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Only One Name Means ProTek’Tion™ www.protekdevices.com 05438.R2 6/15Page 1
05438 DSL03-24
ULTRA LOW CAPACITANCE STEERING DIODE/TVS ARRAY
DESCRIPTION
The DSL03-24 provides ESD, EFT and surge protection for high-speed data interfaces. The transient voltage array, steering diode combination device meets IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC 61000-4-5 (Surge) require- ments. Available in the space-saving SOT-23-6 package configuration, this device is offered in 24 Volts with a Peak Pulse Power rating of 500 Watts for and 8/20µs waveshape.
FEATURES
- Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
- Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
- Compatible with IEC 61000-4-5 (Surge): 24A, 8/20µs - Level 2(Line- Gnd) & Level 3(Line-Line0
- 500 Watts Peak Pulse Power per Line(tp = 8/20µs)
- ESD Protection > 25 kilovolts
- Protection for 2 Lines
- Low Capacitance: < 5pF
- RoHS Compliant
- REACH Compliant MECHANICAL CHARACTERISTICS
- Molded JEDEC SOT-23-6 Package
- Approximate Weight: 16 milligrams
- Lead-Free Nickel Paladium Gold Plating
- Solder Reflow Temperature - 260-270°C
- Flammability Rating UL 94V-0
- 8mm Tape and Reel per EIA Standard 481
APPLICATIONS
- xDSL
- Portable Electronics
- SMART Phones PIN CONFIGURATION SOT-23-6 PACKAGE 1 6 3 4 I/O 1 GND I/O 2 REF REF REF
Only One Name Means ProTek’Tion™ www.protekdevices.com 05438.R2 6/15Page 2 TYPICAL DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25°C Unless Otherwise Specified PARAMETER SYMBOL VALUE UNITS Peak Pulse Power (tp = 8/20µs) - See Figure 1 PPP 500 Watts Operating Temperature TL -55 to 150 °C Storage Temperature TSTG -55 to 150 °C Peak Pulse Current (tp = 8/20µs) - Note 1 IPP 15 Amps NOTES 1. Across TVS only - pin 2 to pin 5. ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified PART NUMBER (Note 1) DEVICE MARKING RATED STAND-OFF VOLTAGE VWM VOLTS MINIMUM BREAKDOWN VOLTAGE @ 1mA V(BR) VOLTS MAXIMUM CLAMPING VOLTAGE (Fig. 2) @ IP = 1A VC VOLTS TYPICAL CLAMPING VOLTAGE (Fig. 2) @ 8/20µs VC @ IPP MAXIMUM LEAKAGE CURRENT @VWM ID µA TYPICAL CAPACITANCE @0V, 1MHz C pF MAXIMUM CAPACITANCE @0V, 1MHz C pF NOTES 1. All measurements made between I/O1 and I/O2. FIGURE 1 PEAK PULSE POWER VS PULSE TIME td - Pulse Duration - µs 500W, 8/20µs Waveform 0.1 1 10 100 1,000 10,000 PPP - Peak Pulse Power - Watts 100 1,000 10,000
Only One Name Means ProTek’Tion™ www.protekdevices.com 05438.R2 6/15Page 3 TYPICAL DEVICE CHARACTERISTICS TEST WAVEFORM PARAMETERS t f = 8µs td = 20µs tf e-t Peak Value IPP td = t/(IPP/2) FIGURE 2 PULSE WAVE FORM t - Time - µs 0 5 10 15 20 25 30 IPP - Peak Pulse Current - % of IPP 100 120 Peak Pulse Power 8/20µs Average Power FIGURE 3 POWER DERATING CURVE TA - Ambient Temperature - °C 0 25 50 75 100 125 150 100 % Of Rated Power
Only One Name Means ProTek’Tion™ www.protekdevices.com 05438.R2 6/15Page 4 TYPICAL DEVICE CHARACTERISTICS FIGURE 4 MAXIMUM CURRENT VS PULSE DURATION Pulse Duration - seconds 100 Maximum Current - Amps FIGURE 5 NORMALIZED CAPACITANCE VS V D 0 5 10 15 20 25 VD - Volts 0.4 0.8 1.2 Capacitance Normalized to VD = 1 V
Only One Name Means ProTek’Tion™ www.protekdevices.com 05438.R2 6/15Page 5
APPLICATION INFORMATION
The DSL03-24 is used to protect a VDSL driver outputs. The current limiting resistors (Rp), typically around 1 Ohm, limit the peak current seen by the driver. Low volt- age varistors MOV1 and MOV2, with a typical working voltage of less than 20V, limit the current in the line side of the transformer by limiting the voltage across it. In applications sensitive to very low levels of leakage current, optional bias resistors RB1 and RB2 can be used. Both resistors would be required for dual supply applica- tions. Only RB1 is requried for single supply applications. In this case, the anodes of the diode array should be connected to ground. CIRCUIT BOARD RECOMMENDATIONS Circuit board layout is critical for electromagnetic compatibility protection. The following guidelines are recommended:
- The protection device should be placed near the input terminals or connectors, the device will divert the transient current immediately before it can be coupled into the nearby traces.
- The path length between the TVS device and the protected line should be minimized.
- All conductive loops including power and ground loops should be minimized.
- The transient current return path to ground should be kept as short as possible to reduce parasitic inductance.
- Ground planes should be used whenever possible. For multilayer PCBs, use ground vias. From IC To Next Connection FIGURE 5 VDSL DRIVER PROTECTION FIGURE 6 CONNECTING A DIFFERENTIAL SIGNAL
Only One Name Means ProTek’Tion™ www.protekdevices.com 05438.R2 6/15Page 6 SOT-23-6 PACKAGE INFORMATION OUTLINE DIMENSIONS DIM MILLIMETERS INCHES MIN MAX MIN MAX A 2.80 3.05 0.110 0.120 B 1.50 1.75 0.059 0.070 C 0.90 1.30 0.036 0.051 D 0.30 0.40 0.012 0.016 E 0.85 1.05 0.033 0.040 G 0.90 1.45 0.036 0.057 J 0.09 0.20 0.003 0.008 K 2.60 3.00 0.102 0.118 L 0.0 0.15 0.0 0.006 M 0.30 0.60 0.012 0.024 NOTES 1. Controlling dimension: inches. 2. Dimensioning and tolerances per ANSI Y14.5M, 1985. 3. Dimensions are exclusive of mold flash and metal burrs. PAD LAYOUT DIMENSIONS DIM MILLIMETERS INCHES NOMINAL NOMINAL A 0.70 0.028 B 1.90 0.074 C 0.95 0.037 D 2.40 0.094 E 1.00 0.039 NOTES 1. Controlling dimension: inches. D E K 456 321 A G C L B M 0° - 8° J D C B A E
Only One Name Means ProTek’Tion™ www.protekdevices.com 05438.R2 6/15Page 7 REEL DIA. TAPE WIDTH A0 B0 K0 D E F W P0 P2 P tmax NOTES 1. Dimensions are in millimeters. 2. Surface mount product is taped and reeled in accordance with EIA-481. 3. Suffix - T7 = 7” Reel - 3,000 pieces per 8mm tape. 4. Marking on Part - marking code (see page 2) and pin one defined by dot on package.
ORDERING INFORMATION
BASE PART NUMBER LEADFREE SUFFIX TAPE SUFFIX QTY/REEL REEL SIZE TUBE QTY DSL03-24 N/A -T7 3,000 7” n/a This device is only available in a Lead-Free configuration. Top Cover Tape D
10 Pitches Cumulative
Tolerance on Tape. ± 0.2 P E F W User Direction of Feed Pin 1 t
Only One Name Means ProTek’Tion™ www.protekdevices.com 05438.R2 6/15Page 8 COPYRIGHT © ProTek Devices 2014 - This literature is subject to all applicable copyright laws and is not for resale in any manner. SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice. DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance. ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ProTek assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability without limitation special, consequential or incidental damages. LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without written consent from the factory. CONTACT US Corporate Headquarters
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Tel: +65-67488312 Fax: +65-67488313 Web www.protekdevices.com COMPANY PROFILE In business more than 20 years, ProTek Devices™ is a privately held semiconductor company. The company offers a product line of overvoltage pro- tection and overcurrent protection components. These include transient voltage suppressor array (TVS arrays) avalanche breakdown diode, steering diode TVS array and electronics SMD chip fuses. These components deliver circuit protection in electronic systems from numerous overvoltage and overcurrent events. They include lightning; electrostatic discharge (ESD); nuclear electromagnetic pulses (NEMP); inductive switching; and electro- magnetic interference (EMI) / radio frequency interference (RFI). ProTek Devices also offers high performance interface and linear products. They include analog switches; multiplexers; LED drivers; LED wafer die for ESD protection; audio control ICs; RF and related high frequency products.