DSA1101DA1T

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Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 24

Technical content

Features

• Automotive AEC-Q100 Qualified
• Two Rise/Fall Time Options for EMI Reduction
• Low RMS Phase Jitte r: <1 ps (typ.)
• High Stability: ±20 ppm, ±2 5 ppm, ±50 ppm
• Wide Temperature Range: - Automotive Grade 1: – 40°C to +125°C - Automotive Grade 2: – 40°C to +105°C - Automotive Grade 3: – 40°C to +85°C
• High Supply Noise Rejection: –50 dBc
• Wide Freq. Range: 2.3 MHz to 170 MHz
• Small Industry Standard Footprints - 2.5 mm x 2.0 mm - 3.2 mm x 2.5 mm - 5.0 mm x 3.2 mm
• Excellent Shock and Vibration Immunity - Qualified to MIL-STD-883
• High Reliability - 20x Better MTF than Quartz Oscillators
• Low Current Consumption
• Supply Range of 2.25 to 3.63V
• Standby and Output Enable Function
• Lead-Free and RoHS Compliant

Applications

• Automotive Infotainment
• Automotive ADAS
• Automotive Camera Module
• Automotive LIDAR and RADAR Benefits
• Replace High Temperature Crystals and Quartz Oscillators General Description The DSA1101 and DSA1121 series of high performance oscillators utilize a proven silicon MEMS technology to provide excellent jitter and stability over a wide range of supply voltages and temperatures. By eliminating the need for quartz or SAW technology, MEMS oscillators significantly enhance reliability and accelerate product development, while meeting stringent clock performance criteria for a variety of communications, storage, and networking applications. DSA1101 has a standby feature that allows it to comple tely power-down when EN pin is pulled low. For DSA1121, only the outputs are disabled when EN is low. Both oscillators are available in industry standard packages, including the small 2.5 mm x 2.0 mm, and are “drop-in” replacements for standard 4-pin and 6-pin CMOS quartz crystal osc illators. The DSA1105/25 is functionally equivalent to the DSA1 101/21, but it has lower drive strength for EMI reduction. Functional Block Diagram Low-Jitter Precision CMOS Oscillator for Automotive

DS20005890B-page 2  2018 Microchip Technology Inc.

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings † † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of thi s specification is not intend ed. Exposure to maximum rating conditions for extended periods may affect device reliability.

TABLE 1-1: ELECTRICAL CHARACTERISTICS Parameter Symbol Min. Typ. Max. Units Conditions Supply Voltage (Note 1) VDD 2.25 — 3.63 V — Supply Current IDD — — 0.095 mA DSA1101/05, EN pin low. Output is disabled and device is in standby — 20 22 DSA1121/25, EN pin low, output is d isabled — 21 35 EN pin high, output is enabled C L = 15 pF, FO = 100 MHz Frequency Stability (Including frequency variations due to initial tolerance, temp. and power supply voltage) Δf — — ±20 ppm All temp ranges — — ±25 — — ±50 Aging Δf — — ±5 ppm 1 year @ 25°C Startup Time (Note 2) t SU — — 5 ms T = 25°C Input Logic Levels Input Logic High VIH 0.75 x VDD — — V — Input Logic Low VIL — — 0.1 x VDD V — Output Disable Time (Note 3) tDS — — 5 ns — Output Enable Time tEN — — 5 ms DSA1101/05 20 ns DSA1121/25 Enable Pull-Up Resistor (Note 4) — — 40 — kΩ Internally pulled-up CMOS Output Output Logic Level High VOH 0.9 x VDD — — V I = ±6 mAOutput Logic Level Low VOL — — 0.1 x VDD V Output Transition Rise Time tR — 1.1 2 ns DSA1101/21, 20% to 80%, CL = 15 pF — 4 5 DSA1105/25, 20% to 80%, CL = 15 pF Output Transition Fall Time tF — 1.3 2 ns DSA1101/21, 20% to 80%, CL = 15 pF — 4.7 6 DSA1105/25, 20% to 80%, CL = 15 pF Frequency fO 2.3 — 170 MHz CL = 15 pF and –40°C to +85°C 3.3 — 170 CL = 15 pF, –40°C to +105°C and –40°C to +125°C Output Duty Cycle SYM 45 — 55 % — Period Jitter JPER — 3 — psRMS FOUT = 125 MHz Integrated Phase Noise JPH — 0.3 — psRMS 200 kHz to 20 MHz @ 125 MHz — 0.38 — 100 kHz to 20 MHz @ 125 MHz — 1.7 2 12 kHz to 20 MHz @ 125 MHz Note 1: Pin 6 VDD should be filtered with 0.1 µF capacitor. 2: tSU is time to 100 ppm of output frequency after VDD is applied and outputs are enabled. 3: Ou tput Waveform and Test Circuit figures define the parameters. 4: Ou tput is enabled if pad is floated or not connected.  2018 Microchip Technology Inc. DS20005890B-page 3 DSA1101/21/05/25

TEMPERATURE SPECIFICATIONS (Note 1) Parameters Symbol Min. Typ. Max. Units Conditions Temperature Ranges Operating Temperature Ran ge (T) TA –40 — +85 °C Ordering Option I TA –40 — +105 °C Ordering Option L TA –40 — +125 °C Ordering Option A Junction Operating Temperature TJ — — +150 °C — Storage Temperature Range TA –40 — +150 °C — Soldering Temperature Range TS — — +260 °C Soldering, 40s Note 1: Th e maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability. DSA1101/21/05/25 DS20005890B-page 4  2018 Microchip Technology Inc.

 2018 Microchip Technology Inc. DS20005890B-page 5 DSA1101/21/05/25

2.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 2-1. TABLE 2-1: DSA1101/21/05/25 PIN FUNCTION TABLE Pin Number 5x3.2 Pin Number 3.2x2.5 Pin Number 2x2.5 Pin Name Description 1 1 1 EN Enable. 2 2 2 NC Do not connect. 3 3 3 GND Ground. 4 4 4 OUT Output. 5 5 5 NC Do not connect. 6 6 6 VDD Supply voltage. TABLE 2-2: EN Pin DSA1101/05 DSA1121/25 High Output Active Output Active NC Output Active Output Active Low Standby Output Disabled OUTPUT ENABLE MODES

DS20005890B-page 6  2018 Microchip Technology Inc.

3.0 NOMINAL PERFORMAN CE CHARACTERISTICS

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The p erformance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the dat a presented may be out side the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. FIGURE 3-1: Phase Jitter (Integrated Phase Noise). FIGURE 3-2: Power Supply Rejection Ratio.

 2018 Microchip Technology Inc. DS20005890B-page 7 DSA1101/21/05/25

4.0 OUTPUT WAVEFORM

FIGURE 4-1: DSA1101/21/05/25 Output Waveform.

DS20005890B-page 8  2018 Microchip Technology Inc.

5.0 TYPICAL TERMINATION SCHEME

FIGURE 5-1: Typical Termination Scheme for DSA1101/21/05/25.

 2018 Microchip Technology Inc. DS20005890B-page 9 DSA1101/21/05/25

6.0 BOARD LAYOUT (RECOMMENDED)

FIGURE 6-1: DSA1101/21/05/25 Recommended Board Layout.

DS20005890B-page 10  2018 Microchip Technology Inc.

7.0 SOLDER REFLOW PROFILE

FIGURE 7-1: Solder Reflow Profile. TABLE 7-1: SOLDER REFLOW MSL 1 @ 260°C Refer to JSTD-020C Ramp-Up Rate (200°C to Peak Temp.) 3°C/sec. max. Preheat Time 150°C to 200°C 60 to 180 sec. Time Maintained above 217°C 60 to 150 sec. Peak Temperature 255°C to 260°C Time within 5°C of Actual Peak 20 to 40 sec. Ramp-Down Rate 6°C/sec. max. Time 25°C to Peak Temperature 8 minutes max.

 2018 Microchip Technology Inc. DS20005890B-page 11 DSA1101/21/05/25

8.0 PACKAGING INFORMATION

8.1 Package Marking Information

Example6-Pin CDFN/VDFN* XXXXXXX 0SSS DCPYYWW 0750000 0421 DCP1723 Legend: XX...X Product code, customer-specific information, or frequency in MHz  without printed decimal point Y Year code (last digit of calendar year)  YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’)  NNN Alphanumeric traceability code  Pb-free JEDEC ® designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package.

• , ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked o n one line, it will be carried over to the next line, thus limiting the number of a vailable characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar (‾) symbol may not be to scale.

DS20005890B-page 12  2018 Microchip Technology Inc. 6-Lead VDFN 2.5 mm x 2.0 mm Package Outline and Recommended Land Pattern BA 0.05 C 0.05 C (DATUM B) (DATUM A) C SEATING PLANE N 2X TOP VIEW SIDE VIEW NOTE 1 0.10 C 0.08 C Microchip Technology Drawing C04-1005A Sheet 1 of 2 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: 6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN] D E A

0.10 C A B

0.05 C BOTTOM VIEW N 2X b2 4X b1 5X L1 e

REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Microchip Technology Drawing C04-1005A Sheet 2 of 2 6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN] Number of Terminals Overall Height Terminal Width Overall Width Terminal Length Pitch Standoff Units Dimension Limits A e E N

0.825 BSC

0.665 0.60 0.80 0.00 0.65 0.765 0.85 0.02

2.00 BSC

0.865 0.70 0.90 0.05 MAX Overall Length D 2.50 BSC Terminal Length L1 0.60 0.70 0.80 Terminal Width b2 0.20 0.25 0.30  2018 Microchip Technology Inc. DS20005890B-page 13 DSA1101/21/05/25

C Contact Pad Width (X4) Contact Pad Spacing Contact Pad Width (X2) Contact Pitch 0.25 0.65 MILLIMETERS E MAX 1.45 Space Between Contacts (X3) Space Between Contacts (X4) 0.60 0.38 Microchip Technology Drawing C04-3005A NOM 6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN] 1 2 YContact Pad Length (X6) 0.85 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: C E Y SILK SCREEN DSA1101/21/05/25 DS20005890B-page 14  2018 Microchip Technology Inc.

 2018 Microchip Technology Inc. DS20005890B-page 15 DSA1101/21/05/25 6-Lead VDFN 3.2 mm x 2.5 mm Package Outline and Recommended Land Pattern BA 0.05 C 0.05 C

0.07 C A B

0.05 C (DATUM B) (DATUM A) C SEATING PLANE NOTE 1 N TOP VIEW SIDE VIEW BOTTOM VIEW NOTE 1 N 0.10 C 0.08 C Microchip Technology Drawing C04-1007A Sheet 1 of 2 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: 6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN] D E e 2X b2 4X b1 L A

Microchip Technology Drawing C04-1007A Sheet 2 of 2 REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M 6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN] For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Number of Terminals Overall Height Terminal Width Overall Width Terminal Length Terminal Width Pitch Standoff Units Dimension Limits A e L E N

1.05 BSC

0.85 0.65 0.45 0.80 0.00 0.50 0.70 0.90 0.85 0.02

2.50 BSC

0.95 0.75 0.55 0.90 0.05 MAX L1 0.10 REFTerminal Pullback Overall Length D 3.20 BSC DSA1101/21/05/25 DS20005890B-page 16  2018 Microchip Technology Inc.

X1Contact Pad Width (X4) Contact Pitch MILLIMETERS E MAX 1.00 Contact Pad Length (X6) Contact Pad Width (X2) Y 0.85 Microchip Technology Drawing C04-3007A NOM 6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN] SILK SCREEN CContact Pad Spacing 1.60 Space Between Contacts (X4) G1 0.25 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M1. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: C E Y G 0.60  2018 Microchip Technology Inc. DS20005890B-page 17 DSA1101/21/05/25

DS20005890B-page 18  2018 Microchip Technology Inc. 6-Lead CDFN 5.0 mm x 3.2 mm Package Outline and Recommended Land Pattern

 2018 Microchip Technology Inc. DS20005890B-page 19 DSA1101/21/05/25 APPENDIX A: REVISION HISTORY Revision A (March 2018)

• Initial release of DSA1101/21/05/25 as Microchip data sheet DS20005890B. Revision B (May 2018)
• Typographical errors were changed in the last paragraph of the General Description and in the CMOS Output section of the Electrical Character- istics Table under the Conditions column that corrects the part numbers from DSC1105/25 and DSC1101/21 to DSA1105/25 and DSA1101/21.
• Added the Automotive Suffix to the Product Identification System.

DS20005890B-page 20  2018 Microchip Technology Inc. NOTES:

 2018 Microchip Technology Inc. DS20005890B-page 21 DSA1101/21/05/25 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. Examples: a) DSA1101CL3-030.0000VAO: Low-Power Precision CMOS Oscillator for Automotive with Standby, 6-LD 3.2X2.5 VDFN, Grade 2 Temperature Range, ±20 ppm, 30 MHz Output Frequency, 110/ Tube, Automotive Suffix b) DSA1121DI1-075.0000TVAO: Low-Power Precision CMOS Oscillator for Automotive with Standby, 6-LD 2.5x2.0 VDFN, Grade 3 Temperature Range, ±50 ppm, 75 MHz Output Frequency, 1,000/Reel, Automotive Suffix c) DSA1105BL2-027.0000VAO: Low-Power Precision CMOS Oscillator for Automotive, 6-LD 5.0x3.2 CDFN, Grade 2 Temperature Range, ±25 ppm, 27 MHz Output Frequency, 110/ Tube, Automotive Suffix d) DSA1125CA3-033.0000TVAO: Low-Power Precision CMOS Oscillator for Automotive, 6-LD 3.2x2.5 VDFN, Grade 1 Temperature Range, ±20 ppm, 33 MHz Output Frequency, 1000/Reel, Automotive Suffix PART NO. X X PackingStabilityDevice Device: DSA1101/21: Low-Power Precision CMOS Oscillator for Automotive with Standby DSA1105/25: Low-Power Precision CMOS Oscillator for Automotive Package: B = 6-Lead 5.0 mm x 3.2 mm CDFN C = 6-Lead 3.2 mm x 2.5 mm VDFN D = 6-Lead 2.5 mm x 2.0 mm VDFN Temperature Range: I = –40 C to +85C (Grade 3) L = –40 C to +105C (Grade 2) A = –40 C to +125C (Grade 1) Stability: 1 = ±50 ppm 2= ± 2 5 p p m 3= ± 2 0 p p m Frequency: xxx.xxxx = 2.3 MHz to 170 MHz (user-defined) Packing Option: <blank> = 110/Tube T = 1,000/Reel Automotive Suffix: Vxx = Automotive Suffix in which “xx” is assigned by Microchip X Package Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. X Temp. Range -XXX.XXXX Frequency Please use the Microchip Clockworks to check AEC-Q100 compliance status and build the exact part number. Option VXX Automotive Suffix

DS20005890B-page 22  2018 Microchip Technology Inc. NOTES:

 2018 Microchip Technology Inc. DS20005890B-page 23 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclai m s a l l l i a b i l i t y arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP , Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2018, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-2997-5 Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the spec ification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the m ost secure families of its kind on the market today, when used in the intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breac h the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerne d about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are com mitted to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC ® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==

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