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Technical content

Features

 Low RMS Phase Jitter: <1 ps (typ)  High Stability: ±25ppm, ±50ppm  Wide Temperature Range o Ext. commercial: -20°C to 70°C o Industrial: -40°C to 85°C  High Supply Noise Rejection: -50 dBc  Four format configurable outputs: o LVPECL, LVDS, HCSL, LVCMOS  Available Pin-Selectable frequency table o 1 pin per bank for 2 frequency sets  Wide Freq. Range: o 2.3 MHz – 460 MHz  20 QFN Footprint (5mm x 3.2mm)  Excellent Shock & Vibration Immunity o Qualified to MIL-STD-883  High Reliability o 20x better MTF than quartz based devices  Wide Supply Range of 2.25 to 3.6 V  Lead Free & RoHS Compliant  AEC-Q100 Automotive Qualified

Applications

 Communications and Networks  Ethernet o 1G, 10GBASE-T/KR/LR/SR, and FCoE  Storage Area Networks o SATA, SAS, Fibre Channel  Passive Optical Networks o EPON, 10G-EPON, GPON, 10G-PON  HD/SD/SDI Video & Surveillance  Automotive  Media and Video  Embedded and Industrial

DSC400 Configurable Four Output, Low Jitter Crystal-less™ Clock Generator Pin Description Pin No. Pin Name Pin Type Description

1 OE1 I Output Enable for Bank1 (CLK0 and CLK3); active high – See Table 1

2 NC NA Leave unconnected or connect to ground

3 VSS Power Ground

4 VSS Power Ground

5 CLK0- O Complement output of differential pair 0 (off when in LVCMOS format)

6 CLK0+ O True output of differential pair 0 or LVCMOS output 0

7 CLK1- O Complement output of differential pair 1 (off when in LVCMOS format)

8 CLK1+ O True output of differential pair 1 or LVCMOS output 1

9 VDD2 Power Power Supply for Bank2 (CLK1 and CLK2)

10 FSB2 I Input for selecting pre-configured frequencies on Bank2 (CLK1 and CLK2)

11 OE2 I Output Enable for Bank2 (CLK1 and CLK2); active high – See Table 1

12 NC NA Leave unconnected or connect to ground

13 VSS Power Ground

14 VSS Power Ground

15 CLK2- O Complement output of differential pair 2 (off when in LVCMOS format)

CLK2+ O True output of differential pair 2 or LVCMOS output 2

17 CLK3- O Complement output of differential pair 3 (off when in LVCMOS format)

18 CLK3+ O True output of differential pair 3 or LVCMOS output 3

19 VDD1 Power Power Supply for Bank1 (CLK0 and CLK3)

20 FSB1 I Input for selecting pre-configured frequencies on Bank1 (CLK0 and CLK3)

20 QFN 5.0 × 3.2mm

DSC400 Configurable Four Output, Low Jitter Crystal-less™ Clock Generator Operational Description The DSC400 is a crystal-less™ clock generator. Unlike older clock g enerators in the industry, it does not require an external crystal to operate; it relies on the integrated MEMS resonator that interfaces with internal PLLs. This technology enhances performance and r eliability by allowing tighter frequency stability over a far wider temperature range. In addition, the higher resistance to shock and vibration decreases the aging rate to allow for much improved product life in the system. Inputs There are 4 input signals in the device. Each has an internal (40kΩ) pull up to default the selection to a high (1). Inputs can be controlled through hardware strapping method with a resistor to ground to assert the input low (0). Inputs may also be controlled by other components’ GPIOs In case more than one frequency set is desired, FSB1 and FSB2 are used for independently selecting one of two sets per bank. FSB1 selects the pre-configured set on Bank1 (CLK0 and CLK3) and FSB2 selects the pre-configured set on Bank2 (CLK1 and CLK2), as shown in table 2. If there is a requirement to disable outputs, the inputs OE1 and OE2 are used in conjunction to disable the banks of outputs. Outputs are disabled in tristate (Hi-Z) mode, see Table 1 below. Table 1: Output Enable (OE) Selection Table OE1 OE2 Bank1 (CLK0 & CLK3) Bank2 (CLK1 & CLK2) 0 0 Hi-Z Hi-Z 0 1 Hi-Z Running 1 0 Running Hi-Z 1 1 Running Running Outputs The four outputs are grouped into two banks. Each bank is supplied by an independent VDD to allow for optimized noise isolation between the two banks. Each bank provides two synchronous outputs generated by a common PLL:  Bank1 is composed of outputs CLK0 and CLK3  Bank2 is composed of outputs CLK1 and CLK2 Each output maybe pre -configured independently to be one of the following formats: LVCMOS, LVDS, LVPECL or HCSL. In case the output is configured to be the single ended LVCMOS, the frequency is generated on the true output (C LKx+) and the complement output ( CLKx-) is shut off in a low state. Frequencies can be chosen from 2.3MHz to 460MHz for differential outputs and from 2.3MHz to 170MHz on LVCMOS outputs. Power VDD1 and VDD2 supply the power to banks 1 and 2 respectively. Each VDD may have different supply voltage from the other as long as it is within the 2.25V to 3.6V range. Each VDD pin should have a 0.1µF capacitor to filter high frequency noise. VSS is common to the entire device.

DSC400 Configurable Four Output, Low Jitter Crystal-less™ Clock Generator

Ordering Information

(Example shown in red font) Factory configuration code assignment of Qxxxx The DSC400 is meant for customers to define their own frequency requirements at the four available outputs. The Qxxxx number identifies these specific customer requirements and is assigned by the factory. Table 2: Example of how FSB1 and FSB2 are applied and the Qxxxx code assignment Bank1 Outputs FSB1 Qxxxx number 1 (default) 0 Q0001 CLK0 125 MHz 150 MHz CLK3 50 MHz 25 MHz Bank2 Outputs FSB2 1 (default) 0 CLK1 156.25 MHz 100 MHz CLK2 156.25 MHz 100 MHz DSC400- CLK2 Output Format 1: LVCMOS 2: LVPECL 3: LVDS 4: HCSL CLK3 Output Format 0: off 1: LVCMOS 2: LVPECL 3: LVDS 4: HCSL CLK1 Output Format 0: off 1: LVCMOS 2: LVPECL 3: LVDS 4: HCSL CLK0 Output Format 1: LVCMOS 2: LVPECL 3: LVDS 4: HCSL Packing T: Tape & Reel Q Package K: 20 QFN Temp Range E: -20ºC to 70ºC I: -40ºC to 85º Stability 1: ±50ppm 2: ±25ppm x T x x K T E T x Frequency Code Qxxxx is assigned by factory; see Table2

DSC400 Configurable Four Output, Low Jitter Crystal-less™ Clock Generator Absolute Maximum Ratings Item Min Max Unit Condition Supply Voltage -0.3 +4.0 V Input Voltage -0.3 VDD+0.3 V Junction Temp - +150 °C Storage Temp -55 +150 °C Soldering Temp - +260 °C 40sec max. ESD HBM MM CDM 4000 400 1500 V Note: 1000+ years of data retention on internal memory Specifications (Unless specified otherwise: Ta =25° C, VDD = 3.3V) Notes: 1. VDD pins should be filtered with a 0.1µF capacitor connected between VDD and VSS. 2. The addition of IDDcore and IDDio provides total current consumption of the device 3. tsu is time to 100 ppm stable output frequency after VDD is applied and outputs are enabled. 4. Output Waveform figures below the parameters. See Output Waveform section Parameter Symbol Condition Min. Typ. Max. Unit Supply Voltage1 VDD 2.25 3.6 V Supply Current – Core2 IDDcore OE(1:2) = 0 All outputs are disabled 40 44 mA Frequency Stability Δf All temp and VDD ranges ±25 ±50 ppm Aging – first year ΔfY1 1 year @25°C ±5 ppm Aging – after first year ΔfY2 + Year 2 and beyond @25°C <±1/yr ppm Startup Time3 tSU T=25°C 5 ms Input Logic Levels Input logic high Input logic low VIH VIL 0.75xVDD 0.25xVDD V Output Disable Time4 tDA OE(1:2) transition from 1 to 0 5 ns Output Enable Time4 tEN OE(1:2) transition from 0 to 1 20 ns Pull-Up Resistor RPU All input pins have an internal pull- up 40 kΩ

DSC400 Configurable Four Output, Low Jitter Crystal-less™ Clock Generator Notes: 5. Period Jitter includes crosstalk from adjacent output 6. LVPECL applicable to ext. commercial temperature only LVPECL: Typical Termination Scheme LVPECL Outputs6 Output Logic Levels Output logic high Output logic low VOH VOL RL=50Ω VDD-1.08 VDD-1.55 V Pk to Pk Output Swing Single-Ended 800 mV Output Transition time4 Rise Time Fall Time tR tF 20% to 80% RL=50Ω 250 ps Frequency f0 Single Frequency 2.3 460 MHz Output Duty Cycle SYM Differential 48 52 % Supply Current – IO2 IDDio Per output at 125MHz 35 38 mA Period Jitter5 JPER CLK(0:3) = 156.25 MHz 2.5 psRMS Integrated Phase Noise JPH 200kHz to 20MHz @156.25MHz 100kHz to 20MHz @156.25MHz 12kHz to 20MHz @156.25MHz 0.25 0.38 1.7 psRMS

DSC400 Configurable Four Output, Low Jitter Crystal-less™ Clock Generator LVDS: Typical Termination Scheme If the 100Ω clamping resistor does not exist inside the receiving device, it should be added externally on the PCB and placed as close as possible to the receiver. LVDS Outputs Output offset Voltage VOS R=100Ω Differential 1.125 1.4 V Delta Offset Voltage ∆VOS 50 mV Pk to Pk Output Swing VPP Single-Ended 350 mV Output Transition time3 Rise Time Fall Time tR tF 20% to 80% RL=50Ω, CL= 2pF 200 ps Frequency f0 Single Frequency 2.3 460 MHz Output Duty Cycle SYM Differential 48 52 % Supply Current – IO2 IDDio Per output at 125MHz 9 12 mA Period Jitter JPER 2.5 psRMS Integrated Phase Noise JPH 200kHz to 20MHz @156.25MHz 100kHz to 20MHz @156.25MHz 12kHz to 20MHz @156.25MHz 0.28 0.4 1.7 psRMS

DSC400 Configurable Four Output, Low Jitter Crystal-less™ Clock Generator HCSL: Typical Termination Scheme RS is a series resistor implemented to match the trace impedance. Depending on the board layout, the value may range from 0 to 30Ω HCSL Outputs Output Logic Levels Output logic high Output logic low VOH VOL RL=50Ω 0.725 0.1 V Pk to Pk Output Swing Single-Ended 750 mV Output Transition time3 Rise Time Fall Time tR tF 20% to 80% RL=50Ω, CL= 2pF 200 400 ps Frequency f0 Single Frequency 2.3 460 MHz Output Duty Cycle SYM Differential 48 52 % Supply Current – IO2 IDDio Per output at 125MHz 20 22 mA Period Jitter JPER 2.5 psRMS Integrated Phase Noise JPH 200kHz to 20MHz @156.25MHz 100kHz to 20MHz @156.25MHz 12kHz to 20MHz @156.25MHz 0.25 0.37 1.7 psRMS

DSC400 Configurable Four Output, Low Jitter Crystal-less™ Clock Generator LVCMOS: Typical Termination Scheme RS is a series resistor implemented to match the trace impedance to that of the clock output. Depending on the board layout, the value may range from 0 to 27Ω LVCMOS Outputs Output Logic Levels Output logic high Output logic low VOH VOL I=±6mA 0.9xVDD 0.1xVDD V Output Transition time3 Rise Time Fall Time tR tF 20% to 80% CL=15pF 1.1 1.3 ns Frequency f0 All temp range except Auto Auto temp range 2.3 170

100 MHz

Output Duty Cycle SYM 45 55 % Supply Current – IO2 IDDio Per output at 125MHz, CL=15pF 11 14 mA Period Jitter JPER CLK(0:3) =125MHz 3 psRMS Integrated Phase Noise JPH 200kHz to 20MHz @ 125MHz 100kHz to 20MHz @ 125MHz 12kHz to 20MHz @ 125MHz 0.3 0.38 1.7 psRMS

DSC400 Configurable Four Output, Low Jitter Crystal-less™ Clock Generator Connection Diagram: The connection Diagram below includes recommended capacitors to be placed on each VDD for noise filtering.

DSC400 Configurable Four Output, Low Jitter Crystal-less™ Clock Generator Output Waveform  Differential Output (LVDS, LVPECL, HCSL)  LVCMOS Output

DSC400 Configurable Four Output, Low Jitter Crystal-less™ Clock Generator Solder Reflow Profile MSL 1 @ 260°C refer to JSTD-020C Ramp-up rate (200°C to peak temp) 3°C/sec max. Preheat time 150°C to 200°C 60-180 sec Time maintained above 217°C 60-150 sec Peak temperature 255-260°C Time within 5°C of actual peak 20-40 sec Ramp-down rate 6°C/sec max. Time 25°C to peak temperature 8 min max.

DSC400 Configurable Four Output, Low Jitter Crystal-less™ Clock Generator Package Dimensions 20 QFN, 5.0mm x 3.2 mm

DSC400 Configurable Four Output, Low Jitter Crystal-less™ Clock Generator Recommended Solder Pad Layout units: mm[inches] Connect the center pad to ground plane for best thermal performance

DSC400 Configurable Four Output, Low Jitter Crystal-less™ Clock Generator Disclaimer: Micrel makes no representations or warranties with respect to the accuracy or completeness of the information furnished in this data sheet. This information is not intended as a warranty and Micrel does not assume responsibility for its use. Micrel reserves the right to change circuitry, specifications and descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Micrel’s terms and conditions of sale for such products, Micrel assumes no liability whatsoever, an d Micrel disclaims any express or implied warranty relating to the sale and/or use of Micrel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyrig ht or other intellectual property right. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where mal function of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and w hose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or sale of Mic rel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or s ale. MICREL, Inc. ● 2180 Fortune Drive, San Jose, California 95131 ● USA Phone: +1 (408) 944-0800 ● Fax: +1 (408) 474-1000 ● Email: hbwhelp@micrel.com ● www.micrel.com