KBP301 YIXIN | Alldatasheet
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Features
Case: Reliable low cost construction utilizing molded plastic technique Terminals: Plated leads solderable per MIL-STD-202, Method 208 Mounting Position: Any Weight: 0.065 ounce, 2.2 grams (approx) The plastic material used carries Underwriters Laboratory flammability recognition 94V-0 Ideal for printed circuit board mounting High temperature soldering guaranteed 265 /10 seconds at 5 lbs (2.3kg) tension Built-in printed circuit board stand-offs High case dielectric strength A C / W +14.7 0.5 +11.2 0.5 +12.2 0.5 +3.83 0.25 12.7 MIN.15.2 MIN. +3.85 0.25 +0.81 0.05 +1.5 0.2 Notes: (1)Thermal resistance from Junction to Ambemt on P .C.board mounting. (2)Measured at 2.0MHz and applied reverse voltage of 4.0 volts. Dimensions in millimeters(1mm =0.0394 ") This series is UL listed under the Recognized Component Index, file number E142814 A ll data sheet.com
Rating and Characteristic Curves KBP301 thru KBP307 Fig. 1 Derating Curve for Output Rectified Current Fig. 2 Maximum Non-repetitive Peak Forward Surge Current Fig. 3 Typical Instantaneous Forward Characteristics Fig. 4 Typical Reverse Characteristics Fig. 5 Typical Junction Capacitance ( TA=25 Unless otherwise noted )C o Av erag e Forward Ou tpu t Cu rren t, Ampe res Peak Forward Surge Current, Amperes Instantaneous Forward Current, Amperes Instantaneous Reverse Current ,AmperesCapacitance, pF Number of Cycles at 60HZ Instantaneous Forward Voltage, Volts Percent of Rated Peak Reverse Voltage, % Reverse Voltage, Volts 1 10 100 .01 0.1 1.0 100 1 10 100 8.3ms Single half-sine-Wave [JEDEC Method] Tj=25 C Pulse Width=300us 2% duty cycle Tj=25 C f=1.0MHz 1.0 10050 150 1.5 0.5 2.0 .01 0.1 1.0 0 20 40 60 80 100 120 140 TA=25 C TA=100 C TA=125 C Lead Case Ambient Case T emperature, C o A ll data sheet.com