DTC646

DTC646 MICROCHIP | Alldatasheet

Document overview

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Technical content

Features

• Temperature Proportional Fan Speed for Acoustic Control and Longer Fan Life
• Efficient PWM Fan Drive
• 3.0V to 5.5V Supply Range: - Fan Voltage Independent of TC646 Supply Voltage - Supports any Fan Voltage
• FanSense™ Fault Detection Circuits Protect Against Fan Failure and Aid System Testing
• Shutdown Mode for "Green" Systems
• Supports Low Cost NTC/PTC Thermistors
• Space Saving 8-Pin MSOP Package
• Over-temperature Indication

Applications

• Power Supplies
• Computers
• F i l e S e r v e r s
• Portable Computers
• Telecom Equipment
• UPS, Power Amps
• General Purpose Fan Speed Control Available Tools
• Fan Controller Demonstration Board (TC642DEMO)
• Fan Controller Evaluation Kit (TC642EV) Package Types General Description The TC646 is a switch mode, fan speed controller for use with brushless DC fans. Temperature proportional speed control is accomplished using pulse width mod- ulation (PWM). A thermistor (or other voltage output temperature sensor) connected to the V IN input fur- nishes the required control voltage of 1.25V to 2.65V (typical) for 0% to 100% PWM duty cycle. The TC646 automatically suspends fan operation when measured temperature (V IN) is below a user programmed minimum setting (V AS). An integrated Start-up Timer ensures reliable motor start-up at turn-on, coming out of shutdown mode, auto-shutdown mode or following a transient fault. The TC646 features Microchip Technology's proprie- tary FanSense™ technology for increasing system reli- ability. In normal fan operation, a pulse train is present at SENSE (Pin 5). A missing-pulse detector monitors this pin during fan operation. A stalled, open, or uncon- nected fan causes the TC646 to trigger its Start-up Timer once. If the fault persists, the FAULT output goes low and the device is latched in its shutdown mode. FAULT is also asserted if the PWM reaches 100% duty cycle, indicating a possible thermal runaway situation, although the fan continues to run. See Section 5.0, “Typical Applications”, for more information and system design guidelines. The TC646 is available in the 8-pin plastic DIP, SOIC and MSOP packages and is available in the industrial and extended commercial temperature ranges. TC646 GND CF VIN VAS FAULT SENSE VDD VOUT SOIC/PDIP/MSOP PWM Fan Speed Controller with Auto-Shutdown and FanSense™ Technology

DS21446D-page 2  2002-2012 Microchip Technology Inc. Functional Block Diagram FAULT SHDN SENSE PWM OTF GND 70mV (typ.) 10kΩ VAS VSHDN VIN CF VDD VOUT TC646 Control Logic –VOTF 3 x TPWM Timer Start-up Timer Clock Generator Missing Pulse Detect.

 2002-2012 Microchip Technology Inc. DS21446D-page 3 TC646

1.0 ELECTRICAL

Absolute Maximum Ratings* Package Thermal Resistance: *Stresses above those listed under "Absolute Maximum Rat- ings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specif ications is not implied. Expo- sure to absolute maximum rating conditions for extended peri- ods may affect device reliability. DC ELECTRICAL SPECIFICATIONS Electrical Characteristics: Unless otherwise specified, TMIN  TA  TMAX, VDD = 3.0V to 5.5V Symbol Parameter Min Typ Max Units Test Conditions VDD Supply Voltage 3.0 — 5.5 V IDD Supply Current, Operating — 0.5 1.0 mA Pins 6, 7 Open, CF = 1 µF, VIN = VC(MAX) IDD(SHDN) Supply Current, Shutdown/ Auto-shutdown Mode — 25 — µA Pins 6, 7 Open; Note 1 C F =1 µF, VIN = 0.35V IIN VIN, VAS Input Leakage -1.0 — +1.0 µA Note 1 VOUT Output tR VOUT Rise Time — — 50 µsec I OH = 5 mA, Note 1 tF VOUT Fall Time — — 50 µsec I OL = 1 mA, Note 1 tSHDN Pulse Width(On VIN) to Clear Fault Mode 30 — — µsec V SHDN, VHYST Specifications, Note 1 IOL Sink Current at VOUT Output 1.0 — — mA V OL = 10% of VDD IOH Source Current at VOUT Output 5.0 — — mA V OH = 80% of VDD SENSE Input VTH(SENSE) SENSE Input Threshold Voltage with Respect to GND 50 70 90 mV Note 1 FAULT Output VOL Output Low Voltage — — 0.3 V I OL = 2.5 mA tMP Missing Pulse Detector Timer — 32/F — Sec C F = 1.0 µF tSTARTUP Start-up Timer — 32/F — Sec C F = 1.0 µF tDIAG Diagnostic Timer — 3/F — Sec C F = 1.0 µF Note 1: Ensured by design, not tested.

DS21446D-page 4  2002-2012 Microchip Technology Inc. VIN, VAS Inputs VC(MAX),VOTF Voltage at VIN for 100% Duty Cycle and Overtemp. Fault 2.5 2.65 2.8 V VC(SPAN) VC(MAX) - VC(MIN) 1.3 1.4 1.5 V VAS Auto-shutdown Threshold V C(MAX) ~ VC(SPAN) — V C(MAX) V VSHDN Voltage Applied to VIN to ensure Reset/Shutdown —— V DD x 0.13 V VREL Voltage Applied to VIN to Release Reset Mode VDD x 0.19 — — V V DD = 5V, See Figure 5-11 VHYST Hysteresis on VSHDN, VREL — 0.01 x V DD —V VHAS Hysteresis on Auto-shutdown Comparator —7 0 — m V Pulse Width Modulator FOSC PWM Frequency 26 30 34 Hz C F = 1.0 µF DC ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: Unless otherwise specified, TMIN  TA  TMAX, VDD = 3.0V to 5.5V Symbol Parameter Min Typ Max Units Test Conditions Note 1: Ensured by design, not tested.

 2002-2012 Microchip Technology Inc. DS21446D-page 5 TC646

2.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE

2.1 Analog Input (V IN)

The thermistor network (or other temperature sensor) connects to the VIN input. A voltage range of 1.25V to 2.65V (typical) on this pin drives an active duty cycle of 0% to 100% on the VOUT pin. The TC646 enters shut- down mode when VIN VSHDN. During shutdown, the FAULT output is inactive, and supply current falls to 25 µA (typical). The TC646 exits shutdown mode when V IN VREL (see Section 5.0, “Typical Applications”, for details).

2.2 Analog Output (C F)

CF is the positive terminal for the PWM ramp generator timing capacitor. The recommended C F is 1 µF for 30 Hz PWM operation.

2.3 Analog Input (V AS)

An external resistor divider connected to the VAS input sets the auto-shutdown threshold. Auto-shutdown occurs when V IN V AS. The fan is automatically restarted when V IN (VAS + V HAS) (see Section 5.0 , “Typical Applications”, for more details).

2.4 Ground (GND)

GND denotes the ground terminal.

2.5 Analog Input (SENSE)

Pulses are detected at the SENSE pin as fan rotation chops the current through a sense resistor (R SENSE). The absence of pulses indicates a fault (see Section 5.0, “Typical Applications”, for more details).

2.6 Digital Output (FAULT )

The FAULT line goes low to indicate a fault condition. When FAULT goes low due to a fan fault condition, the device is latched in shutdown mode until deliberately cleared or until power is cycled. FAULT w i l l a l s o b e asserted when the PWM reaches 100% duty cycle, indicating that maximum cooling capability has been reached and a possible over-temperature condition may occur. This is a non-latching state and the FAULT output will go high when the PWM duty cycle goes below 100%.

2.7 Digital Output (V OUT)

VOUT is an active high complimentary output that drives the base of an external NPN transistor (via an appropri- ate base resistor) or the gate of an N-channel MOS- FET. This output has asymmetrical drive (see Section 1.0, “Electrical Characteristics”).

2.8 Power Supply Input (V DD)

VDD may be independent of the fan’s power supply (see Section 1.0, “Electrical Characteristics”). Pin No. Symbol Description 1V IN Analog Input 2C F Analog Output 3V AS Analog Input

4 GND Ground Terminal

5 SENSE Analog Input

Digital (Open Collector) Output 7V OUT Digital Output 8V DD Power Supply Input

DS21446D-page 6  2002-2012 Microchip Technology Inc.

3.0 DETAILED DESCRIPTION

3.1 PWM

The PWM circuit consists of a ramp generator and threshold detector. The frequency of the PWM is determined by the value of the capacitor connected to the C F input. A frequency of 30 Hz is recommended (CF = 1 µF). The PWM is also the time base for the Start-up Timer (see Section 3.3, “Start-Up Timer”). The PWM voltage control range is 1.25V to 2.65V (typical) for 0% to 100% output duty cycle.

3.2 V OUT Output

The VOUT pin is designed to drive a low cost transistor or MOSFET as the low side, power switching element in the system. Various examples of driver circuits will be shown throughout this data sheet. This output has asymmetric complementary drive and is optimized for driving NPN transistors or N-channel MOSFETs. Since the system relies on PWM rather than linear control, the power dissipation in the power switch is kept to a minimum. Generally, very small devices (TO-92 or SOT packages) will suffice.

3.3 Start-Up Timer

To ensure reliable fan start-up, the Start-up Timer turns the VOUT output on for 32 cycles of the PWM whenever the fan is started from the off state. This occurs at power-up and when coming out of shutdown or auto- shutdown mode. If the PWM frequency is 30 Hz F = 1 µF), the resulting start-up time will be approxi- mately one second. If a fan fault is detected, the Diag- nostic Timer is triggered once, followed by the Start-up Timer. If the fault persists, the device is shut down (see Section 3.5, “F AULT Output”).

3.4 SENSE Input

(FanSense™ Technology) The SENSE input (Pin 5) is connected to a low value current sensing resistor in the ground return leg of the fan circuit. During normal fan operation, commutation occurs as each pole of the fan is energized. This causes brief interruptions in the fan current, seen as pulses across the sense resistor. If the device is not in auto-shutdown or shutdown mode, and pulses are not appearing at the SENSE input, a fault exists. The short, rapid change in fan current (high dI/dt) causes a corresponding dV/dt across the sense resistor, R SENSE. The waveform on R SENSE is differentiated and converted to a logic-level pulse-train by CSENSE and the internal signal processing circuitry. The presence and frequency of this pulse-train is a direct indication of fan operation. See Section 5.0, “Typical Applications”, for more details.

3.5 FAULT Output

The TC646 detects faults in two ways: First, pulses appearing at SENSE due to the PWM turning on are blanked, with the remaining pulses being filtered by a missing pulse detector. If consecutive pulses are not detected for thirty-two PWM cycles (1S e c i f C F = 1 µF), the Diagnostic Timer is activated and VOUT is driven high continuously for three PWM cycles ( 100 msec if C F = 1 µF). If a pulse is not detected within this window, the Start-up Timer is trig- gered (see Section 3.3, “Start-up Timer”). This should clear a transient fault condition. If the missing pulse detector times out again, the PWM is stopped and FAULT goes low. When FAULT is activated due to this condition, the device is latched in shutdown mode and will remain off indefinitely. Therefore, the TC646 is pre- vented from attempting to drive a fan under cata- strophic fault conditions. One of two things will restore operation: Cycling power off and then on again or pulling V IN below VSHDN and releasing it to a level above V REL. When one of these two conditions is satisfied, the normal start-up cycle is triggered and operation will resume if the fault has been cleared. The second condition by which the TC646 asserts a FAULT is when the PWM control voltage applied to VIN becomes greater than that needed to drive 100% duty cycle (see Section 1.0 , “Electrical Characteristics”). This indicates that the fan is at maximum drive and the potential exists for system overheating. Either heat dis- sipation in the system has gone beyond the cooling system’s design limits or some subtle fault exists (such as fan bearing failure or an airflow obstruction). This output may be treated as a “System Overheat” warning and be used to trigger system shutdown or some other corrective action. However, in this case, the fan will continue to run even when FAULT is asserted. If the system is allowed to continue operation, and the temperature (and thus VIN) falls, the FAULT output will become inactive when V IN < VOTF.

3.6 Auto-Shutdown Mode

If the voltage on VIN becomes less than the voltage on VAS, the fan is automatically shut off (auto-shutdown mode). The TC646 exits auto-shutdown mode when the voltage on V IN becomes higher than the voltage on VAS by V HAS (the auto-shutdown Hysteresis Voltage (see Figure 3-1)). The Start-up Timer is triggered and normal operation is resumed upon exiting auto-shut- down mode. The FAULT output is unconditionally inactive in auto-shutdown mode.

 2002-2012 Microchip Technology Inc. DS21446D-page 7 TC646 FIGURE 3-1: TC646 Nominal Operation.

3.7 Shutdown Mode (Reset)

If an unconditional shutdown and/or device reset is desired, the TC646 may be placed in shutdown mode by forcing V IN to a logic low (i.e., V IN < V SHDN) (see Figure 3-1). In this mode, all functions cease and the FAULT output is unconditionally inactive. The TC646 should not be shut down unless all heat producing activity in the system is at a negligible level. The TC646 exits shutdown mode when V IN becomes greater than VREL, the release voltage. Entering shutdown mode also performs a complete device reset. Shutdown mode resets the TC646 into its power-up state. The Start-up and Fault Timers, and any current faults, are cleared. FAULT is unconditionally inactive in shutdown mode. Upon exiting shutdown mode (V IN > VREL), the Start-up Timer will be triggered and normal operation will resume, assuming no fault conditions exist and VIN > VAS + VHAS If a fan fault has occurred and the device has latched itself into shutdown mode, performing a reset will not clear the fault unless V IN > (VAS + VHAS). If VIN is not greater than (V AS + V HAS) upon exiting shutdown mode, the fan will not be restarted. Consequently, there is no way to establish that the fan fault has been cleared. To ensure that a complete reset takes place, the user’s circuitry must ensure that V IN > (VAS + VHAS) when the device is released from shutdown mode. A recommended algorithm for management of the TC646 by a host microcontroller or other external circuitry is given in Section 5.0, “Typical Applications”. A small amount of hysteresis, typically one percent of V DD (50 mV at V DD = 5.0V), is designed into the V SHDN/ VREL threshold. The levels specified for V SHDN and VREL in Section 1.0, “Electrical Characteristics”, include this hysteresis plus adequate margin to account for normal variations in the absolute value of the threshold and hysteresis. 2.6V VAS + VHAS VIN tRESET VREL VSHDN VAS 1.2V TC646 Status Normal Operation Auto-Shutdown Mode Normal Operation Shut- Down Normal Operation GND Time TEMP. HI LO Note: If V IN < V AS when the device exits shutdown mode, the fan will not restart as it will be in auto-shut- down mode. CAUTION: Shutdown mode is unconditional. That is, the fan will remain off as long as the VIN pin is being held low or VIN < VAS + VHAS.

DS21446D-page 8  2002-2012 Microchip Technology Inc.

4.0 SYSTEM BEHAVIOR

The flowcharts describing the TC646’s behavioral algorithm are shown in Figure 4-1. They can be summarized as follows:

4.1 Power-Up

(1) Assuming the device is not being held in auto-shut- (2) Turn V OUT output on for 32 cycles of the PWM clock. This ensures that the fan will start from a dead stop. (3) During this Start-up Timer, if a fan pulse is detected, branch to Normal Operation; if none are received… (4) Activate the 32-cycle Start-up Timer one more time and look for fan pulse; if a fan pulse is detected, proceed to Normal Operation; if none are received… (5) Proceed to Fan Fault. (6) End.

4.2 Normal Operation

“Normal Operation” is an endless loop which may only be exited by entering shutdown mode, auto-shutdown mode or Fan Fault. The loop can be thought of as executing at the frequency of the oscillator and PWM. (1) Reset the missing pulse detector. (2) Is the TC646 in shutdown or auto-shutdown mode? If so... a. V OUT duty cycle goes to zero. b. FAULT is disabled. c. Exit the loop and wait for VIN > (VAS + VHAS) to resume operation. (3) If an over-temperature fault occurs (VIN > VOTF), activate FAULT; release FAULT when VIN< VOTF. (4) Drive V OUT to a duty cycle proportional to VIN on a cycle by cycle basis. (5) If a fan pulse is detected, branch back to the start of the loop (1). (6) If the missing pulse detector times out … (7) Activate the 3-cycle Diagnostic Timer and look for pulses; if a fan pulse is detected, branch back to the start of the loop (1); if none are received… (8) Activate the 32-cycle Start-up Timer and look for pulses; if a fan pulse is detected, branch back to the start of the loop (1); if none are received… (9) Quit Normal Operation and go to Fan Fault. (10) End.

4.3 Fan Fault

Fan fault is an infinite loop wherein the TC646 is latched in shutdown mode. This mode can only be released by a reset (i.e., V IN being brought below VSHDN, then above (VAS + VHAS), or by power-cycling). (1) While in this state, FAULT is latched on (low) and the VOUT output is disabled. (2) A reset sequence applied to the VIN pin will exit the loop to Power-up. (3) End.

 2002-2012 Microchip Technology Inc. DS21446D-page 9 TC646 FIGURE 4-1: TC646 Behavioral Algorithm Flowchart. Auto-Shutdown FAULT = 1 VOUT = 0 Cycling Power Yes Yes No No No No Yes Power-Up VIN > VREL ? Fan Pulse Detected? VIN < VSHDN? VIN < VAS? Shutdown VOUT = 0 Auto- Shutdown VOUT = 0 Yes No No No Yes Yes Power-Up Normal Operation YES Power-on Reset FAULT = 1 VIN > VREL? No VIN > (VAS + VHAS) Yes Yes No Hot Start Fire Start-up Timer (1 SEC) Fan Pulse Detected? No Yes Fan Fault Fire Start-up Timer (1 SEC) VIN > VREL Yes FAULT = 0, VOUT = 0 VIN < VSHDN ? Yes Fan Fault Clear Missing Pulse Detector VOUT Proportional to VIN VIN < VSHDN? VIN < VAS? VIN > VOTF? M.P.D. Expired? Fan Pulse Detected? Shutdown VOUT = 0 Auto Shutdown VOUT = 0 No No No No No No Yes YesYes Yes Normal Operation Power-Up VIN > (VAS + VHAS) No Yes Hot Start Yes No FAULT = 0 Yes Fire Diagnostic Timer (100msec) Fan Pulse Detected? Fire Start-up Timer (1 sec) Fan Fault Fan Pulse Detected? Yes No VIN > (VAS + VHAS)?

DS21446D-page 10  2002-2012 Microchip Technology Inc.

5.0 TYPICAL APPLICATIONS

Designing with the TC646 involves the following: (1) The temperature sensor network must be configured to deliver 1.25V to 2.65V on VIN for 0% to 100% of the temperature range to be regulated. (2) The auto-shutdown temperature must be set with a voltage divider on VAS. (3) The output drive transistor and associated circuitry must be selected. (4) The SENSE network, R SENSE and C SENSE, must be designed for maximum efficiency while delivering adequate signal amplitude. (5) If shutdown capability is desired, the drive require- ments of the external signal or circuit must be considered. The TC642 demonstration and prototyping board (TC642DEMO) and the TC642 Evaluation Kit (TC642EV) provide working examples of TC646 cir- cuits and prototyping aids. The TC642DEMO is a printed circuit board optimized for small size and ease of inclusion into system prototypes. The TC642EV is a larger board intended for benchtop development and analysis. At the very least, anyone contemplating a design using the TC646 should consult the documenta- tion for both TC642EV (DS21403) and TC642DEMO (DS21401). Figure 5-1 shows the base schematic for the TC642DEMO. FIGURE 5-1: Typical Application Circuit. FAULT SENSE NTCR1 GND *See cautions regarding latch-up considerations in Section 5.0, "Typical Applications". Optional. See Section 5.0, "Typical Applications", for details. NOTES: Thermal Shutdown Shutdown +12V +5V* VDDVIN VAS VOUT RBASE RSENSE CSENSE CF 1μF CF TC646 Fan CB 0.01μF CB 0.01μF CB 1μF +5V

 2002-2012 Microchip Technology Inc. DS21446D-page 11 TC646

5.1 Temperature Sensor Design

The temperature signal connected to VIN must output a voltage in the range of 1.25V to 2.65V (typical) for 0% to 100% of the temperature range of interest. The circuit in Figure 5-2 illustrates a convenient way to provide this signal. FIGURE 5-2: Temperature Sensing Circuit. Figure 5-2 shows a simple temperature dependent voltage divider circuit. RT 1 is a conventional NTC thermistor, while R1 and R2 are standard resistors. The supply voltage, VDD, is divided between R2 and the par- allel combination of RT1 and R1. For convenience, the parallel combination of RT1 and R1 will be referred to as RTEMP. The resistance of the thermistor at various tem- peratures is obtained from the manufacturer’s specifi- cations. Thermistors are often referred to in terms of their resistance at 25°C. Generally, the thermistor shown in Figure 5-2 is a non- linear device with a negative temperature coefficient (also called an NTC thermistor). In Figure 5-2, R 1 is used to linearize the thermistor temperature response and R 2 is used to produce a positive temperature coefficient at the V IN node. As an added benefit, this configuration produces an output voltage delta of 1.4V, which is well within the range of the V C(SPAN) specification of the TC646. A 100 kNTC thermistor is selected for this application in order to keep I DIV at a minimum. For the voltage range at V IN to be equal to 1.25V to 2.65V, the temperature range of this configuration is 0°C to 50°C. If a different temperature range is required from this circuit, R 1 should be chosen to equal the resistance value of the thermistor at the center of this new temperature range. It is suggested that a maxi- mum temperature range of 50°C be used with this cir- cuit due to thermistor linearity limitations. With this change, R 2 is adjusted according to the following equations: EQUATION These two equations facilitate solving for the two unknown variables, R1 and R2. More information about thermistors may be obtained from AN679, “Tempera- ture Sensing Technologies”, and AN685, “Thermistors In Single Supply Temperature Sensing Circuits”, which can be downloaded from Microchip’s web site at www.microchip.com.

5.2 Auto-Shutdown Temperature

A voltage divider on V AS sets the temperature where the part is automatically shut down if the sensed temperature at VIN drops below the set temperature at VAS (i.e., V IN < V AS). As with the V IN input, 1.25V to 2.65V corresponds to the temperature range of interest from T 1 to T 2, respectively. Assuming that the temperature sensor network designed above is linearly related to temperature, the shutdown temperature T AS is related to T2 and T1 by: EQUATION For example, if 1.25V and 2.65V at VIN corresponds to a temperature range of T1 = 0°C to T2 = 125°C, and the auto-shutdown temperature desired is 25°C, then V AS voltage is: EQUATION The VAS voltage may be set using a simple resistor divider as shown in Figure 5-3. R2 = 23.2kΩ R1 = 100 kΩ NTC Thermistor 100 kΩ@25˚C IDIV VIN VDD RT1 VDD x R2 RTEMP (T1) + R2 = V(T1) RTEMP (T2) + R2 = V(T2) VDD x R2 Where T1 and T 2 are the chosen temperatures and RTEMP is the parallel combination of the thermistor and R1. 2.65V - 1.25V T2 - T1 VAS - 1.25V TAS - T1 VAS = ( ( TAS - T1) + 1.25V 1.4V ) T2 - T1 1.4V (125 - 0)

DS21446D-page 12  2002-2012 Microchip Technology Inc. FIGURE 5-3: VAS CIRCUIT Per Section 1.0, “Electrical Characteristics”, the leak- age current at the V AS pin is no more than 1 µA. It is conservative to design for a divider current, I DIV, of 100 µA. If VDD = 5.0V then… EQUATION We can further specify R1 and R2 by the condition that the divider voltage is equal to our desired VAS. This yields: EQUATION Solving for the relationship between R1 and R2 results in: EQUATION In the case of this example, R1 = (2.27) R2. Substituting this relationship back into the original equation yields the resistor values: R 2 = 15.3 k, and R1 = 34.7 k In this case, the standard values of 34.8 k and 15.4 k are very close to the calculated values and would be more than adequate.

5.3 Operations at Low Duty Cycle

One boundary condition which may impact the selec- tion of the minimum fan speed is the irregular activation of the Diagnostic Timer due to the TC646 “missing” fan commutation pulses at low speeds. This is a natural consequence of low PWM duty cycles (typically 25% or less). Recall that the SENSE function detects commu- tation of the fan as disturbances in the current through R SENSE. These can only occur when the fan is ener- gized (i.e., V OUT is “on”). At very low duty cycles, the VOUT output is “off” most of the time. The fan may be rotating normally, but the commutation events are occurring during the PWM’s off-time. The phase relationship between the fan’s commutation and the PWM edges tends to “walk around” as the system operates. At certain points, the TC646 may fail to capture a pulse within the 32-cycle missing pulse detector window. If this happens, the 3-cycle Diagnostic Timer will be activated, the V OUT output will be active continuously for three cycles and, if the fan is operating normally, a pulse will be detected. If all is well, the system will return to normal operation. There is no harm in this behavior, but it may be audible to the user as the fan accelerates briefly when the Diagnostic Timer fires. For this reason, it is recommended that V AS be set no lower than 1.8V.

5.4 FanSense ™ Network

(RSENSE and CSENSE) The FanSense network, comprised of R SENSE and CSENSE, allows the TC646 to detect commutation of the fan motor (FanSense ™ technology). This network can be thought of as a differentiator and threshold detector. The function of R SENSE is to convert the fan current into a voltage. CSENSE serves to AC-couple this voltage signal and provide a ground-referenced input to the SENSE pin. Designing a proper SENSE network is simply a matter of scaling R SENSE to provide the necessary amount of gain (i.e., the current-to-voltage conversion ratio). A 0.1 µF ceramic capacitor is recommended for C SENSE. Smaller values require larger sense resistors, and higher value capacitors are bulkier and more expensive. Using a 0.1 µF capacitor results in reasonable values for R SENSE. Figure 5-4 illustrates a typical SENSE network. Figure 5-5 shows the waveforms observed using a typical SENSE net- work. GND VDD VASIDIV IIN R1 + R2 IDIV = 1e–4A = , therefore 5.0V 1e–4A 5.0V VAS = VDD x R2 R1 + R2 R1 = R2 x = R2 x VDD - VAS VAS 5 - 1.53 1.53

 2002-2012 Microchip Technology Inc. DS21446D-page 13 TC646 FIGURE 5-4: SENSE Network. FIGURE 5-5: SENSE Waveforms. Table 5-1 lists the recommended values of R SENSE based on the nominal operating current of the fan. Note that the current draw specified by the fan manufacturer may be a worst-case rating for near-stall conditions and not the fan’s nominal operating current. The values in Table 5-1 refer to actual average operating current. If the fan current falls between two of the values listed, use the higher resistor value. The end result of employ- ing Table 5-1 is that the signal developed across the sense resistor is approximately 450 mV in amplitude. TABLE 5-1: RSENSE VS. FAN CURRENT

5.5 Output Drive Transistor Selection

The TC646 is designed to drive an external transistor or MOSFET for modulating power to the fan. This is shown as Q 1 in Figures 5-1, 5-4, 5-6, 5-7, 5-8 and 5-9. The VOUT pin has a minimum source current of 5 mA and a minimum sink current of 1 mA. Bipolar transistors or MOSFETs may be used as the power switching element, as shown in Figure 5-7. When high current gain is needed to drive larger fans, two transistors may be used in a Darlington configuration. These circuit topologies are shown in Figure 5-7: (a) shows a single NPN transistor used as the switching element; (b) illustrates the Darlington pair; and (c) shows an N- channel MOSFET. One major advantage of the TC646’s PWM control scheme versus linear speed control is that the power dissipation in the pass element is kept very low. Generally, low cost devices in very small packages, such as TO-92 or SOT, can be used effectively. For fans with nominal operating currents of no more than 200 mA, a single transistor usually suffices. Above 200 mA, the Darlington or MOSFET solution is recommended. For the fan sensing function to work correctly, it is imperative that the pass transistor be fully saturated when “on”. Table 5-2 gives examples of some commonly available transistors and MOSFETs. This table should be used as a guide only since there are many transistors and MOSFETs which will work just as well as those listed. The critical issues when choosing a device to use as Q 1 are: (1) the breakdown voltage (V (BR)CEO or V DS (MOSFET)) must be large enough to withstand the highest voltage applied to the fan (Note: This will occur when the fan is off); (2) 5 mA of base drive current must be enough to saturate the transistor when conducting the full fan current (transistor must have sufficient gain); (3) the V OUT voltage must be high enough to suf- ficiently drive the gate of the MOSFET to minimize the RDS(on) of the device; (4) rated fan current draw must be within the transistor's/MOSFET's current handling capability; and (5) power dissipation must be kept within the limits of the chosen device. GND VDD RSENSE SENSE RBASE CSENSE (0.1 μF Typ.) VOUT Fan Ch1 100mV Tek Run: 10.0kS/s Sample Ch2 100mV M5.00ms Ch1 142mV GND [ T ] T Waveform @ Sense Resistor 90mV 50mV GND Waveform @ Sense Pin Nominal Fan Current (mA) R SENSE () 50 9.1 100 4.7 150 3.0 200 2.4 250 2.0 300 1.8 350 1.5 400 1.3 450 1.2 500 1.0

 2002-2012 Microchip Technology Inc. DS21446D-page 15 TC646 FIGURE 5-8: Power the Fan from a -12V Supply. TABLE 5-2: TRANSISTORS AND MOSFETS FOR Q 1 (VDD = 5V)

5.6 Latch-up Considerations

As with any CMOS IC, the potential exists for latch-up if signals are applied to the device which are outside the power supply range. This is of particular concern during power-up if the external circuitry (such as the sensor network, V AS divider or shutdown circuit) is powered by a supply different from that of the TC646. Care should be taken to ensure that the TC646’s VDD supply powers up first. If possible, the networks attached to VIN and VAS should connect to the VDD sup- ply at the same physical location as the IC itself. Even if the IC and any external networks are powered by the same supply, physical separation of the connecting points can result in enough parasitic capacitance and/ or inductance in the power supply connections to delay one power supply “routing” versus another.

5.7 Power Supply Routing and

Noise present on the V IN and V AS inputs may cause erroneous operation of the FAULT output. As a result, these inputs should be bypassed with a 0.01 µF capacitor mounted as close to the package as possible. This is especially true of V IN, which is usually driven from a high impedance source (such as a thermistor). In addition, the V DD input should be bypassed with a 1 µF capacitor. Grounds should be kept as short as possible. To keep fan noise off the TC646 ground pin, individual ground returns for the TC646 and the low side of the fan current sense resistor should be used. Device Package Max. V BE(sat)/VGS (V) Min. HFE VCEO/VDS (V) Fan Current (mA) Suggested RBASE () MMBT2222A SOT-23 1.2 50 40 150 800 MPS2222A TO-92 1.2 50 40 150 800 MPS6602 TO-92 1.2 50 40 500 301 SI2302 SOT-23 2.5 NA 20 500 Note 1 MGSF1N02E SOT-23 2.5 NA 20 500 Note 1 SI4410 SO-8 4.5 NA 30 1000 Note 1 SI2308 SOT-23 4.5 NA 60 500 Note 1 Note 1: A series gate resistor may be used in order to control the MOSFET turn-on and turn-off times. GND +5V -12V Q1* VDD VOUT TC646 Fan R2* 2.2 kΩ R3* 2.2Ω R4* 10 kΩ 12.0V Zener NOTE: *Value depends on the specific application and is shown for example only.

DS21446D-page 16  2002-2012 Microchip Technology Inc. Design Example Step 1. Calculate R1 and R2 based on using an NTC having a resistance of 10 k  at T MIN (25°C) and 4.65 k at TMAX (45°C) (See Figure 5-9). R1 = 20.5 k R2 = 3.83 k Step 2. Set auto-shutdown level VAS = 1.8V. Limit the divider current to 100 µA from which R5 = 33 k R6 = 18 k Step 3. Design the output circuit. Maximum fan motor current = 250 mA. Q 1 beta is chosen at 50 from which R7 = 800 . FIGURE 5-9: Design Example.

5.8 TC646 as a Microcontroller

In a system containing a microcontroller or other host intelligence, the TC646 can be effectively managed as a CPU peripheral. Routine fan control functions can be performed by the TC646 without controller intervention. The microcontroller receives temperature data from one or more points throughout the system. It calculates a fan operating speed based on an algorithm specifi- cally designed for the application at hand. The proces- sor controls fan speed using complementary port bits I/O1 through I/O3. Resistors R 1 through R6 (5% toler- ance) form a crude 3-bit DAC that translates the 3-bit code from the processor's outputs into a 1.6V DC con- trol signal. A monolithic DAC or digital pot may be used instead of the circuit shown in Figure 5-10. With V AS set at 1.8V, the TC646 enters auto-shutdown when the controller's output code is 000[B]. Output codes 001[B] to 111[B] operate the fan from roughly 40% to 100% of full speed. An open-drain output from the processor (I/O0) can be used to reset the TC646 following detection of a fault condition. The FAULT out- put can be connected to the controller's interrupt input, or to another I/O pin, for polled operation. FAULT SENSE NTC 10 kΩ @ 25˚C 20.5 kΩ 3.83 kΩ 33 kΩ 800Ω GND Reset Shutdown (Optional) Q1 +12V +5V +5V +5V VDDVIN VAS VOUT RSENSE 2.2Ω CSENSE 0.1 μF 1 μF CF TC646 Fan Fan/Thermal Fault CB 0.01 μF CB 0.01 μF CB 1 μF 8 4 18 kΩ Open-Drain Device

DS21446D-page 18  2002-2012 Microchip Technology Inc.

6.0 PACKAGING INFORMATION

6.1 Package Marking Information

8-Lead PDIP (300 mil) Example: 8-Lead SOIC (150 mil) Example: XXXXXXXX YYWW NNN TC646VPA 025 0215 TC646VOA 0215 025 8-Lead MSOP Example: XXXXXX YWWNNN TC646E 215025 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.

 2002-2012 Microchip Technology Inc. DS21446D-page 19 TC646 8-Lead Plastic Dual In-line (P) – 300 mil (PDIP) B A L p E eB c n D Units INCHES* MILLIMETERS Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n 88 Pitch p .100 2.54 Base to Seating Plane A1 .015 0.38 Mold Draft Angle Top  5 10 15 5 10 15 Mold Draft Angle Bottom  5 10 15 5 10 15 * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed JEDEC Equivalent: MS-001 Drawing No. C04-018 .010” (0.254mm) per side. § Significant Characteristic Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

DS21446D-page 20  2002-2012 Microchip Technology Inc. 8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC) Foot Angle f 048048 1512015120Mold Draft Angle Bottom 1512015120Mold Draft Angle Top 1.27.050pPitch 88nNumber of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units D n p B E h c 45× f A * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 § Significant Characteristic Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

 2002-2012 Microchip Technology Inc. DS21446D-page 21 TC646 8-Lead Plastic Micro Small Outline Package (MS) (MSOP) p A D L c Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not .037.035FFootprint (Reference) exceed. 010" (0.254mm) per side. Notes: Drawing No. C04-111 *Controlling Parameter Mold Draft Angle Top Mold Draft Angle Bottom Foot Angle Lead Width Lead Thickness c B .004 .010 .006 .012 (F) Dimension Limits Overall Height Molded Package Thickness Molded Package Width Overall Length Foot Length Standoff § Overall Width Number of Pins Pitch A L D E .016 .114 .114 .022 .118 .118 .002 .030 .193 .034 MIN p n Units .026 NOM INCHES 1.000.950.90.039 0.15 0.30 .008 .016 0.10 0.25 0.20 0.40 MILLIMETERS* 0.65 0.86 3.00 3.00 0.55 4.90 .044 .122 .028 .122 .038 .006 0.40 2.90 2.90 0.05 0.76 MINMAX NOM 1.18 0.70 3.10 3.10 0.15 0.97 MAX E B n 1 § Significant Characteristic Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

DS21446D-page 22  2002-2012 Microchip Technology Inc.

6.2 Taping Form

Component Taping Orientation for 8-Pin MSOP Devices User Direction of Feed Standard Reel Component Orientation for 713 Suffix Device W P Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin MSOP 12 mm 8 mm 2500 13 in Carrier Tape, Number of Components Per Reel and Reel Size Component Taping Orientation for 8-Pin SOIC (Narrow) Devices Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin SOIC (N) 12 mm 8 mm 2500 13 in Carrier Tape, Number of Components Per Reel and Reel Size Standard Reel Component Orientation for 713 Suffix Device PIN 1 User Direction of Feed P W

 2002-2012 Microchip Technology Inc. DS21446D-page 23 TC646

7.0 REVISION HISTORY

Revision D (December 2012) Added a note to each package outline drawing.

DS21446D-page 24  2002-2012 Microchip Technology Inc. NOTES:

 2002-2012 Microchip Technology Inc. DS21446D-page 25 THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:

• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support

DS21446D-page 26  2002-2012 Microchip Technology Inc. READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager RE: Reader Response From: Name Company Address City / State / ZIP / Country Application (optional): Would you like a reply? Y N Device: Literature Number: Questions: DS21446D 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document?

 2002-2012 Microchip Technology Inc. DS21446D-page27 TC646 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office . Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an e rrata sheet describing minor operational differences and recom- mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. PART NO. X /XX PackageTemperature Range Device Device: TC646: PWM Fan Speed Controller w/Auto Shutdown and Fault Detection Temperature Range: V= 0C to +85C E= - 4 0 C to +85C Package: PA = Plastic DIP (300 mil Body), 8-lead * OA = Plastic SOIC, (150 mil Body), 8-lead UA = Plastic Micro Small Outline (MSOP), 8-lead * PDIP package is only offerred in the V temp range Examples: a) TC646VOA: PWM Fan Speed Controller w/ Auto Shutdown and Fault Detection, SOIC package. b) TC646VUA: PWM Fan Speed Controller w/ Auto Shutdown and Fault Detection, MSOP package. c) TC646VPA: PWM Fan Speed Controller w/ Auto Shutdown and Fault Detection, PDIP package. d) TC646EOA713: PWM Fan Speed Controller w/Auto Shutdown and Fault Detection, SOIC package, Tape and Reel.

DS21446D-page 28  2002-2012 Microchip Technology Inc. NOTES:

 2002-2012 Microchip Technology Inc. DS21446D-page 29 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY , PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2002-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620768273 Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification cont ained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are co mmitted to continuously improvin g the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT S YSTEM CERTIFIED BY DNV == ISO/TS 16949 ==

DS21446D-page 30  2002-2012 Microchip Technology Inc. AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 China - Hangzhou Tel: 86-571-2819-3187 Fax: 86-571-2819-3189 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 ASIA/PACIFIC India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Osaka Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 Japan - Tokyo Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 Taiwan - Kaohsiung Tel: 886-7-213-7828 Fax: 886-7-330-9305 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 Worldwide Sales and Service 11/29/12