CEM311_V01 AXIOMTEK | Alldatasheet
Document overview
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- PDF pages: 3
Technical content
Features
(optional) Intel® Pentium® processor N4200 & Celeron® processor N3350 Rear view Low Power USB 3.0 USBUSB DualView Full Solid Cap Design AiRDDDR3L DDR3LDDR3L Specifications Core System CPU Intel® Pentium® processor N4200 & Celeron® processor N3350 (Apollo Lake) onboard System Memory 4GB DDR3L memory onboard 8GB LPDDR4 memory onboard Chipset SoC integrated BIOS AMI uEFI (Legacy free) Storage eMMC 5.0 upto 64GB (optional) Watchdog Timer 65536 levels, 0 to 65535 sec. Expansion Interface 4 x PCIe x1 devices (3 x1 while internal LAN is connected) Battery Lithium N/A Power Input ATX: +12V, +5VSB AT: +12V Wide range input: +4.75V to +20V Display Chipset Intel® Gen 9 Graphics Engine Support Gfx-DX12.0, OCL2.0, OGL 4.3 Display Interface 1 x DDI (DP , HDMI, DVI) 1 x LVDS; 18/24-bit single channel (eDP optional)
- Intel® Pentium® processor N4200 & Celeron® processor N3350 (Apollo Lake)
- 4GB DDR3L / 8GB LPDDR4 memory onboard
- Max. up to 4 lanes of PCI Express
- 2 SATA-600
- 2 USB 3.0 and 8 USB 2.0
- All specifications and photos are subject to change without notice. System on Modules 1 2928
Ordering Information
(P/N: E38D311103) COM Express Type 10 compact module with Intel® Pentium® N4200, DDI/LVDS, USB 3.0, and GbE LAN CEM311PG-N3350 (P/N: E38D311100) COM Express Type 10 compact module with Intel® Celeron® N3350, DDI/LVDS, USB 3.0, and GbE LAN CEM311-G3C-P1G (P/N:E38D311107) COM Express Type 10 compact module with Intel® Pentium® N4200, DDI/LVDS, USB 3.0, GbE LAN, LPDDR4 8GB, and eMMC 64GB CEM311-H2B-P1G (P/N:E38D311108) COM Express Type 10 compact module with Intel® Pentium® N3350, DDI/LVDS, USB 3.0, GbE LAN, LPDDR4 4GB, and eMMC 32GB 7128D311000E CEM311 heat spreader E39J011100 CEM311 heat sink without fan I/O MIO 1 x LPC interface 1 x SPI interface 2 x Serial TX/RX 1 x I C SATA 2 x SATA-600 Hardware Monitoring Yes Ethernet 1 x 10/100/1000 Mbps Ethernet with Intel® i211AT; supports Wake-on-LAN, PXE Boot ROM Audio HD link interface to baseboard for Codec USB 2 x USB 3.0 8 x USB 2.0 TPM N/A SMBus Yes Digital I/O 4-CH in & 4-CH out Smart Battery Yes Mechanical and Environmental Dimensions 84 x 55 mm Board Thickness 2.0 mm Temperature -20°C to +70°C (-4°F to +158°F), operation Operation Humidity 10% - 95% relative humidity, non-condensing Vibration 3.5 Grms Packing List Quick installation guide
USB 2.0 x 8 SPI BIOS USB 3.0 x 2 SMBUS I2C SPI LPC EC IT8528VG-I LPC GPIO Serial port x 2 (only TX / RX) HDA GEb eDP DDI 0 LVDS Apollo Lake Series COM Express Type 10 Connector BGA1296 Intel DDR3L x16 4G/8G Channel 1 Intel i210IT Intel i211AT -40~95 0~70 CH7511B-BFI -40~85 (OPTION) SD CARD (OPTION)