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Technical content
Features
- Frequency Range: 1 MHz to 150 MHz
- Exceptional Stability over Temperature - ±10 ppm, ±20 ppm, ±25 ppm, ±50 ppm
- Operating Voltage - 1.7 to 3.6V
- Operating Temperature Range - Ext. Industrial –40° C to 105°C - Industrial –40°C to 85°C - Commercial –20° C to 70°C
- Low Operating and Standby Current -6 mA Operating (1 MHz) -1 5 µA Standby (Max.)
- Ultra Miniature Footprint -2 . 5 mm x 2.0 mm x 0.85 mm -3 . 2 mm x 2.5 mm x 0.85 mm -5 . 0 mm x 3.2 mm x 0.85 mm -7 . 0 mm x 5.0 mm x 0.85 mm
- MIL-STD 883 Shock and Vibration Resistant
- Pb Free, RoHS, Reach SVHC Compliant
- AEC-Q100 Reliability Qualified
Applications
- Mobile Applications
- Consumer Electronics
- Portable Electronics
- DVR, CCTV, Surveillance Cameras
- Low Profile Applications
- Industrial Applications Benefits
- Pin for Pin “Drop-In” Replacement for Industry Standard Oscillators
- Semiconductor Level Reliability, Significantly Hig her than Quartz
- Short Mass Production Lead Times
- Longer Battery Life/Reduced Power Consumption
- Compact Plastic Package
- Cost Effective General Description The DSC1001/3/4 is a s ilicon MEMS based CMOS family of oscillators that offers excellent jitter and stability performance over a wide range of supply voltages and temperatures. The device operates from 1 MHz to 150 MHz with supply voltages between 1.8 to 3.3 volts and temperature ranges up to –40°C to 105°C. The DSC1001/3/4 incorporat e an al l silicon resonator that is extremely robust and nearly immune to stress related fractures, common to crystal based oscillators. Without sacrificing the performance and stability required of today’s system s, a crystal-less design allows for a higher level of reliability, making the DSC1001/3/4 ideal for rugged, industrial, and portable applications where stress, shock, and vibration can damage quartz crystal based systems. Available in industry standard packages, the DSC10 01/3/4 can be “dropped-in” to the same PCB footprint as standard crystal oscillators. The DSC1003 and DSC1004 have the same function ality and performance as the DSC1001, but feature higher out put drives of 25 pF and 40 pF, respectively Package Types DSC1001/3/4 CDFN/DFN (Top View) STANDBY# 1 GND VDD OUT 1.8V-3.3V Low-Power Precision CMOS Oscillators
DS20005529B-page 2 2017 Microchip Technology Inc. Block Diagram PFD VCO FRAC-N PLL OUTPUTVDD GND (PIN1) STANDBY# PFD VCO FRAC-N PFD VCO PLL RESONATOR VDD GND (PIN1)
2017 Microchip Technology Inc. DS20005529B-page 3 DSC1001/3/4
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings † Recommended Operating Conditions † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this s pecification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: DC CHARACTERISTICS Electrical Characteristics: VDD = 1.8 to 3.3V; TA = +85°C unless otherwise specified. Parameters Sym. Min. Typ. Max. Units Conditions Frequency F0 1 — 150 MHz Single Frequency Frequency Tolerance ∆f — — ±10 ppm Includes frequency variations due to initial tolerance, temperature and power supply voltage — — ±20 — — ±25 — — ±50 Aging ∆f — — ±5 ppm 1 year @ +25°C Supply Current, Standby IDD — — 15 µA T = +25°C Output Startup Time (Note 1) tSU — 1.0 1.3 ms T = +25°C Output Disable Time tDA — 20 100 ns — Output Duty Cycle SYM 45 — 55 % — Input Logic Level High VIH 0.75 x VDD — — V — Input Logic Level Low VIL — — 0.25 x VDD V — VDD = 1.8V Supply Current, No Load IDD — 6.0 6.3 mA
1 MHz
CL = 0 pF, RL = ∞, T = +25°C — 6.5 7.1 27 MHz — 7.2 8.5 70 MHz — 8.3 11.9 150 MHz Output Logic Level High VOH 0.8 x VDD — — V –6 mA, DSC1004, CL = 40 pF 0.8 x VDD — — –6 mA, DSC1003, CL = 25 pF 0.8 x VDD — — –4 mA, DSC1001, CL = 15 pF Output Logic Level Low VOL — — 0.2 x VDD V 6 mA, DSC1004, CL = 40 pF — — 0.2 x VDD 6 mA, DSC1003, CL = 25 pF — — 0.2 x VDD 4 mA, DSC1001, CL = 15 pF Note 1: tSU is time to stable output frequency after VDD is applied. tSU and tEN (after EN is asserted) are identical values. 2: Measured over 50k clock cycles.
DS20005529B-page 4 2017 Microchip Technology Inc. Output Transition Rise Time tR — 1.4 3.0 ns DSC1001, CL = 15 pF T = +25°C, 20% to 80%— 1.5 3.0 DSC1003, CL = 25 pF — 1.8 3.0 DSC1004, C2 = 40 pF Output Transition Fall Time tF — 1.0 3.0 ns DSC1001, CL = 15 pF T = +25°C, 20% to 80%— 1.1 3.0 DSC1003, CL = 25 pF — 1.2 3.0 DSC1004, C2 = 40 pF Jitter, Max. Cycle-to-Cycle JCC — 60 — ps f = 100 MHz (Note 2) Period Jitter JP — 10 15 psRMS f = 100 MHz (Note 2) VDD = 2.5V Supply Current, No Load IDD — 6.0 6.4 mA CL = 0 pF, RL = ∞, T = +25°C — 6.7 7.5 27 MHz — 7.7 9.4 70 MHz — 9.6 13.9 150 MHz Output Logic Level High VOH 0.9 x VDD — — V –6 mA, DSC1004, CL = 40 pF 0.8 x VDD — — –6 mA, DSC1003, CL = 25 pF 0.8 x VDD — — –4 mA, DSC1001, CL = 15 pF Output Logic Level Low VOL — — 0.1 x VDD V 6 mA, DSC1004, CL = 40 pF — — 0.2 x VDD 6 mA, DSC1003, CL = 25 pF — — 0.2 x VDD 4 mA, DSC1001, CL = 15 pF Output Transition Rise Time tR — 1.0 2.0 ns DSC1001, CL = 15 pF T = +25°C, 20% to 80%— 1.1 2.0 DSC1003, CL = 25 pF — 1.2 2.0 DSC1004, C2 = 40 pF Output Transition Fall Time tF — 0.9 2.0 ns DSC1001, CL = 15 pF T = +25°C, 20% to 80%— 1.0 2.0 DSC1003, CL = 25 pF — 1.1 2.0 DSC1004, C2 = 40 pF TABLE 1-1: DC CHARACTERISTICS (CONTINUED) Electrical Characteristics: VDD = 1.8 to 3.3V; TA = +85°C unless otherwise specified. Parameters Sym. Min. Typ. Max. Units Conditions Note 1: tSU is time to stable output frequency after VDD is applied. tSU and tEN (after EN is asserted) are identical values. 2: Measured over 50k clock cycles.
2017 Microchip Technology Inc. DS20005529B-page 5 DSC1001/3/4 Jitter, Max. Cycle-to-Cycle JCC — 50 — ps f = 100 MHz (Note 2) Period Jitter JP — 5 10 psRMS f = 100 MHz (Note 2) VDD = 3.3V Supply Current, No Load IDD — 6.0 6.5 mA CL = 0 pF, RL = ∞, T = +25°C — 6.8 8.0 27 MHz — 8.2 10.5 70 MHz — 10.8 16.6 150 MHz Output Logic Level High VOH 0.9 x VDD — — V –8 mA, DSC1004, CL = 40 pF 0.9 x VDD — — –6 mA, DSC1003, CL = 25 pF 0.8 x VDD — — –4 mA, DSC1001, CL = 15 pF Output Logic Level Low VOL — — 0.1 x VDD V 8 mA, DSC1004, CL = 40 pF — — 0.1 x VDD 6 mA, DSC1003, CL = 25 pF — — 0.2 x VDD 4 mA, DSC1001, CL = 15 pF Output Transition Rise Time tR — 1.0 2.0 ns DSC1001, CL = 15 pF T = +25°C, 20% to 80%— 1.1 2.0 DSC1003, CL = 25 pF — 1.2 2.0 DSC1004, C2 = 40 pF Output Transition Fall Time tF — 0.9 2.0 ns DSC1001, CL = 15 pF T = +25°C, 20% to 80%— 1.0 2.0 DSC1003, CL = 25 pF — 1.1 2.0 DSC1004, C2 = 40 pF Jitter, Max. Cycle-to-Cycle JCC — 50 — ps f = 100 MHz (Note 2) Period Jitter JP — 5 10 psRMS f = 100 MHz (Note 2) TABLE 1-1: DC CHARACTERISTICS (CONTINUED) Electrical Characteristics: VDD = 1.8 to 3.3V; TA = +85°C unless otherwise specified. Parameters Sym. Min. Typ. Max. Units Conditions Note 1: tSU is time to stable output frequency after VDD is applied. tSU and tEN (after EN is asserted) are identical values. 2: Measured over 50k clock cycles.
TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Operating Temperature Range (T) TA –40 — +105 °C Ordering Option L –40 — +85 °C Ordering Option I –20 — +70 °C Ordering Option E Junction Operating Temperature TJ — — +150 °C — Storage Temperature Range TA –55 — +150 °C — Soldering Temperature Range TS — — +260 °C 40 sec. max Note 1: Th e maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability. DSC1001/3/4 DS20005529B-page 6 2017 Microchip Technology Inc.
2017 Microchip Technology Inc. DS20005529B-page 7 DSC1001/3/4
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1 and Table 2-2. TABLE 2-1: CDFN PACKAGE PIN FUNCTION TABLE Pin Number Symbol Description 1 STANDBY# Standby input (Section 4.1 “Standby Function”)
2 GND Power supply ground
3 OUT Oscillator output
4 VDD Positive power supply
TABLE 2-2: DFN PACKAGE PIN FUNCTION TABLE Pin Number Symbol Description 1 STANDBY# Standby input (Section 4.1 “Standby Function”) Center Pad NC Tie to GND or do not connect.
DS20005529B-page 8 2017 Microchip Technology Inc.
3.0 NOMINAL PERFORMAN CE CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or ta bles, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. FIGURE 3-1: Supply Current. FIGURE 3-2: Rise Time. FIGURE 3-3: Rise Time. FIGURE 3-4: Supply Current. FIGURE 3-5: Fall Time. FIGURE 3-6: Fall Time.
2017 Microchip Technology Inc. DS20005529B-page 9 DSC1001/3/4
4.0 OUTPUT WAVEFORM
STANDBY# tEN tDA tFtR VIH VOH VOL FIGURE 4-1: Output Waveform.
4.1 Standby Function
Standby# (Pin 1) Output (Pin 3) High Level Output ON Open (no connect) Output ON Low Level High Impedance
DS20005529B-page 10 2017 Microchip Technology Inc.
5.0 TEST CIRCUIT
0.01μF VDD 15pF IDD *VSD 1 2 *VSD = Standby# Logic Level Input FIGURE 5-1: DSC1001/3/4 Test Circuit.
2017 Microchip Technology Inc. DS20005529B-page 11 DSC1001/3/4
6.0 BOARD LAYOUT (RECOMMENDED)
FIGURE 6-1: Recommended Board Layout for DSC1001/3/4.
DS20005529B-page 12 2017 Microchip Technology Inc.
7.0 SOLDER REFLOW PROFILE
ReŇow Cool Time Temperature (°C) 3C/Sec Max. 6C/Sec Max. 200°C 217°C 150°C 25°C 260°C 3C/Sec Max. 60-150 Sec 20-40 Sec 60-180 Sec 8 min max Pre heat ReŇow Cool Time Temperature (°C) 3C/Sec Max. 6C/Sec Max. 200°C 217°C 150°C 25°C 260°C 60-150 Sec 20-40 Sec 60-180 Sec 8 min max Pre heat ReŇow Cool Time Temperature (°C) 3C/Sec Max. 6C/Sec Max. 200°C 217°C 150°C 25°C 260°C 3C/Sec Max. FIGURE 7-1: Solder Reflow Profile. MSL 1 @ 260°C refer to JSTD-020C Ramp-Up Rate (200°C to Peak Temp) 3°C/sec. max. Preheat Time 150°C to 200°C 60 to 180 sec. Time maintained above 217°C 60 to 150 sec. Peak Temperature 255°C to 260°C Time within 5°C of Actual Peak 20 to 40 sec. Ramp-Down Rate 6°C/sec. max. Time 25°C to Peak Temperature 8 minutes max.
2017 Microchip Technology Inc. DS20005529B-page 13 DSC1001/3/4
8.0 PACKAGING INFORMATION
8.1 Package Marking Information
Example4-Lead CDFN/DFN* XXXXXX 0SSS DCPYYWW 0400000 0603 DCP1121 Legend: XX...X Product code, customer-specific information, or frequency in MHz without printed decimal point Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC ® designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package.
- , ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part numbe r cannot be marked on one line, it will be carried over to the next line, t hus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar (⎯) symbol may not be to scale.
DS20005529B-page 14 2017 Microchip Technology Inc. 4-Lead DFN 7.0 mm x 5.0 mm Package Outline & Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.
2017 Microchip Technology Inc. DS20005529B-page 15 DSC1001/3/4 4-Lead CDFN 5.0 mm x 3.2 mm Package Outline & Recommended Land Pattern
DS20005529B-page 16 2017 Microchip Technology Inc. 4-Lead CDFN 3.2 mm x 2.5 mm Package Outline & Recommended Land Pattern
2017 Microchip Technology Inc. DS20005529B-page 17 DSC1001/3/4 4-Lead CDFN 2.5 mm x 2.0 mm Package Outline & Recommended Land Pattern
DS20005529B-page 18 2017 Microchip Technology Inc. NOTES:
2017 Microchip Technology Inc. DS20005529B-page 19 DSC1001/3/4 APPENDIX A: REVISION HISTORY Revision A (September 2017)
- Converted Micrel data sheet DSC1001 to Micro - chip format data sheet DS20005529A.
- Minor text changes throughout.
- Added Table 2-2 for DFN package.
- Combined Micrel data sheet DSC1003 and DSC1004 into this data sheet. - Updated Section 1.0 “Electrical Character- istics” to reflect this change. - Updated General Description and Features to reflect this change. Revision B (November 2017)
- Updated V OH and VOL values in Table 1-1.
DS20005529B-page 20 2017 Microchip Technology Inc. NOTES:
2017 Microchip Technology Inc. DS20005529B-page 21 DSC1001/3/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. Examples: a) DSC1001AE1-010.0000T: 1.8V - 3.3V Low-Power Pre- cision CMOS Oscillator, 4- Lead 7.0 mm x 5.0 mm DFN, Ext. Commercial Tem- perature Range, ±50 ppm,
10 MHz Output Fre-
quency, 1,000/Reel b) DSC1003BL2-030.0000: 1.8V - 3.3V Low-Power Pre- cision CMOS Oscillator, 4- Lead 5.0 mm x 3.2 mm CDFN, Ext. Industrial Tem- perature Range, ±25 ppm,
30 MHz Output Fre-
quency, 110/Tube c) DSC1001DE5-150.0000: 1.8V - 3.3V Low-Power Pre- cision CMOS Oscillator, 4- Lead 2.5 mm x 2.0 mm CDFN, Ext. Commercial Temperature Range, ±10 ppm,
150 MHz Output
Frequency, 110/Tube d) DSC1004AI3-075.0000T: 1.8V - 3.3V Low-Power Precision CMOS Oscilla- tor, 4-Lead 7.0 mm x 5.0 mm DFN, Industrial Temperature Range, ±20 ppm,
75 MHz
Output Frequency, 1,000/Reel PART NO. X X PackageStabilityDevice Device: DSC1001/3/4: 1.8V - 3.3V Low-Power Precision CMOS Oscillator Package: A = 4-Lead 7.0 mm x 5.0 mm DFN B = 4-Lead 5.0 mm x 3.2 mm CDFN C = 4-Lead 3.2 mm x 2.5 mm CDFN D = 4-Lead 2.5 mm x 2.0 mm CDFN Temperature Range: E = –20 C to +70C (Extended Commercial) I = –40 C to +85C (Industrial) L = –40 C to +105C (Extended Industrial) Stability: 1 = ±50ppm 2 = ±25ppm 3= ± 2 0 p p m 5= ± 1 0 p p m Frequency: xxx.xxxx = 1 MHz to 150 MHz (user-defined) Packing Option: <blank>= 110/Tube T = 1,000/Reel X Package X Temperature Range -XXX.XXXX Frequency Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option.
DS20005529B-page 22 2017 Microchip Technology Inc. NOTES:
2017 Microchip Technology Inc. DS20005529B-page 23 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application me ets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or ot herwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP , Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2017, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-2389-8 Note the following details of the code protection feature on Microchip devices:
- Microchip products meet the specification cont ained in their particular Microchip Data Sheet.
- Microchip believes that its family of pr oducts is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.
- There are dishonest and possibly illegal meth ods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
- Microchip is willing to work with the customer who is concerned about the integrity of their code.
- Neither Microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC ® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==
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