EC1089B

EC1089 ETC | Alldatasheet

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Technical content

Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com December 2004 EC1089 InGaP HBT Gain Block Product Information The Communications Edge TM Product Features x 10 – 2500 MHz x +24 dBm P1dB x +41 dBm OIP3 x 15.5 dB Gain at 900 MHz x 12.2 dB Gain at 1900 MHz x Available in SOT-89 and lead-free / green SOT-89 Package Styles x Internally matched to 50 :

Applications

x Final stage amplifiers for Repeaters x Defense / Homeland Security Product Description The EC1089 is a high dynamic range driver amplifier in a low-cost surface mount package. The InGaP/GaAs HBT is able to achieve high performance across a broad range with +41 dBm OIP3 and +24 dBm of compressed 1dB power. It is housed in an industry standard SOT-89 SMT package. The EC1089 is also available in a lead-free/green/RoHS- compliant SOT-89 package. All devices are 100% RF and DC tested. The EC1089 is targeted for use as a driver amplifier in wireless infrastructure where high linearity and medium power is required. An internal active bias allows the EC1089 to maintain high linearity over temperature and operate directly off a single +5 V supply. This combination makes the device an excellent candidate for transceiver line cards in current and next generation multi-carrier 3G base stations. Functional Diagram RF IN GND RF OUT GND 1 2 3 EC1089B / EC1089B-G Specifications (1) Parameters Units Min Typ Max Operational Bandwidth MHz 10 2500 Test Frequency MHz 1900 Gain dB 10.5 12.2 Input Return Loss dB 15 Output Return Loss dB 10 Output P1dB dBm +23.5 Output IP3 (2) dBm +40 +41 IS-95A Channel Power @ -45 dBc ACPR dBm +17 Noise Figure dB 5.9 Test Frequency MHz 2140 Gain dB 11.5 Output P1dB dBm +23.5 Output IP3 (2) dBm +40 Operating Current Range mA 140 160 175 Device Voltage V +5 1. Test conditions unless otherwise noted: 25º C, Supply Voltage = +5 V, , in tuned application circuit. 2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Absolute Maximum Rating Parameter Rating Operating Case Temperature -40 to +85 qC Storage Temperature -65 to +150 qC RF Input Power (continuous) +18 dBm Device Voltage +6 V Device Current 220 mA Junction Temperature +250 qC Operation of this device above any of these parameters may cause permanent damage. Typical Performance (3) Parameters Units Typical Frequency MHz 900 1900 2140 S21 - Gain dB 15.5 12.2 11.5 S11 - Input R.L. dB -14 -15 -15 S22 - Output R.L. dB -10 -10 -10 Output P1dB dBm +24 +23.5 +23.5 Output IP3 dBm +40 +41 +40 Noise Figure dB 5.1 5.9 5.4 Supply Bias +5 V @ 160 mA 3. Typical parameters reflect performance in a tuned application circuit: Supply Voltage = +5 V, I = 160 mA, +25 C

Ordering Information

Part No. Description EC1089B InGaP HBT Gain Block (leaded SOT-89 Pkg) EC1089B-G InGaP HBT Gain Block (lead-free/green/RoHS-compliant SOT-89 Pkg) EC1089B-PCB900 900 MHz Evaluation Board EC1089B-PCB1900 1900 MHz Evaluation Board EC1089B-PCB2140 2140 MHz Evaluation Board

Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com December 2004 EC1089 ¼ Watt, High Linearity InGaP HBT Amplifier Product Information The Communications Edge TM Typical Device Data S-Parameters (VDS = +5 V, Icc = 160 mA, T = 25 C, unmatched 50 ohm system) 0 0.5 1 1.5 2 2.5 Frequency (GHz) Gain / Maximum Stable Gain Gain (dB) DB(|S[2,1]|) DB(GMax) 1.0 1.0-1.0 10.0 10.0 -10.0 5.0 5.0 -5.0 2.0 2.0 -2.0 3.0 3.0 -3.0 4.0 4.0 -4.0 0.2 0.2 -0.2 0.4 0.4 -0.4 0.6 0.6 -0.6 0.8 0.8 -0.8 S11 Swp Max 6GHz Swp Min 0.1GHz 1.0 1.0-1.0 10.0 10.0 -10.0 5.0 5.0 -5.0 2.0 2.0 -2.0 3.0 3.0 -3.0 4.0 4.0 -4.0 0.2 0.2 -0.2 0.4 0.4 -0.4 0.6 0.6 -0.6 0.8 0.8 -0.8 S22 Swp Max 6GHz Swp Min 0.1GHz Notes: The gain for the unmatched device in 50 ohm system is shown as the trace in black color. For a tuned circuit for a particular frequency, it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line. The return loss plots are shown from 50 – 3000 MHz, with markers placed at 0.5 – 3.0 GHz in 0.5 GHz increments. S-Parameters (VDS = +5 V, IDS = 160 mA, T = 25 C, unmatched 50 ohm system, calibrated to device leads) Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) Device S-parameters are available for download off of the website at: http://www.wj.com Application Circuit PC Board Layout Circuit Board Material: .014” Getek, 4 layers (other layers added for rigidity), .062” total thickness, 1 oz copper Microstrip line details: width = .026” , spacing = .026”

Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com December 2004 EC1089 ¼ Watt, High Linearity InGaP HBT Amplifier Product Information The Communications Edge TM

900 MHz Application Circuit (EC1089B-PCB900)

S21 ± Gain 15.5 dB S11 ± Input Return Loss -15dB S22 ± Output Return Loss -10 dB Output IP3 (+11 dBm / tone, 1 MHz spacing) +40 dBm Output P1dB +24 dBm Noise Figure 5.1 dB Supply Voltage +5 V Supply Current 160 mA Measured parameters were taken at 25 CAP ID= 56 pF C4 CAP ID= 56 pF RES ID=

2700 Ohm

ID= 5.6 pF C12 DIODE1 ID= D1 RES ID=

0 Ohm

ID= 56 pF CAP ID= 1000 pF CAP ID= 1e5 pF IND ID= 33 nH CAP ID= 1.0 pF C13 SUBCKT NET= ID= "EC1089B" PORT

50 Ohm

Vcc = +5 V 5.6 V C12 should be placed at the silk screen marker "F" on the WJ evaluation board. All passive components are of size 0603 unless otherwise noted. size 1206 size 0805 The capacitor should be placed 14° @ 0.9GHz from pin 1. C13 should be placed at the silk screen marker "8" on the WJ evaluation board. The capacitor should be placed 19° @ 0.9GHz from pin 3. OIP3 vs. Frequency 600 700 800 900 1000 1100 Frequency (.9 GHz Matching) OIP3 (dBm) 25°C -40°C +85°C Average CDMA ACPR 10 12 14 16 18 Average output power (dBm) ACPR (dBc) Note: (IS95) ACPR1 measured at 750KHz, Forward 9 Channel

1900 MHz Application Circuit (EC1089B-PCB1900)

S21 ± Gain 12.2 dB S11 ± Input Return Loss -15 dB S22 ± Output Return Loss -10 dB Output IP3 (+11 dBm / tone, 1 MHz spacing) +41 dBm Output P1dB +23 dBm Noise Figure 5.9 dB Supply Voltage +5 V Supply Current 160 mA Measured parameters were taken at 25 CAP ID= 56 pF C4 CAP ID= 56 pF IND ID= 18 nH RES ID= ID= 2.7 nH CAP ID= 2.4 pF CAP ID= 1.2 pF C13 DIODE1 ID= D1 CAP ID= 56 pF CAP ID= 1000 pF CAP ID= 1e5 pF SUBCKT NET= ID= "EC1089B" PORT

1 PORT

Vcc = +5 V 5.6 V marker "A" on the WJ evaluation board. C7 should be placed at the silk screen All passive components are of size 0603 unless otherwise noted. 5° @ 1.9GHz from pin 1. The capacitor should be placed 34° @ 1.9GHz from pin 3. The capacitor should be placed marker "7" on the WJ evaluation board. C13 should be placed at the silk screen size 1206 size 0805 OIP3 vs. Temperature vs. Frequency 1600 1700 1800 1900 2000 2100 Frequency (MHz) dBm 25°C -40°C 85°C Average CDMA ACPR 10 12 14 16 18 Average output power (dBm) ACPR (dBc) Note: (IS95) ACPR1 measured at 750KHz, Forward 9 Channel

Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com December 2004 EC1089 ¼ Watt, High Linearity InGaP HBT Amplifier Product Information The Communications Edge TM

2140 MHz Application Circuit (EC1089B-PCB2140)

S21 ± Gain 11.5 dB S11 ± Input Return Loss -15 dB S22 ± Output Return Loss -10 dB Output IP3 (+10 dBm / tone, 1 MHz spacing) +40 dBm Output P1dB +23 dBm Noise Figure 5.4 dB Supply Voltage +5 V Supply Current 160 mA Measured parameters were taken at 25 CAP ID= 56 pF C4 CAP ID= 56 pF IND ID= 18 nH RES ID= ID= 1.5 pF C12 CAP ID= 0.8 pF C13 DIODE1 ID= D1 CAP ID= 1.5 pF CAP ID= 56 pF CAP ID= 1000 pF CAP ID= 1e5 pF SUBCKT NET= ID= "EC1089B" PORT Vcc = +5 V 5.6 V All passive components are of size 0603 unless otherwise noted. size 1206 size 0805 39° @ 2.14GHz from pin 3. The capacitor should be placed screen marker "6" on the WJ evaluation board. C13 should be placed at the silk 33° @ 2.14GHz from pin 1. The capacitor should be placed screen marker "F" on the WJ evaluation board. C12 should be placed at the silk from pin 1. C6 should be placed 19.5° @ 2.14GHz

Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com December 2004 EC1089 ¼ Watt, High Linearity InGaP HBT Amplifier Product Information The Communications Edge TM EC1089B (SOT-89 Package) Mechanical Information This package may contain lead-bearing materials. The plating material on the leads is SnPb. Outline Drawing Land Pattern Product Marking The component will be marked with an “ 1089” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “ Application Notes” section. MSL / ESD Rating ESD Rating: Class 1A Value: Passes between 250 and 500V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +235 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135º ) diameter drill and have a final plated thru diameter of .25 mm (.010º ). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Thermal Specifications Parameter Rating Operating Case Temperature -40 to +85q C Thermal Resistance (1) 149q C / W Junction Temperature (2) 204q C Notes: 1. The thermal resistance is referenced from the junction- to-case at a case temperature of 85 2. This corresponds to the typical biasing condition of +5V, 160 mA at an 85 C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247 MTTF vs. GND Tab Temperature 1.0 10.0 100.0 1000.0 60 70 80 90 100 110 120 Tab Temperature (°C)

Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com December 2004 EC1089 ¼ Watt, High Linearity InGaP HBT Amplifier Product Information The Communications Edge TM EC1089B-G (Green / Lead-free SOT-89 Package) Mechanical Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260qC reflow temperature) and leaded (maximum 245qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu. Outline Drawing Land Pattern Product Marking The component will be marked with an ª 1089Gº designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the ª Application Notesº section. MSL / ESD Rating ESD Rating: Class 1A Value: Passes between 250 and 500V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135º ) diameter drill and have a final plated thru diameter of .25 mm (.010º ). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Thermal Specifications Parameter Rating Operating Case Temperature -40 to +85q C Thermal Resistance (1) 149q C / W Junction Temperature (2) 204q C Notes: 1. The thermal resistance is referenced from the junction- to-case at a case temperature of 85 2. This corresponds to the typical biasing condition of +5V, 160 mA at an 85 C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247 MTTF vs. GND Tab Temperature 1.0 10.0 100.0 1000.0 60 70 80 90 100 110 120 Tab Temperature (°C)