DZQA6V8AXV5-7 DIODES | Alldatasheet

Document overview

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Technical content

Features

  • Quad TVS in Common Anode Configuration
  • Ultra-Small Surface Mount Package
  • Ideal For Transient Suppression and ESD Protection
  • Lead Free By Design/RoHS Compliant (Note 1)
  • "Green Device" (Note 2)
  • Qualified to AEC-Q101 Standards for High Reliability ESD Capability
  • IEC 61000-4-2 Contact Method ±8kV
  • IEC 61000-4-2 Air Discharge Method ±15kV Mechanical Data
  • Case: SOT553
  • Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0
  • Moisture Sensitivity: Level 1 per J-STD-020
  • Terminal Finish: Matte Tin, Annealed Over Copper Leadframe. Solderable per MIL-STD-202, Method 208
  • Weight: 0.002 grams (approximate) Ordering Information (Note 3) Part Number Case Packaging DZQA6V8AXV5-7 SOT553 3000/Tape & Reel Notes: 1. No purposefully added lead. 3. For packaging details, go to our website at http://www.diodes.com. Marking Information Date Code Key Year 2009 2010 2011 2012 2013 2014 2015 Code W X Y Z A B C Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Code 1 2 3 4 5 6 7 8 9 O N D Device Schematic C4C3 C2 C1 A1/A2 A3/A4 D4D3 D1D2 TOP VIEW 321 T62 = Product type marking code YM = Date code marking Y = Year (Ex: W = 2009) M = Month (ex: 9 = September) YM YMT62

Document number: DS31271 Rev. 6 - 2 2 of 4 www.diodes.com February 2011 © Diodes Incorporated DZQA6V8AXV5 Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Symbol Value Unit Forward Voltage @ IF = 10mA VF 0.9 V Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Notes 4 & 5) PD 380 mW Peak Power Dissipation, 8x20μS Waveform (Note 6) Ppk 20 W Thermal Resistance, Junction-to-Ambient (Note 4) RθJA 327 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics @TA = 25°C unless otherwise specified Type Number Marking Code Breakdown Voltage (Note 7) Leakage Current (Note 7) Clamping Voltage (Note 6) Capacitance @0V Bias(pF) (Note 8) Capacitance @3V Bias(pF) (Note 8) VBR @ IT = 1mA IRM @ VRM V C Max @ IPP C T C T Min (V) Nom (V) Max (V) Max(μA) (V) VC(V) I PP(A) Typ Max Typ Max Notes: 4. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0. 062 inch; pad layout as shown on Diodes Inc. Suggested Pad Layout Document AP02001, which can be found on our website at http://www.diodes.com. 5. Only 1 diode under power. For all 4 diodes under power, P D will be 25% of the listed value. 6. Non-repetitive current pulse per Figure 3 and derate above T A = 25°C per Figure 1. 7. Short duration pulse test used to minimize self-heating effect. 8. Per element, f = 1MHz, TA = 25°C 0 25 50 75 100 125 150 175 200 100 T , AMBIENT TEMPERATURE (°C) Fig. 1 Pulse Derating Curve A PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT t, TIME ( s) Fig. 2 Pulse Waveform μ 20 40 60 100 I , PEAK PULSE CURRENT (%I )Pp pP

Document number: DS31271 Rev. 6 - 2 3 of 4 www.diodes.com February 2011 © Diodes Incorporated DZQA6V8AXV5 0.0001 0.001 0.01 0.1 V , INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 3 Typical Forward Characteristics F I, I NSTANTANEOUS FORWARD CURRENT (mA)F f = 1.0MHz V , REVERSE VOLTAGE (V) Fig. Typical Total Capacitance vs. Reverse Voltage (Per Element) R C, TOTAL CAPACITANCE (pF)T Package Outline Dimensions Suggested Pad Layout SOT553 Dim Min Max Typ A 0.55 0.60 0.60 c 0.10 0.18 0.15 D 1.50 1.70 1.60 E 1.55 1.70 1.60 E1 1.10 1.25 1.20 L 0.10 0.30 0.20 b 0.15 0.30 0.20 e 0.50 Typ e1 1.00 Typ a 6° 8° 7° All Dimensions in mm Dimensions Value (in mm) Z 2.2 G 1.2 X 0.375 Y 0.5 C1 1.7 C2 0.5 c L A D EE1 b (5 places) e a X Z Y C2C2 G

Document number: DS31271 Rev. 6 - 2 4 of 4 www.diodes.com February 2011 © Diodes Incorporated DZQA6V8AXV5 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries rese rve the right to make modifications, enhanc ements, improvements, corrections or ot her changes without further notice to this document and any product descri bed herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or an y product described herein; neither does Di odes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or us er of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthoriz ed sales channel. Should Customers purchase or use Diodes Inco rporated products for any unintended or una uthorized application, Customers shall i ndemnify and hold Diodes Incorporated and its representativ es harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical component s in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support dev ice or system whose failure to perform can be reasonably expect ed to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifi cations of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or s ystems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporate d and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2011, Diodes Incorporated www.diodes.com