DSF0.5A JUXING | Alldatasheet
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Technical content
Features
Ideal for automated placement Glass passivated chip junctions Low forward voltage drop Low leakage current High forward surge capability High temperature soldering： 260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC Mechanical Date Case: JEDEC SOD-123FL molded plastic body over glass passivated chip Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D Polarity: Laser band denotes cathode end Weight: 0.017gram Maximum Ratings & Thermal Characteristics & Electrical Characteristics A = 25 °C unless otherwise noted) V RRM 50 100 150 200 300 400 V V RMS 35 70 105 140 210 280 V V DC 50 100 150 200 300 400 V I F(AV) A I FSM A V F V I R μA t rr nS R θJA ℃/W T J , T STG I FSM 15 A I R 5 μA I F(AV) 0.5 A V RRM
50 V to 400 V
0.95V，1.25V T j max. 150 °C DSF- V F Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage 5.0 100 Maximum average forward rectified current 0.5 Peak forward surge current 8.3 ms single half sine- wave superimposed on rated load 15 Operating junction and storage temperature range –55 to +150 0.95 1.25 35Maximum reverse recovery time at I F = 0.5 A , I R = 1.0 A , I rr = 0.25 A Typical thermal resistance Maximum instantaneous forward voltage at 0.5A Maximum DC reverse current T A = 25 ℃ at Rated DC blocking voltage T A = 100℃ 150 http://www.trr-jx.com
DSF0.5A~DSF0.5G Surface Mount Superfast Rectifiers Characteristic Curves A =25 ℃ unless otherwise noted) http://www.trr-jx.com