DSTINIM400 MAXIM | Alldatasheet
Document overview
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Technical content
TINI and 1-Wire are registered trademarks of Dallas Semiconductor. 1 of 5 REV: 013004 GENERAL DESCRIPTION The DSTINIm400 is a fully assembled and tested circuit board that evaluates the DS80C400 network microcontroller. In addition to the DS80C400, the DSTINIm400 includes a real-time clock, 1MB flash, 1MB static RAM, and support for an external Ethernet PHY for connecting to a wide variety of networks. The circuit board is designed as a module to be plugged into a 144-pin SODIMM connector. For evaluation, the DSTINIm400 can be inserted into the DSTINIs400 socket board. The combination of the two boards allows full evaluation of the features of the DS80C400 using an Ethernet network. Detailed information about the initial setup process and use of the TINI platform is contained in Application Note 612: Getting Started with the TINIm400 (DS80C400) Verification Module.
ORDERING INFORMATION
PART TEMP RANGE DIMENSIONS DSTINIm400 0°C to +70°C Approx. 67mm x 48mm, 144 SODIMM Note: To evaluate the DS80C400, order both a DSTINIm400 and a DSTINIs400.
FEATURES
/g167/g32Hosts the TINI® Runtime Environment in Validated Hardware Design (in Conjunction with the DSTINIs400) /g167/g32Industry Standard MII Interface to Connects to Network Interfaces Including 10/100 Base-T, Optical, and HomePNA /g167/g32Three Hardware Serial Ports /g167/g32Integrated 1-Wire® Network Master /g167/g32CAN2.0B Port /g167/g32Real-Time Clock for Time Stamping /g167/g321MB Flash ROM for Application Storage /g167/g321MB NV SRAM for Data Storage /g167/g323.3V Single-Supply Operation /g167/g32Fully Assembled and Tested Design COMPONENT LIST DESIGNATION QTY DESCRIPTION C1–C5, C8–C14, C17, C18 14 0.1/g109F, ±20%, 10V ceramic capacitors (0805) C6, C7 2 27pF, ±20%, 50V C0G ceramic capacitors (0805) C15 1 1.0/g109F, ±20%, 10V ceramic capacitor (1206) C16 1 4.7/g109F, ±20%, 10V ceramic capacitor (1206) C19, C20 2 47/g109F, ±20%, tantalum capacitors (C) BT1 1 CR1632 3V lithium cell DESIGNATION QTY DESCRIPTION DN1 1 BAT54S diode (SOT23) DS1 1 SML-LX23SRC Lumex LED Q1, Q3 2 BSS84 P-Channel FET (SOT23) Q2 1 2N7002 N-Channel FET (SOT23) R1, R4, R7, R8 4 10k/g87, ±5% resistors (0805) R2 1 1.5k/g87, ±5% resistor (0805) R3 1 1k/g87, ±5% resistor (0805) R5 1 2.2k/g87, ±5% resistor (0805) DS80C400 (DSTINIm400) Networked Microcontroller Evaluation Kit www.maxim-ic.com
DS80C400 (DSTINIm400) Networked Microcontroller EV KIT 2 of 5 COMPONENT LIST (continued) DESIGNATION QTY DESCRIPTION R6 1 10/g87, ±5% resistor (0805) U1 1 DS80C400 networked microcontroller U2, U3 2 HM62W8512BLTT-7UL 512kB RAM U4 1 AM29LV081B-70EC 1MB flash U5, U6 2 MAX6365PKA31 reset controllers DESIGNATION QTY DESCRIPTION U7 1 MAX1792EUA18 voltage regulator U8 1 DS1672U-33 real-time clock U9 1 DS2502-E48 IEEE MAC address Y1 1 14.7456MHz crystal Y2 1 32kHz crystal QUICK START It is highly recommended that the developer use the DSTINIs400 sockets board in conjunction with the DSTINIm400. The DSTINIs400 was specifically designed to hold the DSTINIm400 and provide the physical interconnects (Ethernet PHY), as well as the 1-Wire, I 2C, SPI, CAN, and four serial port connectors. If the developer wishes to implement his or her own design using the DSTINIm400, a 144-pin SODIMM connector such as the Hirose SX6E-144S-0.8SH is required. The TINIm400 must be seated correctly into the DSTINIs400 to ensure a proper connection. Insert the TINIm400 into the connector at a 30-degree angle. Place index fingers behind the SODIMM connector and place thumbs on the top edge of the TINIm400, pressing firmly until it clicks into place or seats with only a millimeter of gold contact exposed. Press the TINIm400 down parallel to the TINIs400 until the side arms latch into the center of the semicircular cutouts on the TINIm400. Note that the flash used on the DSTINIm400 limits applications to a maximum of 2x clock multiplier mode with the included 14.7456MHz crystal. Use of the 4x clock multiplier mode results in unstable operations. FOR MORE INFORMATION TINI platform details can be found at www.maxim-ic.com/TINI. The TINI Specification and Developers Guide (Addison-Welsey, 2001) is an invaluable resource when developing with the TINI platform. Download a free copy from our website at www.maxim-ic.com/TINIguide DS80C400 INFORMATION For more information about the DS80C400 network microcontroller, please consult the DS80C400 data sheet available on our website at www.maxim-ic.com/microcontrollers ADDITIONAL RESOURCES For detailed information about the initial setup and use of the TINI platform, refer to Application Note 612: Getting Started with the TINIm400 (DS80C400) Verification Module at www.maxim-ic.com/appnoteindex. DS80C400 Networked Microcontroller Data Sheet: www.maxim-ic.com/DS80C400 Microcontroller Website: www.maxim-ic.com/microcontrollers I2C is a trademark of Philips Corp. Purchase of I 2C components of Maxim Integrated Products, Inc., or one of its sublicensed Associated Companies, conveys a license under the Philips I 2C Patent Rights to use these components in an I 2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. SPI is a trademark of Motorola Inc.
A 1 3Tuesday, February 12, 2002 TxD 3 TxD 2 TxD 1 TxD 0 RxD0 RxD1 RxD2 RxD3 P51 P50 P53 P3 0 P3 1 P3 2 P3 3 P17 P16 P15 P14 P13 P12 P11 P10 P67 P66 P52 TxD[3:0] RxD[3:0] nW r nRd nPCE[0..3] AL E nPS En D[7:0] A[21:0] TxE n MDC TxClk MDIO RxDV RxClk RxEr CRS Col SDa SClk nStiffPU Int1W P3[3:0] P1[7:0] Reset nE A P6[7:6] nCE[7:0] nRstOut P5[3:0] VCC1 VCC3 VCC3 VCC3 VCC3 VCC3 0.1uF 1.5K DS80C400 100 CRS COL TXD.3 TXD.2 TXD.1 TXD.0 TX_EN TXCLK RX_ER RXCLK RX_DV RXD.0 RXD.1 RXD.2 RXD.3 MDC MDIO P3.0/RXD0 P3.1/TXD0 P3.2/INT0* P3.3/INT1* P3.4/T0 P3.5/T1/CLKO P3.6/WR* P3.7/RD* P5.7/PCE3* P5.6/PCE2* P5.5/PCE1* P5.4/PCE0* P5.3 P5.2/T3 P5.1/C0RX P5.0/C0TX XTAL2 XTAL1 MUX* P4.7/A19 P4.6/A18 P4.5/A17 P4.4/A16 P4.3/CE3* P4.2/CE2* P4.1/CE1* P4.0/CE0* P6.7/TXD2 P6.6/RXD2 P6.5/A21 P6.4/A20 P6.3/CE7* P6.2/CE6* P6.1/CE5* P6.0/CE4* P2.7/A15 P2.6/A14 P2.5/A13 P2.4/A12 P2.3/A11 P2.2/A10 P2.1/A9 P2.0/A8 PSEN* ALE EA* VCC1 P7.7/A7 P7.6/A6 P7.5/A5 P7.4/A4 P7.3/A3 P7.2/A2 P7.1/A1 P7.0/A0 P0.7/D7 P0.6/D6 P0.5/D5 P0.4/D4 P0.3/D3 P0.2/D2 P0.1/D1 P0.0/D0 P1.0/T2 P1.1/T2EX P1.2/RXD1 P1.3/TXD1 P1.4/INT2 P1.5/INT3* P1.6/INT4 P1.7/INT5* RST RSTOL OW OWSTP* 0.1uF 0.1uF C7 27pF 0.1uF C6 27pF 10 K 0.1uF DS1 LED Y1 14.7 456MHz
N.C. TINI-400 TINI-400 memory A 2 3Tuesday, February 12, 2002 A1 0 A1 1 A1 2 A1 3 A1 4 A1 5 A1 6 A1 7 A1 8 A2 0 A[20:0] D[7:0] nFlashEn nP SEn nWr nRAM2En nRstOut nRAM1En nResetIn Reset MVCC 2 MVCC 1 VCC3 VCC3 MVCC 2 MVCC 1 MVCC2 MVCC1 VBat VCC3 VCC3 VCC3 10 K C10 0.1uF 0.1uF 10 K 0.1uF AM2 9LV017D RY/BY A17 CE GND OE DQ0 VCC DQ7 GND A16 A15 A14 A13 A12 A11 A10 WE RST DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 A18 A19 VCC A20 MAX6365 PKA RST CEI GND MR CEO Batt Out Vcc MAX6365 PKA RST CEI GND MR CEO Batt Out Vcc HM6 28512 GND VCC A10 I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 A14 A13 A11 A12 A15 A16 A17 A18 OE WE CS BT 1 3V Lithium C12 0.1uF C13 0.1uF HM6 28512 GND VCC A10 I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 A14 A13 A11 A12 A15 A16 A17 A18 OE WE CS BSS 84 C11 0.1uF
B 3 3Tuesday, February 12, 2002 Int1W Local1W nStiffPU VPullup SDa SClk nCE0 RxD3 P14 nResetIn A19 nRstOut MDC A16 MDIO P33 RxClk A13 nPCE2 P10 P52 ALE A10 nWr nCE4 TxD0 P15 nEA A14 nCE1 P16 RxEr P66 nCE6 RxDV RxD0 A21 P67 nPCE3 P11 P53 nRAM1En P12 COL P30 TxD2 A17 CRS TxD1 P31 nFlashEn nCE2 P17 TxClk RxD1 nCE3 A12 P13 nRd A20 A18 Local1W P32 nPCE0 nCE5 TxD3 P50 nPCE1 nCE7 A15 TxEn P51 A11 VPullup RxD2 nRAM2En nPSEn VCC1 VCC3 VCC3 VBat VCC3 VCC3 J1 DIMM144 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144
2 Pin1
2.2K C14 0.1uF BSS84 C18 0.1uF C15 1.0uF 10K C19 47uF 2N7002 Y2 32KHz C17 0.1uF C16 4.7uF DS2502 1DATA GND DS1672U-33 GND RST SDAX1 SCL VBAT VCC C20 47uF MAX1792EUA18 IN RST SHDN OUT1 OUT2 SET GND IN