DSR0.3A CHENDA | Alldatasheet
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Technical content
Features
Ideal for automated placement Glass passivated chip junctions Low forward voltage drop Low leakage current High forward surge capability High temperature soldering： 260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC Mechanical Date Case: JEDEC SOD-123FL molded plastic body over glass passivated chip Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D Polarity: Laser band denotes cathode end Weight: 0.017gram
RATINGS AND CHARACTERISTIC CURVES DSR0.3A THRU DSR0.3M Characteristic Curves A =25 ℃ unless otherwise noted) The cruve g ra p h is for reference onl y , can't be the basis for j ud g ment 曲线图仅供参考