DTA114EE

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Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 12

Technical content

Features

• Simplifies Circuit Design
• Reduces Board Space
• Reduces Component Count
• S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant MAXIMUM RATINGS (TA = 25°C) Rating Symbol Max Unit Collector−Base Voltage VCBO 50 Vdc Collector−Emitter Voltage VCEO 50 Vdc Collector Current − Continuous IC 100 mAdc Input Forward Voltage VIN(fwd) 40 Vdc Input Reverse Voltage VIN(rev) 10 Vdc Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. PIN 3 COLLECTOR (OUTPUT) PIN 2 EMITTER (GROUND) PIN 1 BASE (INPUT) See detailed ordering, marking, and shipping information in the package dimensions section on page 2 of this data sheet.

ORDERING INFORMATION

http://onsemi.com SC−75 CASE 463 STYLE 1 MARKING DIAGRAMS XXX = Specific Device Code M = Date Code* /C0071 =P b −Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. SC−59 CASE 318D STYLE 1 SOT−23 CASE 318 STYLE 6 SC−70/SOT−323 CASE 419 STYLE 3 SOT−723 CASE 631AA STYLE 1 SOT−1123 CASE 524AA STYLE 1 XX M/C0071 /C0071 XXX M/C0071 /C0071 XX M/C0071 /C0071 XX M X M XX M PIN CONNECTIONS

Table 1. ORDERING INFORMATION Specifications Brochure, BRD8011/D. Figure 1. Derating Curve

Table 2. THERMAL CHARACTERISTICS

1. FR −4 @ 100 mm2, 1 oz. copper traces, still air.
2. FR −4 @ 500 mm2, 1 oz. copper traces, still air.

1. FR −4 @ 100 mm2, 1 oz. copper traces, still air.
2. FR −4 @ 500 mm2, 1 oz. copper traces, still air.

Table 3. ELECTRICAL CHARACTERISTICS (TA = 25°C, unless otherwise noted)

1. Pulsed Condition: Pulse Width = 300 msec, Duty Cycle ≤ 2%.

MUN2111, MMUN2111L, MUN5111, DTA114EE, DTA114EM3, NSBA114EF3 http://onsemi.com PACKAGE DIMENSIONS SC−59 CASE 318D−04 ISSUE H STYLE 1: PIN 1. BASE 2. EMITTER 3. COLLECTOR e b A E D C L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 2.4 0.094 0.95 0.037 0.95 0.037 1.0 0.039 0.8 0.031 /C0466mm inches/C0467SCALE 10:1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* HE DIM A MIN NOM MAX MIN MILLIMETERS 1.00 1.15 1.30 0.039 INCHES A1 0.01 0.06 0.10 0.001 b 0.35 0.43 0.50 0.014 c 0.09 0.14 0.18 0.003 D 2.70 2.90 3.10 0.106 E 1.30 1.50 1.70 0.051 e 1.70 1.90 2.10 0.067 L 0.20 0.40 0.60 0.008 2.50 2.80 3.00 0.099 0.045 0.051 0.002 0.004 0.017 0.020 0.005 0.007 0.114 0.122 0.059 0.067 0.075 0.083 0.016 0.024 0.110 0.118 NOM MAX HE

MUN2111, MMUN2111L, MUN5111, DTA114EE, DTA114EM3, NSBA114EF3 http://onsemi.com PACKAGE DIMENSIONS SOT−23 (TO−236) CASE 318−08 ISSUE AP D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. /C0466mm inches/C0467SCALE 10:1 0.8 0.031 0.9 0.035 0.95 0.0370.95 0.037 2.0 0.079 SOLDERING FOOTPRINT* VIEW C L 0.25 /C0113 e E E b A SEE VIEW C DIM A MIN NOM MAX MIN MILLIMETERS 0.89 1.00 1.11 0.035 INCHES A1 0.01 0.06 0.10 0.001 b 0.37 0.44 0.50 0.015 c 0.09 0.13 0.18 0.003 D 2.80 2.90 3.04 0.110 E 1.20 1.30 1.40 0.047 e 1.78 1.90 2.04 0.070 L 0.10 0.20 0.30 0.004 0.040 0.044 0.002 0.004 0.018 0.020 0.005 0.007 0.114 0.120 0.051 0.055 0.075 0.081 0.008 0.012 NOM MAX H STYLE 6: PIN 1. BASE 2. EMITTER 3. COLLECTOR c *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

MUN2111, MMUN2111L, MUN5111, DTA114EE, DTA114EM3, NSBA114EF3 http://onsemi.com PACKAGE DIMENSIONS SC−70 (SOT−323) CASE 419−04 ISSUE N STYLE 3: PIN 1. BASE 2. EMITTER 3. COLLECTOR A A2 D b e E c L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 0.05 (0.002) 1.9 0.075 0.65 0.025 0.65 0.025 0.9 0.035 0.7 0.028 /C0466mm inches/C0467SCALE 10:1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* HE DIM A MIN NOM MAX MIN MILLIMETERS 0.80 0.90 1.00 0.032 INCHES A1 0.00 0.05 0.10 0.000 A2 0.70 REF b 0.30 0.35 0.40 0.012 c 0.10 0.18 0.25 0.004 D 1.80 2.10 2.20 0.071 E 1.15 1.24 1.35 0.045 e 1.20 1.30 1.40 0.047 0.035 0.040 0.002 0.004 0.014 0.016 0.007 0.010 0.083 0.087 0.049 0.053 0.051 0.055 NOM MAX L e1 0.65 BSC 0.38

0.028 REF

0.026 BSC

MUN2111, MMUN2111L, MUN5111, DTA114EE, DTA114EM3, NSBA114EF3 http://onsemi.com PACKAGE DIMENSIONS SC−75/SOT−416 CASE 463 ISSUE F STYLE 1: PIN 1. BASE 2. EMITTER 3. COLLECTOR NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. M0.20 (0.008) D −E− −D− b e 3 PL 0.20 (0.008) E C L A HE DIM MIN NOM MAX MILLIMETERS A 0.70 0.80 0.90 A1 0.00 0.05 0.10 b C 0.10 0.15 0.25 D 1.55 1.60 1.65 E e 1.00 BSC 0.027 0.031 0.035 0.000 0.002 0.004 0.004 0.006 0.010 0.059 0.063 0.067

0.04 BSC

L 0.10 0.15 0.20 1.50 1.60 1.70 0.004 0.006 0.008 0.061 0.063 0.065 0.787 0.031 0.508 0.020 1.000 0.039 /C0466mm inches/C0467SCALE 10:1 0.356 0.014 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 1.803 0.071

MUN2111, MMUN2111L, MUN5111, DTA114EE, DTA114EM3, NSBA114EF3 http://onsemi.com PACKAGE DIMENSIONS SOT−723 CASE 631AA ISSUE D DIM MIN NOM MAX MILLIMETERS A 0.45 0.50 0.55 b 0.15 0.21 0.27 b1 0.25 0.31 0.37 C 0.07 0.12 0.17 D 1.15 1.20 1.25 E 0.75 0.80 0.85 e 0.40 BSC H 1.15 1.20 1.25 L E NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. D E b e A L C H −Y− −X− X0.08 Y E 1 2 STYLE 1: PIN 1. BASE 2. EMITTER 3. COLLECTOR *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* L2 0.15 0.20 0.25

0.29 REF

DIMENSIONS: MILLIMETERS 0.40 1.50 PACKAGE OUTLINE 0.272X 0.523X 0.36

MUN2111, MMUN2111L, MUN5111, DTA114EE, DTA114EM3, NSBA114EF3 http://onsemi.com PACKAGE DIMENSIONS SOT−1123 CASE 524AA ISSUE C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM MIN MAX MILLIMETERS A 0.34 0.40 b 0.15 0.28 c 0.07 0.17 D 0.75 0.85 E 0.55 0.65 0.95 1.05 L 0.185 REF HE D E c A −Y− −X− HE *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* e b1 0.10 0.20 STYLE 1: PIN 1. BASE 2. EMITTER 3. COLLECTOR 0.35 0.40 TOP VIEW SIDE VIEW BOTTOM VIEW L3X DIMENSIONS: MILLIMETERS 1.20 0.26 3X 0.34 PACKAGE OUTLINE b 2X b1 e 0.08 XY L2 0.05 0.15 0.20 0.38 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a numb er of patents, trademarks, reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 DTA114E/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative