40℃ to +105℃ TrustCUSTOM(3) ECC204-TCSMU 8-Pad UDFN Extended Industrial. -40℃ to +105℃ ECC204-TCSMS 8-Pin SOIC Extended Industrial. -40℃ to +105℃

ECC204 Trust Platform Variants and Provisioning Se... © 2023 Microchip Technology Inc. and its subsidiaries Summary Data Sheet DS40002436A-page 12 Notes: 1. This table is a representative sample of Trust Platform Devices. Refer to each Trust Platform Type for a more complete list. 2. For a complete list of ordering codes, including sample devices, see the respective data sheets. 3. TrustCUSTOM sample devices correspond to the standard generic ECC204 devices. ECC204-TCSMU/ ECC204-TCSMS is equivalent to ECC204-MAVDA-T/ECC204-SSVDA-T respectively.

Package Marking Information © 2023 Microchip Technology Inc. and its subsidiaries Summary Data Sheet DS40002436A-page 13 5. Package Marking Information As part of Microchip’s overall security features, the part marking for all crypto devices is intentionally vague. The marking on the top of the package does not provide any information as to the actual device type or the manufacturer of the device. The alphanumeric code on the package provides manufacturing information and will vary with assembly lot. It is recommended that the packaging mark not be used as part of any incoming inspection procedure.

0.25 C A–B D

C SEATING PLANE TOP VIEW SIDE VIEW VIEW A–A 0.10 C 0.10 C Microchip Technology Drawing No. C04-057-OA Rev K Sheet 1 of 2 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: 8-Lead Plastic Small Outline (OA) - Narrow, 3.90 mm (.150 In.) Body [SOIC] © 2022 Microchip Technology Inc. R 1 2 N θ c 4X θ1 4X θ1 (L1) L h h A2A A B e D E E 2E1 NOTE 5 NOTE 5 NX b

0.10 C A–B

H R VIEW C SEE VIEW C NOTE 1 D

© 2023 Microchip Technology Inc. and its subsidiaries Summary Data Sheet DS40002436A-page 18 Microchip Technology Drawing No. C04-057-OA Rev K Sheet 2 of 2 8-Lead Plastic Small Outline (OA) - Narrow, 3.90 mm (.150 In.) Body [SOIC] For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: © 2022 Microchip Technology Inc. R protrusions shall not exceed 0.15mm per side. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 4. Dimensioning and tolerancing per ASME Y14.5M Notes: 5. Datums A & B to be determined at Datum H. Foot Angle 0° – 8° ––0°Lead Angle 0.51–0.31bLead Width 0.25–0.17cLead Thickness 1.27–0.40LFoot Length 0.50–0.25hChamfer (Optional)

4.90 BSCDOverall Length

3.90 BSCE1Molded Package Width

6.00 BSCEOverall Width

0.25–0.10A1Standoff -–1.25A2Molded Package Thickness 1.75––AOverall Height

1.27 BSCePitch

Footprint L1 1.04 REF Mold Draft Angle 5° – 15° θ ––0.07R1Lead Bend Radius ––0.07RLead Bend Radius

© 2023 Microchip Technology Inc. and its subsidiaries Summary Data Sheet DS40002436A-page 19 RECOMMENDED LAND PATTERN Microchip Technology Drawing C04-2057-OA Rev K BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M1. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: © 2022 Microchip Technology Inc. R Dimension Limits Units CContact Pad Spacing Contact Pitch MILLIMETERS

1.27 BSC

E MAX 5.40 Contact Pad Length (X8) Contact Pad Width (X8) 1.55 0.60 NOM E C SILK SCREEN 8-Lead Plastic Small Outline (OA) - Narrow, 3.90 mm (.150 In.) Body [SOIC]

0.10 C A B

(DATUM B) (DATUM A) C SEATING PLANE NOTE 1 TOP VIEW SIDE VIEW BOTTOM VIEW 0.10 C 0.08 C Microchip Technology Drawing C04-21303 Rev A Sheet 1 of 2 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: 3-Lead Contact Package (LAB) - 6.54x2.5 mm Body [Contact] Atmel Legacy Global Package Code RHB © 2017 Microchip Technology Inc. D ENOTE 1 e 3X b 3X L (K) (K) A 123 g f

© 2023 Microchip Technology Inc. and its subsidiaries Summary Data Sheet DS40002436A-page 21 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: © 2017 Microchip Technology Inc. REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Dimensioning and tolerancing per ASME Y14.5M Microchip Technology Drawing C04-21303 Rev A Sheet 2 of 2 3-Lead Contact Package (LAB) - 6.54x2.5 mm Body [Contact] Atmel Legacy Global Package Code RHB Number of Terminals Overall Height Terminal Width Overall Width Terminal Length Pitch Standoff Units Dimension Limits A b e L E N

2.00 BSC

2.10 1.60 0.45 0.00 1.70 2.20 0.50 0.02

2.50 BSC

2.30 1.80 0.55 0.05 MAX K 0.30 REFTerminal-to-Terminal Spacing Overall Length D 6.50 BSC f 0.400.30 0.50Package Edge to Terminal Edge g 0.150.05 0.25Package Edge to Terminal Edge

Revision History

© 2023 Microchip Technology Inc. and its subsidiaries Summary Data Sheet DS40002436A-page 23 Microchip Information The Microchip Website Microchip provides online support via our website at www.microchip.com/. This website is used to make files and information easily available to customers. Some of the content available includes:

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© 2023 Microchip Technology Inc. and its subsidiaries Summary Data Sheet DS40002436A-page 24 Product Identification System To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. -XX X XX -X Device Package Temp Range I/O Type Tape and Reel Device: ECC204: Cryptographic Coprocessor with Secure Hardware-Based Key Storage Package Options SS 8-Lead (0.150” Body), Plastic Gull Wing Small Outline (JEDEC SOIC) MA 8-Pad (2 x 3 x 0.6 mm Body), Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead Package (UDFN) RB 3RB, 3-Lead (2.5 x 6.5 mm Body), 2.0 mm pitch, Contact Package (Sawn). Temperature Option V Extended Industrial Temperature Range: -40℃ to +105℃ I/O Type CZ Single-Wire Interface DA I2C Interface Tape and Reel Options B Tube T Tape and Reel (size varies by package type) Examples:

ECC204-SSVCZ-T: 8-Lead (0.150” Body), Plastic Gull Wing Small Outline (JEDEC SOIC), -40℃ to +105℃, Single-Wire, Tape and Reel, 3,300 per Reel.
ECC204-SSVDA-T: 8-Lead (0.150” Body), Plastic Gull Wing Small Outline (JEDEC SOIC), -40 ℃ to +105℃, I2C, Tape and Reel, 3,300 per Reel.
ECC204-MAVCZ-T: 8-Pad (2 x 3 x 0.6 mm Body), Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead Package (UDFN), -40℃ to +105℃, Single-Wire, Tape and Reel, 5,000 per Reel.
ECC204-MAVDA-T: 8-Pad (2 x 3 x 0.6 mm Body), Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead Package (UDFN), -40℃ to +105℃, I2C, Tape and Reel, 5,000 per Reel.
ECC204-RBVCZ-T: 3-Lead Contact Package, -40 ℃ to +105℃, Single-Wire, Tape and Reel, 5,000 per Reel.
ECC204-RBVCZ-B: 3-Lead Contact Package, -40 ℃ to +105℃, Single-Wire, Tube, 56 per Tube. Notes: 1. Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. 2. Small form-factor packaging options may be available. Please check www.microchip.com/packaging for small- form factor package availability or contact your local Sales Office. Microchip Devices Code Protection Feature Note the following details of the code protection feature on Microchip products:
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and under normal conditions.
Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to continuously improving the code protection features of our products.

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Product Information

ECC204-RBVCZ-T specifications and overview.

Summary

ECC204 CryptoAuthentication™ Summary Data Sheet Revision A March 2023

Description

ECC204 CryptoAuthentication™ Summary Data Sheet Revision A March 2023

Source title ECC204-RBVCZ-T Datasheet(PDF) - Microchip Technology

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