DSM SPSEMI | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 2
Technical content
Surface Mount Devices Almost anywhere there is a low voltage Lead free device power supply, up to 15V and a load to be Size 1.5*0.8 mm / 0.06*0.03 inch protected, including: Surface Mount packaging Com p uter mother board, Modem. USB hub for automated assembly PDAs & Char g er, Analo g & di g ital line card Digital cameras, Disk drivers, CD-ROMs, D E Test Conditions Resistance change Passive aging +85°C, 1000 hrs. ±5% typical Humidity aging +85°C, 85% R.H. , 168 hours ±5% typical Thermal shock +85°C to -40°C, 20 times ±33% typical Resistance to solvent MIL-STD-202,Method 215 No change Vibration MIL-STD-202,Method 201 No change Ambient operating conditions : - 40 °C to +85 °C Maximum surface temperature of the device in the tripped state is 125 °C Terminal pad materials Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper Terminal pad solderability Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3. Model Environmental Specifications Termination pad characteristics Dimensions(mm) Product dimensions (mm) CA B CD E A B 1.0士0.1 0.7士0.1 0.7 士0.1 士 PPTC/DSM Series 01 | www.spsemi.cn REV.2014.05.01
@25°C @25°C Typ. Current Time Rimin R1max (Vdc) (A) (A) (A) (W) (A) (Sec) (Ω) (Ω) Ihold = Hold Current. Maximum current device will not trip in 25°C still air. Itrip = Trip Current. Minimum current at which the device will always trip in 25°C still air. Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax). Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax). Pd = Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage. Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C. R1max = Maximum device resistance is measured one hour post reflow. CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame. -40°C -20°C 0°C 25°C 40°C 50°C 60°C 70°C 85°C Thermal Derating Curve Typical Time-To-Trip At 25°C Recommended Solder Reflow Conditions Soldering ‧Recommended reflow methods：IR, vapor phase oven, hot air oven. ‧Devices are not designed to be wave soldered to the bottom side of the board. ‧Recommended maximum paste thickness is 0.25 mm (0.010 inch). ‧Devices can be cleaned using standard method and solvents. Note：If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Packaging Information Model Model Marking Maximum Time To Trip DSM010-100 5,000 pcs/reel Electrical characteristics(25℃) Ihold verus tempetature Preheating Cooling Maximum ambient operating temperature (Tmao) vs. hold current (Ihold) Resistance Average Time Current Curves 0.001 0.01 0.1 100 0.1 1 10Current In Amperes Time In Seconds 0.10A 0.20A 0.25A 0.35A 0.50A 0.75A 1.00A Derating Curves for SMD0603 Series 100 120 140 160 -40 -20 0 20 40 60 80 Temperature (°C) Percentage of Derated Current 300 200 160 250 190 100 60-120 sec. 120 sec. 30~60sec. PPTC/DSM Series 02 | www.spsemi.cn Reel: REV.2014.05.01