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Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 28
Technical content
Features
- Automotive AEC-Q100 Qualified
- Wide Frequency Range: 2.3 MHz to 460 MHz VDS)
- Low RMS Phase Jitter: <1 ps (typ.)
- High Stability: ±20 ppm, ±25 ppm, ±50 ppm
- Wide Temperature Range: - Automotive Grade 1: –40°C to +125°C - Automotive Grade 2: –40°C to +105°C - Automotive Grade 3: –40°C to +85°C
- High Supply Noise Rejection: –50 dBc
- Small Industry Standard Footprints - 2.5 mm x 2.0 mm (VDFN) - 3.2 mm x 2.5 mm (VDFN & Wettable Flank) - 5.0 mm x 3.2 mm (CDFN)
- Excellent Shock and Vibration Immunity - Qualified to MIL-STD-883
- High Reliability - 20x Better MTBF than Quartz Oscillators
- Low Current Consumption
- Supply Range of 2.25 to 3.63V
- Standby and Output Enable Function
- Lead-Free and RoHS Compliant
Applications
- Automotive Infotainment
- Automotive ADAS
- In-Vehicle Networking
- Autonomous Driving General Description The DSA1103 and DSA1123 series of high performance oscillators utilize a proven silicon MEMS technology to provide excellent jitter and stability over a wide range of supply voltages and temperatures. By eliminating the need for quartz or SAW technology, MEMS oscillators significantly enhance reliability and accelerate product development, while meeting stringent clock performance criteria for a variety of automotive applications like in-vehicle networking and autonomous driving. DSA1103 has a standby feature that allows it to completely power-down when pin 1 is pulled low. For DSA1123, only the outputs are disabled when pin 1 is low. Both oscillators are available in industry standard packages, including the small 2.5 mm x 2.0 mm, and are drop-in replacements for standard 6-pin LVDS crystal oscillators. Functional Block Diagram DIGITAL CONTROL SUPPLY REGULATION PLL MEMS RESONATOR TEMP SENSOR + CONTROL & COMPENSATION OUTPUT DIV Pin 1 OE/STDBY/FS Pin 2 NC Pin 3 GND Pin 6 VDD Pin 5 CLK– Pin 4 CLK+ Low-Jitter Precision LVDS Oscillator for Automotive
DS20005891A-page 2 2019 Microchip Technology Inc.
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings † † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intend ed. Exposure to maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VDD = 3.3V; TA = +25°C unless otherwise specified. Parameter Symbol Min. Typ. Max. Units Conditions Supply Voltage (Note 1) VDD 2.25 — 3.6 V — Supply Current IDD — — 0.095 mA DSA1103, EN pin low. Output is disabled and device is in standby — 20 22 DSA1123, EN pin low, output is disabled Frequency Stability Δf — — ±10 ppm Grade 2 and Grade 3 only — — ±20 Includes frequency variations due to initial tolerance, temp. and power supply voltage. — — ±25 — — ±50 Aging - First year ΔfY1 — — ±5 ppm One year @ 25°C Aging - After first year ΔfY2 — — <±1 ppm/yr Year two and beyond at +25°C Startup Time (Note 2) tSU — — 5 ms T = +25°C Input Logic Levels VIH 0.75 x VDD — — V Input logic high VIL — — 0.25 x VDD V Input logic low Output Disable Time (Note 3) tDS — — 5 ns — Output Enable Time tEN — — 5 ms DSA1103 20 ns DSA1123 Enable Pull-Up Resistor Note 4) — — 40 — kΩ Internally pulled-up LVDS Output Supply Current IDD — 29 32 mA Output enabled, RL = 100Ω Output Offset Voltage VOS 1.125 — 1.4 V R = 100Ω differential Delta Offset Voltage ΔVOS — — 50 mV — Peak-to-Peak Output Swing VPP — 350 — mV Single-ended Output Logic Level High VOH 0.9 x VDD — — V I = ±6 mAOutput Logic Level Low VOL — — 0.1 x VDD V Output Transition Rise Time Note 3) tR — 200 ps 20% to 80%, RL = 50Ω, CL = 2 pFOutput Transition Fall Time Note 3) tF — — Frequency fO 2.3 — 460 MHz –40°C to +85°C 3.3 — 460 –40°C to +105°C and –40°C to +125°C
2019 Microchip Technology Inc. DS20005891A-page 3 DSA1103/23 Output Duty Cycle SYM 48 — 52 % — Period Jitter JPER — 2.5 — psRMS — Integrated Phase Noise JPH — 0.28 — psRMS 200 kHz to 20 MHz @
156.25 MHz
— 0.4 — 100 kHz to 20 MHz @ 156.25 MHz — 1.7 2 12 kHz to 20 MHz @ 125 MHz Note 1: Pin 6 VDD should be filtered with 0.1 μF capacitor. 2: tSU is time to 100 ppm of output frequency after VDD is applied and outputs are enabled. 3: Output Waveform and Test Circuit figures define the parameters. 4: Output is enabled if pad is floated or not connected. ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: VDD = 3.3V; TA = +25°C unless otherwise specified. Parameter Symbol Min. Typ. Max. Units Conditions
TEMPERATURE SPECIFICATIONS (Note 1) Parameters Symbol Min. Typ. Max. Units Conditions Temperature Ranges Operating Temperature Range (T) TA –40 — +85 °C Ordering Option I TA –40 — +105 °C Ordering Option L TA –40 — +125 °C Ordering Option A Junction Operating Temperature TJ — — +150 °C — Storage Temperature Range TA –40 — +150 °C — Soldering Temperature Range TS — — +260 °C 40 sec. max. Package Thermal Resistance 6-Lead VDFN 5.0 mm x 3.0 mm (B) RθJA — — 26 °C/W 6-Lead VDFN 3.2 mm x 2.5 mm (C) — — 45 — 6-Lead VDFN 2.5 mm x 2.0 mm (D) — — 258 — Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability. DSA1103/23 DS20005891A-page 4 2019 Microchip Technology Inc.
2019 Microchip Technology Inc. DS20005891A-page 5 DSA1103/23
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1. TABLE 2-1: DSA1103/DSA1123 PIN FUNCTION TABLE Pin Number Pin Name Pin Type Description OE I Output Enable (DSA1123) H = Specified frequency output. L = Output is high impedance. STDBY Standby: (DSA1103) H = Specified frequency output. L = Output is high impedance. Device in low power mode; Supply current = I STDBY. 2 NC No Connect Do not connect. 3 GND Power Power supply ground. 4 CLK+ O Clock output.5 CLK– 6 VDD Power Power supply.
DS20005891A-page 6 2019 Microchip Technology Inc.
3.0 NOMINAL PERFORMANCE CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Unless otherwise specified, T = +25°C, V DD = 3.3V. 0.0 0.5 1.0 1.5 2.0 2.5 0 200 400 600 800 1000 Phase Jitter (ps RMS) Low-end of integration BW: x kHz to 20 MHz 156MHz-LVDS 212MHz-LVDS 320MHz-LVDS 410MHz-LVDS FIGURE 3-1: Phase Jitter (Integrated Phase Noise). -80 -70 -60 -50 -40 -30 -20 -10 0.1 1 10 100 1000 10000 Rejection (dBc) Supply Noise Frequency (kHz) 50 mV 100 mV FIGURE 3-2: Power Supply Rejection Ratio.
2019 Microchip Technology Inc. DS20005891A-page 7 DSA1103/23
4.0 OUTPUT WAVEFORM
80% 20% 50% CLK+ 830 mv350 mV FIGURE 4-1: DSA1103/23 Output Waveform.
DS20005891A-page 8 2019 Microchip Technology Inc.
5.0 TYPICAL TERMINATION SCHEME
0.1uF 100 100 FIGURE 5-1: Typical Termination Scheme for DSA1103/23.
2019 Microchip Technology Inc. DS20005891A-page 9 DSA1103/23
6.0 BOARD LAYOUT (RECOMMENDED)
FIGURE 6-1: DSA1103/23 Recommended Board Layout. Note: Ferrite beads in series with the power supply are not recommended, since they can prevent device start-up by limiting start-up current. If a ferrite bead is used, a tantalum bypass capacitor of at least 20 μF at pin 6 is recommended and correct start-up verified.
DS20005891A-page 1 0 2019 Microchip Technology Inc.
7.0 SOLDER REFLOW PROFILE
FIGURE 7-1: Solder Reflow Profile. TABLE 7-1: SOLDER REFLOW MSL 1 @ 260°C Refer to JSTD-020C Ramp-Up Rate (200°C to Peak Temp.) 3°C/sec. max. Preheat Time 150°C to 200°C 60 to 180 sec. Time Maintained above 217°C 60 to 150 sec. Peak Temperature 255°C to 260°C Time within 5°C of Actual Peak 20 to 40 sec. Ramp-Down Rate 6°C/sec. max. Time 25°C to Peak Temperature 8 minutes max.
2019 Microchip Technology Inc. DS20005891A-page 1 1 DSA1103/23
8.0 PACKAGING INFORMATION
8.1 Package Marking Information
Example6-Pin CDFN/VDFN* XXXXXXX 0SSS DCPYYWW 0750000 0421 DCP1723 Legend: XX...X Product code, customer-specific information, or frequency in MHz without printed decimal point Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC ® designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package.
- , ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of a vailable characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar (‾) symbol may not be to scale.
© 2018 Microchip Technology Incorporated BA 0.05 C 0.05 C (DATUM B) (DATUM A) C SEATING PLANE N 2X TOP VIEW SIDE VIEW NOTE 1 0.10 C 0.08 C Microchip Technology Drawing C04-1005 Rev C Sheet 1 of 2 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: 6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN] D E A
0.10 C A B
0.05 C BOTTOM VIEW N 2X b2 4X b1 5X L1 e DSA1103/23 DS20005891A-page 1 2 2019 Microchip Technology Inc.
© 2018 Microchip Technology Incorporated REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Microchip Technology Drawing C04-1005 Rev C Sheet 2 of 2 6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN] Number of Terminals Overall Height Terminal Width Overall Width Terminal Length Pitch Standoff Units Dimension Limits A e E N
0.825 BSC
0.665 0.60 0.80 0.00 0.65 0.765 0.85 0.02
2.00 BSC
0.865 0.70 0.90 0.05 MAX Overall Length D 2.50 BSC Terminal Length L1 0.60 0.70 0.80 Terminal Width b2 0.20 0.25 0.30 2019 Microchip Technology Inc. DS20005891A-page 1 3 DSA1103/23
© 2018 Microchip Technology Incorporated RECOMMENDED LAND PATTERN Dimension Limits Units C Contact Pad Width (X4) Contact Pad Spacing Contact Pad Width (X2) Contact Pitch 0.25 0.65 MILLIMETERS E MAX 1.45 Space Between Contacts (X3) Space Between Contacts (X4) 0.60 0.38 Microchip Technology Drawing C04-3005 Rev C NOM 6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN] 1 2 YContact Pad Length (X6) 0.85 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: C E Y SILK SCREEN DSA1103/23 DS20005891A-page 1 4 2019 Microchip Technology Inc.
0.05 C 0.05 C
0.07 C A B
0.05 C (DATUM B) (DATUM A) C SEATING PLANE NOTE 1 N TOP VIEW SIDE VIEW BOTTOM VIEW NOTE 1 N 0.10 C 0.08 C Microchip Technology Drawing C04-1007A Sheet 1 of 2 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: 6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN] D E e 2X b2 4X b1 L A 2019 Microchip Technology Inc. DS20005891A-page 1 5 DSA1103/23
Microchip Technology Drawing C04-1007A Sheet 2 of 2 REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M 6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN] For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Number of Terminals Overall Height Terminal Width Overall Width Terminal Length Terminal Width Pitch Standoff Units Dimension Limits A e L E N
1.05 BSC
0.85 0.65 0.45 0.80 0.00 0.50 0.70 0.90 0.85 0.02
2.50 BSC
0.95 0.75 0.55 0.90 0.05 MAX L1 0.10 REFTerminal Pullback Overall Length D 3.20 BSC DSA1103/23 DS20005891A-page 1 6 2019 Microchip Technology Inc.
X1Contact Pad Width (X4) Contact Pitch MILLIMETERS E MAX 1.00 Contact Pad Length (X6) Contact Pad Width (X2) Y 0.85 Microchip Technology Drawing C04-3007A NOM 6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN] SILK SCREEN CContact Pad Spacing 1.60 Space Between Contacts (X4) G1 0.25 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M1. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: C E Y G 0.60 2019 Microchip Technology Inc. DS20005891A-page 1 7 DSA1103/23
DS20005891A-page 1 8 2019 Microchip Technology Inc.
© 2018 Microchip Technology Incorporated BA 0.05 C 0.05 C 0.05 C (DATUM B) (DATUM A) C SEATING PLANE NOTE 1 2X TOP VIEW SIDE VIEW BOTTOM VIEW NOTE 1 N 0.10 C 0.08 C Microchip Technology Drawing C04-01252 Rev A Sheet 1 of 2 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: 6-Lead Very Thin Plastic Dual Flat, No Lead Package (KDA) - 3.2x2.5 mm Body [VDFN] With Stepped Wettable Flanks D E A e1.05 4X b1 0.90 2X b2 0.50 0.25 N 6X L (A4) END VIEW (E3) 2019 Microchip Technology Inc. DS20005891A-page 1 9 DSA1103/23
© 2018 Microchip Technology Incorporated For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M Microchip Technology Drawing C04-01252 Rev A Sheet 2 of 2 6-Lead Very Thin Plastic Dual Flat, No Lead Package (KDA) - 3.2x2.5 mm Body [VDFN] With Stepped Wettable Flanks Number of Terminals Overall Height Terminal Width Overall Width Terminal Length Step Height Terminal Thickness Pitch Standoff Units Dimension Limits A e L E N 0.20 0.70 0.85 0.80 0.00 0.90 0.80
0.10 REF
0.85 0.02 0.90 0.95 0.90 0.05 MAX E3 0.05 REFStep Width Overall Length D 3.20 BSC 0.15 0.25 Terminal Width b2 0.45 0.50 0.55 DSA1103/23 DS20005891A-page 2 0 2019 Microchip Technology Inc.
© 2018 Microchip Technology Incorporated RECOMMENDED LAND PATTERN Dimension Limits Units Optional Center Pad Width Contact Pitch X2 0.60 MILLIMETERS E MAX Contact Pad Length (X20) Contact Pad Width (X20) Y 0.80 1.00 NOM SILK SCREEN CContact Pad Spacing 2.00 Contact Pad to Contact Pad (X3) G1 0.75 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M1. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: CH G1C E Y Contact Pad to Contact Pad (X4) G2 0.25 Terminal 1 Corner Chamfer CH 0.28 Microchip Technology Drawing C04-03252 Rev A 6-Lead Very Thin Plastic Dual Flat, No Lead Package (KDA) - 3.2x2.5 mm Body [VDFN] With Stepped Wettable Flanks 2019 Microchip Technology Inc. DS20005891A-page 2 1 DSA1103/23
DS20005891A-page 2 2 2019 Microchip Technology Inc. NOTES:
2019 Microchip Technology Inc. DS20005891A-page 2 3 DSA1103/23 APPENDIX A: REVISION HISTORY Revision A (June 2019)
- Initial release of DSA1103/23 as Microchip data sheet DS20005891A.
- Minor changes throughout the data sheet.
DS20005891A-page 2 4 2019 Microchip Technology Inc. NOTES:
2019 Microchip Technology Inc. DS20005891A-page 2 5 DSA1103/23 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. Examples: Device: DSA11x3: Low-Jitter Precision LVDS Oscillator for Automotive Enable Modes: 0 = Enable/Standby 2 = Enable/Disable Package: B = 5.0 mm x 3.2 mm CDFN C = 3.2 mm x 2.5 mm VDFN D = 2.5 mm x 2.0 mm VDFN W = 3.2 mm x 2.5 mm VDFN (Wettable Flanks) Temperature Range: A = –40°C to +125°C I = –40°C to +85°C L = –40°C to +105°C Stability: 1 = ±50 ppm 2 = ±25 ppm 3 = ±20 ppm Frequency Code: xxx.xxxx = 2.3 MHz to 460 MHz (user-defined) Media Type: T = 1,000/Reel (blank) = 100/Tube Automotive Suffix: VXX = Automotive Suffix in which “XX” is assigned by Microchip. Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. a) DSA1123BI2- 400.0000TVA0: Low-Jitter Precision LVDS Oscillator for Automotive, Enable/Disable, 5x3.2 CDFN, –40°C to +85°C, ±25ppm, 400 MHz, 1000/Reel b) DSA1103CL3- 074.2500VA0: Low-Jitter Precision LVDS Oscillator for Automotive, Enable/Standby, 3.2x2.5 VDFN, –40°C to +105°C, ±20 ppm, 74.25 MHz, 100/Tube c) DSA1103WI2- 056.0000VA0: Low-Jitter Precision LVDS Oscillator for Automotive, Enable/Standby, 3.2x2.5 VDFN (Wettable Flanks), –40°C to +85°C, ±25 ppm, 56 MHz, 100/Tube Note: Please use the Microchip Clockworks tool to check AEC-Q10 0 compliance status and build the exact part number. PART NO. X 3 X X X- XXX.XXXX X XXX Device (First 2 Digits) Enable Modes Device (First 2 Digits) Package Temperature Range Frequency Stability Frequency Media Type Automotive Suffix
DS20005891A-page 2 6 2019 Microchip Technology Inc. NOTES:
2019 Microchip Technology Inc. DS20005891A-page 2 7 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, Vite, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2019, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-4722-1 Note the following details of the code protection feature on Microchip devices:
- Microchip products meet the specification contained in their p articular Microchip Data Sheet.
- Microchip believes that its family of products is one of the m ost secure families of its kind on the market today, when used in the intended manner and under normal conditions.
- There are dishonest and possibly illegal methods used to breac h the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
- Microchip is willing to work with the customer who is concerne d about the integrity of their code.
- Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.
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