TMS37145 TI1 | Alldatasheet
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www.ti.com SCBS879 –MAY 2012 DIGITALSIGNATURETRANSPONDER WITHINTEGRATEDDST80AUTHENTICATION,EEPROM,ANDLFIMMOBILIZER Check forSamples: TMS37145 1FEATURES
- Low-Frequency (LF)ImmobilizerInterface – FastMutual AuthenticationWithin65 ms – 75-ByteEEPROM – 75-ByteEEPROM – 80-BitDST80 SecurityAuthentication – 48-ByteAvailableEEPROM User Coprocessor Memory – IntegratedBatterylessImmobilizerInterface – 32-BitUnique SerialNumber – HalfDuplex (HDX) Immobilizer – High EEPROM Securityand Flexibility Communication Achieves up to4-in(10-cm) – Write-OnlyAuthenticationKeys Read Range – Pages Are IrreversiblyLockable and – SpecialSelectiveAddressing Mode Allows Protectable ReliableLearn-InSequence – ProtectedPages Programmable Only – 80-BitAuthenticationKey Length Through Mutual Authentication – Up to8-kbit/sUplinkData Rate – Each User Page isLockable – 5-/3-ByteChallenge/ResponseAlgorithm – Resonant Frequency:134.2kHz – FastAuthenticationWithin42 ms
DESCRIPTION
Thisnew generationofsecurityRFID transponderprovidesthehighestlevelofsecuritywithitsintegrated80-bit encryptionalgorithm.The 5-bytechallengeand 3-byteresponsealgorithmisbackward compatiblewithexisting TIproductsand provides,togetherwiththeburstlengthcoding,shortencryptiontelegramtimes. The DST80 offers65 bytesof freeprogrammable user data storedinninepages,each of them lockablefor programming.Each ofthetwo 80-bitencryptionkeyswithcan be programmed witha singletelegram. The DST80 comes intwo versions,preprogrammed witheitherPWM orPPM communicationformats,eliminating theneed fortheusertochange thisfield. OrderingInformation(1) COMMUNICATIONTA PACKAGE (2) ORDERABLE PART NUMBERFORMAT PWM TMS37145TEAIE -40°C to85°C Wedge PPM TMS37145TEAIEG (1) Forthemost currentpackage and orderinginformation,see thePackage OptionAddendum attheend ofthisdocument,orsee theTI web siteatwww.ti.com. (2) Package drawings,thermaldata,and symbolizationareavailableatwww.ti.com/packaging. WEDGE PACKAGE Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2012,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SCBS879 –MAY 2012 www.ti.com OperatingCharacteristics PartNumber TMS37145TEAIE, TMS37145TEAIEG Features Immobilizerplusmicrocontrollerwithintegratedpower management DST80 authenticationlogic 80-bitkey length,4-byteor5-bytechallenge,3-bytesignature Mutualauthentication:65 msDST80 encryptiontime Fastauthentication:42 ms Transponder Transmissionprinciple HDX (halfduplextelegramprotocol) 134.2kHzOperatingfrequency IntegratedresonantfrequencytrimmingcapabilityviaLF ortestinterface Security Challenge/response,mutualauthentication Downlink 100% AM, PPM bitcodingwith2 kbit/s(typ) Uplink FSK modulationwith7.9kbit/s(typ) Read timeforan encryption PPM: 60 ms (typ)(including20-ms chargetime) Read timeformutualauthentication PPM: 85 ms (typ)(including20-ms chargetime) Protocoltransmissionsecurity 16-bitblockcheckcharacter Activationfieldstrength 141.5dBµA/m Minimum requiredoperationQ-factor 30 48-bytefreeavailableEEPROM usermemory EEPROM memory 75 bytes 32-bituniqueserialnumber Two 80-bitsecuritykeys EEPROM endurance 200 000 (min)write-erasecycles(TA = 25°C) Key learn-in Specialselectiveaddressingtoprovidesecurelearn-inprocedure Storagetemperature -40°C to100°C (175°C for5 minutes) Operatingtemperature -40°C to85°C Case material Plastic Protectionclass IP68 EMC Programmed code isnotaffectedby naturalelectromagneticinterferenceorX-rays Mechanicalshock IEC 68-2-27,TestEa;200 g,halfsine,3 ms, 6 shocksperaxis Vibration IEC 68-2-6,TestFc;10 to500 Hz,1.65mm peak topeak,10 g,4 hoursperaxis Weight 0.4g Packaging Bulk(2000unitsperbox)
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www.ti.com 30-May-2012 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TMS37145TEAIE ACTIVE RFIDP TEA 0 Pb-Free (RoHS) Call TI N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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