CEM130 AXIOMTEK | Alldatasheet

Document overview

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Technical content

Features

AMD Ryzen™ Embedded V1000 processor 2 x DDR4 SO-DIMM COM Express connector DDR4 DDR4DDR4 USB 3.0 USBUSB TripleView Full Solid Cap Design Low Power AMS.AXView Specifications Core System CPU AMD Ryzen™ Embedded V1000 series V1202B / 2.3 GHz (12-25W) V1605B / 2.0 GHz (12-25W) V1756B / 3.25 GHz (35-54W) V1807B / 3.35 GHz (35-54W) System Memory 2 x DDR4-2400/3200 SO-DIMM, up to 64GB (dual channel)*, non-ECC/ECC memory *Memory speed was depend on memory rank. Chipset SoC integrated BIOS AMI uEFI (Legacy free) Storage N/A Watchdog Timer 65536 levels, 0 to 65535 sec. Expansion Interface 7 x PCIe x1 via PCIe bridge Battery Lithium N/A Power Input ATX: +12V, +5VSB AT: +12V Wide range input: +8V to +20V Display Graphic Radeon™ RX Vega Graphics with up to 11 compute units H.265 (10-bit) decode & (8-bit) encode, VP9 decode Display Interface 1 x VGA; 1920 x 1200 @60Hz 1 x LVDS dual-channel 18/24-bit or eDP 1.3 (optional) 2 x DDI (HDMI 1.4, DVI, DisplayPort 1.2)* *HDMI 2.0 needs redriver chip on carrier board/DisplayPort 1.4 needs Redriver chip on carrier board

  • AMD Ryzen™ Embedded V1000 processors
  • 2 DDR-2400/3200 SO-DIMM for up to 64GB of memory
  • Max. up to 7 lanes of PCI Express
  • 2 SATA-600
  • 3 USB 3.0 and 8 USB 2.0
  • TPM 2.0 supported
  • Wide voltage input from +8V to +20V
  • All specifications and photos are subject to change without notice. System on Modules 1 3534

Ordering Information

(P/N: E38D130103) COM Express Type 6 Compact module with AMD Ryzen™ Embedded V1202B, DDI, LVDS, GbE LAN, USB 3.0 and TPM CEM130-V1605B (P/N: E38D130102) COM Express Type 6 Compact module with AMD Ryzen™ Embedded V1605B, DDI, LVDS, GbE LAN, USB 3.0 and TPM CEM130-V1756B (P/N: E38D130101) COM Express Type 6 Compact module with AMD Ryzen™ Embedded V1756B, DDI, LVDS, GbE LAN, USB 3.0 and TPM CEM130-V1807B (P/N: E38D130100) COM Express Type 6 Compact module with AMD Ryzen™ Embedded V1807B, DDI, LVDS, GbE LAN, USB 3.0 and TPM Optional CEB94011 (P/N: E394011100) COM Express Type 6 application board E39J014100 CEM130 heat sink with fan 7128D130000E CEM130 heat spreader I/O SATA 2 x SATA-600 Hardware Monitoring Yes Ethernet 1 x 10/100/1000 Mbps Ethernet with Intel® i210; supports Wake-on-LAN, PXE Boot ROM Audio HD link interface to baseboard for Codec USB 3 x USB 3.0 8 x USB 2.0 Serial 1 x LPC 1 x SPI 2 x TX/RX TPM TPM 2.0 SMBus Yes Others 1 x I C GPIO 4-CH in & 4-CH out Smart Battery Yes Mechanical and Environmental Dimensions 95 x 95 mm Board Thickness 2.0 mm Operating Temperature -20°C to +60°C (-4°F to +140°F) Humidity 10% - 95% relative humidity, non-condensing *Memory speed was depend on memory rank. Packing List Quick installation guide

260 PIN DDR4 SODIMM

(eDP ver. 1.3 ) eDP to LVDS Edp x2 ( eDP ver. 1.3 ) JUMP JUMP JUMP JUMP JUMP CH7517 DP to VGA DDI1 x4 DP1.4 / HDMI 2.0 VGA ( 1920 X 1200 60Hz ) DDI3 x2 ( UPPER } DDI2 x4 DP1.4 / HDMI 2.0 PEG x 8 COM Express Connector Type 6 ver. 3.0 ROW C-D COM Express Connector Type 6 ver. 3.0 ROW A-B USB 3.1 x 3 SATA III x 2 HDA USB 2.0 x 5 SPI ROM SPI LPC IT8528 GPIO EC UART x 2 SMBUS PCIE x 4 USB 2.0 x 1 USB 2.0 x 1 USB 2.0 x 3 PCIe Bridge PCIE x 1 PCIE x 1 LAN MDI x 4 I210 USB HUB USB 2.0 x 1 DP0 DP1 DP2 DP3 GPP[0:3] GPP4 GPP5 PCIE X 1 PCIE X 1 PCIE X 1 PCIE X 1 PCIE X 1 PCIE X 1 PCIE X 1 PEGx8 GPP[6:7]/ SATA[0:1] USB2[0:4] USB2_5 USB3[1:2],4USB3[0:2] PEG[0:7] PCIE[0:3] PCIE4* PCIE6 GBE0PCIE7 PCIE4* PCIE5* TPM check Note3 check Note3 check Note3 DDI3 x2 ( LOWAER } check Note3