DTA801 FS | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 11

Technical content

PNP Silicon Surface M ount Transistors With Monolithic Bias Resistor Network This new series of digital transistors is des igned to r eplace a single device and its external resistor bias network. The BRT (B ias Resistor Transistor) contains a s ingle tra nsistor with a mono lithic bias network consisting of two resist ors; a ser ies base resistor and a base-emitter resistor. The BRT eliminates these individual components by integrating them into a s ingle de vice. The use of a BRT ca n reduce both system cost and board space. The d evice is housed in the SOT-723 package which is designed for low power su rface mount applications. MAXIMUM RATINGS (TA =25℃ unless otherwise noted) Rating Symbol Value Unit Collector-Base Voltage VCBO 50 Vdc Collector-Emitter Voltage VCEO 50 Vdc Collector Current IC 100 mAdc THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Total Device Dissipation TA = 25℃ Derate above 25℃ PD 260 (Note 1) 600 (Note 2) 2.0 (Note 1) 4.8 (Note 2) mW Thermal Resistance – Junction-to-Ambient RθJA 480 (Note 1) 205 (Note 2) ℃/W Junction and Storage Temperature Range TJ, Tstg –55 to +150 ℃ 1. F R–4 @ Minimum Pad 2. F R–4 @ 1.0 x 1.0 inch Pad PIN 3 COLLECTOR (OUTPUT) PIN 2 EMITTER (GROUND) PIN 1 BASE (INPUT) mW/ Simplifies Circuit Design Reduces Component Count The SOT-723 Package can be Soldered using Wave or Reflow. Available in 4 mm, 8000 Unit Tape & Reel Reduces Board Space SOT-723 2019. 04. 22 1/11 SEMICO NDUCTOR TECH NICAL DATA DTA801 ~ 811 DTA817 / 822 Revision No : 1

ORDERING INFORMATION, DEVICE MARKING AND RESISTOR VALUES Device Marking R1 (K) R2 (K) Package Shipping DTA802 DTA803 DTA804 DTA807 DTA811 DTA810 DTA817 DTA801 DTA806 DTA808 DTA805 DTA822 DTA809 E13 4.7 2.2 4.7 4.7 2.2 100 2.2 4.7 100 SOT−723 8000/T ape & Reel 2019. 04. 22 2/11 DTA801~811 / DTA817 / DTA822 Revision No : 1

ELECTRICAL CHARACTERISTICS (TA = 25 Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Collector−Base Cutoff Current (VCB = 50 V, I E = 0) ICBO − − 100 nAdc Collector−Emitter Cutoff Current (VCE = 50 V, I B = 0) ICEO − − 500 nAdc Emitter−Base Cutoff Current (VEB = 6.0 V, I C DTA804 DTA807 DTA811 DTA810 DTA817 DTA801 DTA806 DTA808 DTA805 DTA822 DTA809 IEBO − 0.5 0.2 0.1 0.2 0.9 1.9 2.3 1.5 0.18 0.13 0.2 0.05 0.13 mAdc Collector−Base Breakdown Voltage (IC = 10 uA, IE = 0) V(BR)CBO 50 − − Vdc Collector−Emitter Breakdown Voltage (Note 3.) (IC = 2.0 mA, IB = 0) V(BR)CEO 50 − − Vdc ON CHARACTERISTICS (Note 3.) (VCE = 10 V, IC = 5.0 mA) DTA804 DTA807 DTA811 DTA810 DTA817 DTA801 DTA806 DTA808 DTA805 DTA822 DTA809 hFE 160 160 8.0 100 140 140 250 250 140 130 140 150 140 Collector−Emitter Saturation Voltage (IC = 10 mA, I E = 0.3 mA) (IC = 10 mA, I B=5 mA) DTA817 (IC = 10 mA, I B=1 mA) DTA801 / DTA806 / DTA808 DTA810 / DTA811 VCE(sat) − − 0.25 Vdc Output Voltage (on) (VCC = 5.0 V, V B = 2 5 V, R L = 1.0 k ) DTA801 (VCC = 5.0 V, V B = 3 5 V, R L = 1.0 k ) (VCC = 5.0 V, V B = 5 5 V, R L = 1.0 k ) (VCC = 5.0 V, V B = 4.0 V, R L = 1.0 k ) VOL 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 Vdc Output Voltage (off) (VCC = 5.0 V, V B = 0.5 V, R L = 1.0 k ) (VCC = 5.0 V, V B = 0 25 V, R L = 1.0 k ) VOH 4.9 − − Vdc 3. Pul se Test: Pulse Width < 300 s, Duty Cycle < 2.0% 2019. 04. 22 3/11 DTA801~811 / DTA817 / DTA822 Revision No : 1 DTA803 DTA802 DTA802 DTA803 DTA802 DTA803 DTA807 DTA806 DTA808 DTA805 DTA811 DTA810 DTA817 DTA804 DTA822 DTA809 DTA801 DTA805 DTA811 DTA810 ℃ unless otherwise noted) = 0) DC Current Gain

Figure 1. Derating Curve

D E b e A L C H −Y− −X− X0.08 (0.0032) Y E1 2 1.0 0.039 mm inches 0.40 0.0157 0.40 0.0157 0.40 0.0157 0.40 0.0157 0.40 0.0157 PIN 1. BASE 2. EMITTER 3. COLLECTOR DIM MIN NOM MAX MILLIMETERS A 0.45 0.50 b 0.15 0.20 C D 1.15 1.20 E 0.75 0.80 e 0.40 BSC H 1.15 1.20 L 0.15 0.20 0.018 0.020 0.022 0.010 0.012 0.014 0.045 0.047 0.049 0 016 BSC 0.045 0.047 0.049 MIN NOM MAX INCHES E NOTES:

1 DIMENSIONING AND TOLERANCING PER ANSI

Y14 5M, 1982

2 CONTROLLING DIMENSION: MILLIMETERS

3 MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL

4 DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS SOT−723 SOLDERING FOOTPRINT 2019. 04. 22 11/11 DTA801~811 / DTA817 / DTA822 Revision No : 1 0 07 0.12 0.17 0.25 0.30 0.35 1 25 0.85 1.25 0.25 0 55 0 27 0.0059 0.0079 0.0106 0.0028 0.0047 0.0067 0 030 0.032 0.034 0.0059 0.0079 0.0098