DT1240-02LP10
Document overview
- Manufacturer or author: Diodes Incorporated
- PDF pages: 5
Technical content
Features
Clamping Voltage: 9V at 10A 100ns, TLP 9.4V at 5.5A 8μs/20μs IEC 61000-4-2 (ESD): Air — ± 16kV, Contact — ±16kV IEC 61000-4-5 (Lightning): 5.5A (8/20µ s) 2 Channels of ESD Protection Low Channel Input Capacitance of 0.75pF Max TLP Dynamic Resistance: 0.25Ω Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Mechanical Data Case: X3-DSN1006-3 Case Material: Chip Scale Package Moisture Sensitivity: Level 1 per J-STD-020 Terminals: NiAu Bump. Solderable per MIL-STD-202, Method 208 Weight: 0.001 grams (Approximate) X3-DSN1006-3 (Type B) Ordering Information (Note 4) Product Compliance Marking Reel Size (inches) Tape Width (mm) Quantity per Reel DT1240-02LP10-7B Standard MJ 7 8 10,000/Tape & Reel Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporate d’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain < 900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes -packaging/. Marking Information Bottom View Device Schematic MJ = Product Type Marking Code Top View MJ Top View Bar Denotes Pin 1 and Pin 2 Pin 2 Pin 1 Pin 3
Document number: DS38730 Rev. 4 - 4 2 of 5 www.diodes.com August 2019 © Diodes Incorporated DT1240-02LP10 ADVANCED INFORMATION PART OBSOLETE - NO ALTERNATE PART NO ALTERNATE PART OBSOLETE – PART DISCONTINUED Maximum Ratings (@TA = +25° C, unless otherwise specified.) Characteristic Symbol Value Unit Conditions Peak Pulse Current, per IEC 61000-4-5 IPP 5.5 A I/O to VSS, 8/20µ s Peak Pulse Power, per IEC 61000-4-5 PPP 55 W I/O to VSS, 8/20µ s ESD Protection – Contact Discharge, per IEC 61000-4-2 VESD_CONTACT ±16 kV I/O to VSS ESD Protection – Air Discharge, per IEC 61000-4-2 VESD_AIR ± 16 kV I/O to VSS Operating Temperature TOP -55 to +85 °C — Storage Temperature TSTG -55 to +150 °C — Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation Typical (Note 5) PD 500 mW Thermal Resistance, Junction to Ambient Typical (Note 5) RJA 250 ° C/W Electrical Characteristics (@TA = +25° C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Conditions Reverse Working Voltage VRWM — — 5.5 V IR=1mA, , I/O to VSS Reverse Current IR — — 0.5 μA VR = 5.5V, I/O to VSS Reverse Breakdown Voltage VBR 6 — — V IR = 1mA, I/O to VSS Forward Clamping Voltage VF -1.0 -0.85 — V IF = -15mA, I/O to VSS Reverse Clamping Voltage (Note 6) VC — 9.4 11 V IPP = 5.5A, I/O to VSS, 8/20µ s ESD Clamping Voltage VESD — 9 — V TLP, 10A, tp = 100ns, I/O to VSS Dynamic Reverse Resistance RDIF-R — 0.25 — Ω TLP, 10A, tp = 100ns, I/O to VSS Dynamic Forward Resistance RDIF-F — 0.25 — Ω TLP, 10A, tp = 100ns, VSS to I/O Channel Input Capacitance CI/O — — 0.75 pF VI/O = 2.5V, VSS = 0V, f = 1MHz Delta CI/O CI/OMAX-CI/OMIN — 0.04 — pF CI/OMAX-CI/OMIN Notes: 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes Incorporated’s suggested pad layout, which can be found on our website at http://www.diodes.com/package-outlines.html. 6. Clamping voltage value is based on an 8x20µs peak pulse current (IPP) waveform.
Document number: DS38730 Rev. 4 - 4 4 of 5 www.diodes.com August 2019 © Diodes Incorporated DT1240-02LP10 ADVANCED INFORMATION PART OBSOLETE - NO ALTERNATE PART NO ALTERNATE PART OBSOLETE – PART DISCONTINUED Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. X3-DSN1006-3 (Type B) X3-DSN1006-3 (Type B) Dim Min Max Typ A 0.250 0.300 0.275 A1 0.00 0.02 0.01 b 0.130 0.170 0.150 b2 0.480 0.520 0.500 D 0.975 1.025 1.00 E 0.575 0.625 0.600 e -- -- 0.350 e1 -- -- 0.650 L 0.230 0.270 0.250 All Dimensions in mm Note 7: Device side walls are electrically active bare silicon. Avoid contact of solder or flux on the side walls during the PCB assembly process. Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. X3-DSN1006-3 (Type B) Dimensions Value (in mm) C 0.70 G 0.30 G1 0.20 X 0.40 X1 1.10 Y 0.25 Y1 0.70 Seating Plane A E D b(2x) L(3x) b2 e G X Y C
Document number: DS38730 Rev. 4 - 4 5 of 5 www.diodes.com August 2019 © Diodes Incorporated DT1240-02LP10 ADVANCED INFORMATION PART OBSOLETE - NO ALTERNATE PART NO ALTERNATE PART OBSOLETE – PART DISCONTINUED IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any lia bility arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license unde r its patent or trademark rights, nor the rights of others. Any Customer or user of this document or pro ducts described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diod es Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising ou t of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, internation al or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into mul tiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided i n the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support d evices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety -critical, life support devices or systems, notwithstanding any devices - or systems -related information or support that may be pr ovided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2019, Diodes Incorporated www.diodes.com