E401201 HOKURIKU | Alldatasheet
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A D B C G F E Through-hole Copper Foil 䂓Features Significant cost reduction is possible by replacing copper plating through-hole PWB with polymer through-hole PWB. High density circuit design is widely available. Double sided surface mount PWB is available by using polymer through-hole PWB. Highly reliable PWB is realized by using polymer through-holes on paper phenolic board. 䂓Construction 䂓Design Requirement 䂓Specification Double Sided (Silver / Copper) Polymer Through Hole Board No. Name No. Name Base Solder Resist Copper Foil Covercoat & Marking Through-hole Through-hole Pitch Through-hole Pitch:A C D E F G (mm) AgTh CuTh Copper paste through-hole pitch: Silver Paste Copper Paste Min. 1.25mm 100m㱅/hole 100m 㱅 /hole 300mA/hole 300mA/hole 50V * (20V) 100V Different electric potential Voltage (*Applied less than 1.25mm pitch) 200m 㱅/hole 200m 㱅/hole 70㷄 1000Hr 200m 㱅/hole 200m 㱅/hole 40㷄 90 ~ 95%RH 1000Hr 200m 㱅/hole 200m 㱅/hole 100㷄 1000Hr 200m 㱅/hole 200m 㱅/hole 40㷄 90 ~ 95%RH 1000Hr 200m 㱅/hole 200m 㱅/hole 260㷄 5sec. 200m 㱅/hole 200m 㱅/hole 240㷄 3sec. 200m 㱅/hole 200m 㱅/hole 40㷄 90 ~ 95%RH 1000Hr 200m 㱅/hole 200m 㱅/hole 260㷄 10sec 100 Cycle 200m 㱅/hole 200m 㱅/hole -40㷄 100㷄 30min. 100 cycle Item Condition Material of Base Specification FR-1, CEM-3 Through-hole Ambient Temperature Conductive Resin -30 ~ +100㷄 Through-hole Resistance Rated Current Load Life Humidity Load Life Max. Operation Voltage Migration Oil Dipping Heat Cycle High Temperature Humidity Solder Dipping Reflow 㽲 㽳 㽴 㽵 㽷 㽶 㽲 㽳 㽴 㽵 㽶 㽷 Less than 1.25mm pitch:250mA/hole Specifications are subject to change without notice.HOKURIKU 1
(260㷄 5sec 5Cycle) 100 150 200 250 Through-hole Resistance (m㱅 /2hole) Ag Th Cu Th Initial 100 300 Heat Cycle (100Cycle) (-40㷄 30min 100㷄 30min) 100 150 200 250 Through-hole Resistance (m㱅 /2hole) Ag Th Cu Th Characteristic (Reference Data) Ag Th : Ag Paste (1.5mm pitch , FR-1 , t=1.6mm) Cu Th : Copper Paste (1.5mm pitch , FR-1 , t=1.6mm ) Double Sided (Silver / Copper) Polymer Through Hole Board High Temp. Test (100㷄) 100 150 200 250 0 250 500 750 1000 Time (Hr) Through-hole Resistance (m㱅 /2hole) Ag Th Cu Th Humidity Test (60㷄 90䌾95%Rh) 100 150 200 250 0 250 500 750 1000 Time (Hr) Through-hole Resistance (m㱅 /2hole) Ag Th Cu Th Load Life (70㷄 300mA) 100 150 200 250 0 250 500 750 1000 Time (Hr) Through-hole Resistance (m㱅 /2hole) Ag Th Cu Th Humidity Load Life (40㷄 90䌾95%Rh 300mA) 100 150 200 250 0 250 500 750 1000 Time (Hr) Through-hole Resistance (m㱅/2hole) Ag Th Cu Th Migration (40㷄 90䌾95%Rh DC50V) 䇭 1.E+07 1.E+08 1.E+09 1.E+10 1.E+11 1.E+12 1.E+13 0 500 1000 1500 2000 Time (Hr) InsulationResistance (㱅 ) Ag Th Migration (60㷄 90䌾95%Rh DC100V) 1.E+07 1.E+08 1.E+09 1.E+10 1.E+11 1.E+12 1.E+13 0 500 1000 1500 2000 Time (Hr) InsulationResistance (㱅 ) Ag Th Cu Th Initial 1 3 5 Reflow Dipping (230㷄 3sec 5Cycle) 100 150 200 250 Through-hole Resistance (m㱅 /2hole) Ag Th Cu Th Initial 20 50 100 Oil Dipping (260㷄 10sec 100Cycle) 100 150 200 250 Through-hole Resistance (m㱅 /2hole) Ag Th Cu Th Specifications are subject to change without notice.HOKURIKU 2