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TDK Electronics AG 2022. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without TDK Electronics’ prior express consent is prohibited. SMD Transformers E13 EMHV series Series/Type: B78308*A003 Ordering code: Date: May 2022
Please read Cautions and warnings and Important notes at the end of this document. SMD Transformers B78308*A003 E13 EMHV series Construction Ferrite core MnZn SMD gullwing pins Triple insulated wire class F (155 °C) Non-conductive pick-and-place cap on top
Features
Height: 11.6 mm max Footprint: 16.2 mm x 13.4 mm Plastic Bobbin CTI IIIa class material Wide temperature range from –40 °C up to +150 °C Qualified to AEC-Q200 RoHS compatible
Applications
Isolated DC/DC converters Insulation characteristics PRI / SEC (Cumulative): Creepage 11.2 mm, Clearance 8.14 mm Core / Top surface: Creepage and Clearance 3.25 mm PRI / core: Creepage 7.5 mm, Clearance 5.1 mm SEC / core: Creepage 3.7 mm, Clearance 3.05 mm Insulation distances sufficient for basic insulation according to IEC 60664-1, 61558-2-16 for working voltage 1000 V DC, Transient over voltage 2500 VPeak, P2, CTI IIIa, 5000 m altitude. Insulation distances sufficient for reinforced insulation according to IEC 60664-1, 61558-2-16 for working voltage 300 V, P2, OVC II, CTI IIIa, 2000 m altitude. Marking Product brand, middle block of ordering code, date code, pin 1 marker, production place identification code Delivery mode Tape and reel 13” diameter Packing unit: 190 pcs per reel
Please read Cautions and warnings and Important notes at the end of this document. SMD Transformers B78308*A003 E13 EMHV series Dimensional drawing and recommendation Dimensions in mm Recommended PCB layout (Top View)
Please read Cautions and warnings and Important notes at the end of this document. SMD Transformers B78308*A003 E13 EMHV series Flyback Topology applicable Transformer Product parameters Characteristics and ordering code: specified at +25 °C if not mentioned otherwise, all values without tolerances are typical values. Units Ordering codes B78308A2461A003 B78308A2462A003 Reference Schematic F1 F2 Turns ratio 1 : 0.22 : 0.78 1 : 0.33 : 0.67 Typical operational frequency kHz 100 ... 400 kHz at 100 kHz, 10 mV LL, N1 (1-4) nH 330 300 at 100 kHz, 10 mV short 5, 6, 8 short 5, 6, 8 RDC, N1 m 100 100 RDC, N2 m 50 75 RDC, N3 m 150 130 Saturation Current ISAT, N1 A 4 4 at T +150 °C, L=Lo-20% Typical diagram for LN1 G1 saturation High Voltage Test V AC 3000 Routine test: 50 Hz, 1 sec (N1) / (N2,N3) High Voltage Test V AC 3750 Type test: 50 Hz, 1 min (N1) / (N2,N3) Partial discharge inception V PEAK 1500 voltage, Type test (N1) / (N2,N3) Partial discharge extinction V PEAK 1200 voltage, Type test (N1) / (N2,N3) Surge voltage Test 6 kV peak; 1.2/50 µs, Type test (N1) / (N2,N3) Recommonded IC L9502 – STMicroelectronics
Please read Cautions and warnings and Important notes at the end of this document. SMD Transformers B78308*A003 E13 EMHV series Schematics and saturation graph B78308A2461A003 and B78308A2462A003 - Saturation at different temperatures (typical curves) F1 F2
Please read Cautions and warnings and Important notes at the end of this document. SMD Transformers B78308*A003 E13 EMHV series Push Pull / Half Bridge topology applicable Transformer Product parameters Characteristics and ordering codes: specified at +25 °C if not mentioned otherwise, all values without tolerance are typical values. Units Ordering codes B78308A2387A003 B78308A2484A003 B78308A2485A003 Reference Schematic F3 F3 F4 Turns ratio 1 : 1.07 1 : 1.07 1 : 1 : 0.57 : 2.14 Typical operational kHz 100 ... 400 kHz frequency LN1 (min) µH 100 90 90 at 100 kHz, 100 mV short (2, 3) LL, N1 µH 0.8 2.6 1.1 at 100 kHz, 100 mV short 8-5 short 8-5 short (2, 3) & 5, 6, 7, 8 CP pF 9 2 6 at 20 kHz, 1 V (N1 / N2) (N1 / N2) (N1,N2) / (N3,N4) RDC, N1 m 260 260 175 RDC, N2 m 350 350 175 RDC, N3 m – – 85 RDC, N4 m – – 280 Voltage Time Product V x µVs 15 15 25 Unipolar, Bmax = 220 mT Voltage Time Product V x µVs 30 30 50 Unipolar, Bmax = 440 mT High Voltage test V AC 3000 3000 3000 Routine test: 50 Hz, 1 sec (N1 / N2) (N1 / N2) (N1,N2) / (N3,N4) High Voltage Test V AC 3750 3750 Type test: 50 Hz, 1 min (N1 / N2) (N1,N2) / (N3,N4) Partial discharge incep- VPEAK 1500 1500 voltage, type test (N1 / N2) (N1,N2) / (N3,N4) Partial discharge extinc- VPEAK 1200 1200 voltage, type test (N1 / N2) (N1,N2) / (N3,N4)
Please read Cautions and warnings and Important notes at the end of this document. SMD Transformers B78308*A003 E13 EMHV series Other characteristics Referenced Schematics Storage conditions –25 °C ... +40 °C, humidity 75% RH Climatic category 40/150/56 (to IEC 60068) Resistance to reflow In accordance with JEDEC J-STD-020D Tpeak = +245 °C soldering heat (Tpeak –5 °C for 30 seconds) Operating temperature range –40 °C ... +150 °C (component) Weight Approx. 2.5 g
Please read Cautions and warnings and Important notes at the end of this document. SMD Transformers B78308*A003 E13 EMHV series Blister tape Reel
Please read Cautions and warnings and Important notes at the end of this document. SMD Transformers B78308*A003 E13 EMHV series Recommended reflow soldering curve Pb-free solder material (based on JEDEC J-STD 020E) Time from +24 °C to T4: max. 480 s Maximal numbers of reflow cycles: 3 T1 T2 T3 T4 t1 t2 t3 °C °C °C °C s s s 150 200 217 245 60 – 120 60 – 150 < 30 at T 4 –5 °C
Please read Cautions and warnings and Important notes at the end of this document. SMD Transformers B78308*A003 E13 EMHV series Cautions and warnings Please note the recommendations in our Inductors data book (latest edition) and in the data sheets. – Particular attention should be paid to the derating curves given there. – The soldering conditions should also be observed. Temperatures quoted in relation to wave soldering refer to the pin, not the housing. If the components are to be washed varnished it is necessary to check whether the washing varnish agent that is used has a negative effect on the wire insulation, any plastics that are used, or on glued joints. In particular, it is possible for washing varnish agent residues to have a negative effect in the long-term on wire insulation. Washing processes may damage the product due to the possible static or cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts, which might lead to reduced reliability or lifetime. The following points must be observed if the components are potted in customer applications: – Many potting materials shrink as they harden. They therefore exert a pressure on the plastic housing or core. This pressure can have a deleterious effect on electrical properties, and in extreme cases can damage the core or plastic housing mechanically. – It is necessary to check whether the potting material used attacks or destroys the wire, wire insulation, plastics or glue. – The effect of the potting material can change the high-frequency behaviour of the components. – Many coating materials have a negative effect (chemically and mechanically) on the winding wires, insulation materials and connecting points. Customers are always obligated to determine whether and to what extent their coating materials influence the component. Customers are responsible and bear all risk for the use of the coating material. TDK Electronics does not assume any liability for failures of our components that are caused by the coating material. Ceramics / ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to breakage of the core. Even for customer-specific products, conclusive validation of the component in the circuit can only be carried out by the customer. Display of ordering codes for TDK Electronics products The ordering code for one and the same product can be represented differently in data sheets, data books, other publications, on the company website, or in order-related documents such as shipping notes, order confirmations and product labels. The varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective products. Detailed information can be found on the Internet under www.tdk-electronics.tdk.com/orderingcodes.
The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application . These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, we are either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether a product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous) . Useful information on this will be found in our Material Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time . The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and Conditions of Supply.
- Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF certifications confirm our compliance with requirements regarding the quality management system in the automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only requirements mutually agreed upon can and will be implemented in our Quality Management System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become legally binding if individually agreed upon. 8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap, XieldCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks. Release 2020-06