DS96F173MQML_13 TI1 | Alldatasheet
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DS96F173MQML,DS96F175MQML www.ti.com SNOSAS9A –APRIL 2011–REVISED APRIL 2013 DS96F173MQML/DS96F175MQMLEIA-485/EIA-422QuadDifferentialReceivers Check forSamples: DS96F173MQML ,DS96F175MQML 1FEATURES DESCRIPTION The DS96F173 and the DS96F175 are high speed 2• Meets EIA-485,EIA-422A,EIA-423A Standards quad differentiallinereceiversdesignedto meet the• Designed forMultipointBus Applications EIA-485standard.The DS96F173 and theDS96F175
- TRI-STATE Outputs offerimprovedperformancedue totheuse ofL-FAST bipolartechnology.The use of LFAST technology• Common Mode InputVoltageRange: −7V to allowsthe DS96F173 and DS96F175 to operateat+12V higherspeeds whileminimizingpower consumption.• Operates from Single+5.0V Supply The DS96F173 and theDS96F175 have TRI-STATE• Lower Power Version outputsand are optimizedforbalanced multipoint• InputSensitivityof±200 mV Over Common data bus transmissionat ratesup to 15 Mbps. The Mode Range receiversfeature high input impedance, input hysteresisforincreasednoise immunity,and input• InputHysteresisof50 mV Typical sensitivityof 200 mV over a common mode input• High InputImpedance voltagerange of −7V to +12V. The receiversare• DS96F173 and DS96F175 areLead and thereforesuitableformultipointapplicationsinnoisy FunctionCompatible withSN75173/175 or the environments.The DS96F173 featuresan activehigh AM26LS32/MC3486 and activelow Enable,common toallfourreceivers. The DS96F175 featuresseparateactivehighEnables foreach receiverpair. Connection Diagrams 16-Lead Ceramic Dual-In-LinePackage (Package Number NFE0016A) DS96F173 DS96F175 Figure1.Top View Figure2.Top View Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2011–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
DS96F173MQML,DS96F175MQML SNOSAS9A –APRIL 2011–REVISED APRIL 2013 www.ti.com 20-Lead Ceramic LeadlessChip Carrier (Package Number NAJ0020A) *NC — No Connection Figure3.Top View Figure4.Top View Logic Diagrams DS96F173 DS96F175
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DS96F173MQML,DS96F175MQML www.ti.com SNOSAS9A –APRIL 2011–REVISED APRIL 2013 FunctionTables Table1.(Each Receiver)DS96F173 (1) DifferentialInputs Enable Output A –B E E Y VID ≥ 0.2V H X H X L H VID ≤ −0.2V H X L X L L X L X Z X X H Z (1) H = HighLevel L = Low Level Z = HighImpedance (off) X = Don 'tCare Table2.(Each Receiver)DS96F175 DifferentialInputs Enable Output A –B E Y VID ≥ 0.2V H H VID ≤ −0.2V H L X L Z Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS96F173MQML DS96F175MQML
DS96F173MQML,DS96F175MQML SNOSAS9A –APRIL 2011–REVISED APRIL 2013 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings(1) StorageTemperatureRange(TStg) −65°C ≤ TA ≤ +175°C Lead Temperature(Soldering,60 sec.) 300°C Max. Package Power Dissipationat25°C (2) CDIP (NFE) 1,500mW CDIP (NAD) 1,034mW LCCC (NAJ) 1,500mW SupplyVoltage 7.0V InputVoltage,A orB Inputs ±25V DifferentialInputVoltage ±25V EnableInputVoltage 7.0V Low LevelOutputCurrent 50 mA (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisfunctional,butdo notensurespecificperformancelimits.Forensuredspecificationsand testconditions,see the ElectricalCharacteristics--DCParameters.The ensuredspecificationsapplyonlyforthetestconditionslisted.Some performance characteristicsmay degradewhen thedeviceisnotoperatedunderthelistedtestconditions. (2) Above TA = 25°C derateNFE package 10 mW/ °C, NAD package 6.90mW/ °C, NAJ package 11.11mW/ °C. Recommended OperatingConditions Min Max Units SupplyVoltage(VCC ) 4.50 5.50 V Common Mode InputVoltage(VCM ) −7 +12 V DifferentialInputVoltage(VID) −7 +12 V OutputCurrentHIGH (IOH ) −400 μA OutputCurrentLOW (IOL ) 16 mA OperatingTemperature(TA) −55 125 °C QualityConformance Inspection Mil-Std-883,Method 5005 -Group A Subgroup Description Temp (°C)
1 Statictestsat +25
2 Statictestsat +125
3 Statictestsat -55
4 Dynamic testsat +25
5 Dynamic testsat +125
6 Dynamic testsat -55
7 Functionaltestsat +25
9 Switchingtestsat +25
10 Switchingtestsat +125
11 Switchingtestsat -55
12 Settlingtimeat +25
13 Settlingtimeat +125
14 Settlingtimeat -55
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DS96F173MQML,DS96F175MQML www.ti.com SNOSAS9A –APRIL 2011–REVISED APRIL 2013 ElectricalCharacteristics--DCParameters The followingconditionsapply,unlessotherwisespecified.VCC = 5.0V,OutputsEnabled Sub-Symbol Parameter Conditions Notes Min Max Units groups ICC SupplyCurrent VCC = 5.5V,VID = 2V See (1) 50 mA 1,2,3 VCC = 4.5V,IOH = -400µA,VOH Logical"1"OutputVoltage See (2) 2.5 V 1,2,3VID = 0.2V VCC = 4.5V,IOL = 8mA,VOL Logical"0"OutputVoltage See (2) 0.45 V 1,2,3VID = -0.2V VCC = 4.5V& 5.5V,VCM = 0V,VO = 0.20 V 1,2,32.5V,IO = -400µA VCC = 4.5V& 5.5V,Differential-InputHighThresholdVTH VCM = -12V,VO = 2.5V, 0.20 V 1,2,3Voltage IO = -400µA VCC = 4.5V& 5.5V,VCM = 12V,VO 0.20 V 1,2,3= 2.5V,IO = -400µA VCC = 4.5V& 5.5V,VCM = 0V,VO = -0.20 V 1,2,30.5V,IO = 16mA VCC = 4.5V& 5.5V,Differential-InputLow ThresholdVTL VCM = -12V,VO = 0.5V, -0.20 V 1,2,3Voltage IO = 16mA VCC = 4.5V& 5.5V,VCM = 12V,VO -0.20 V 1,2,3= 0.5V,IO = 16mA VCC = 4.5V,VI= 12V, 1.0 mA 1,2,3UntestedInputsare0V II InputLineCurrent VCC = 5.5V,VI= -7V, -0.8 mA 1,2,3UntestedInputsare0V IIH Logical"1"EnableInputCurrent VCC = 5.5V,VIH = 2.7V 10 µA 1,2,3 IIL Logical"0"EnableInputCurrent VCC = 5.5V,VIL= 0.4V -100 µA 1,2,3 VCC = 4.5V,VO = 0V -85 -15 mA 1,2,3 IOS OutputShortCircuitCurrent See (3) VCC = 5.5V,VO = 0V -85 -15 mA 1,2,3 VIK EnableInputClamp Voltage VCC = 4.5V,II= -18mA -1.5 V 1,2,3 VCC = 5.5V,VEn = 0.8V, VO = 0.4V, -20 20 µA 1,2,3 Outputsdisabled IOZ HighImpedance OutputCurrent VCC = 5.5V,VEn = 0.8V, VO = 2.4V, -20 20 µA 1,2,3 Outputsdisabled VIH Logical"1"EnableInputVoltage See (4) 2.0 V 1,2,3 VIL Logical"0"EnableInputVoltage See (5) 0.8 V 1,2,3 R I InputResistance 10 kΩ 1,2,3 (1) ICC istestedwithoutputsdisabled(worstcase),ICC enabledisensuredby thistest. (2) VOH & VOL aretestedovercommon mode voltagerangeof+/−12V viatheVTH /VTL tests. (3) Onlyone outputata timeshouldbe shorted. (4) Ensuredby VOL & VOH tests. (5) Ensuredby IOZ test. Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS96F173MQML DS96F175MQML
DS96F173MQML,DS96F175MQML SNOSAS9A –APRIL 2011–REVISED APRIL 2013 www.ti.com AC Parameters The followingconditionsapply,unlessotherwisespecified.VCC = 5.0V Sub-Symbol Parameter Conditions Notes Min Max Units groups 22 ns 1 tPHL PropagationDelay C L = 15pF 30 ns 2,3 22 ns 1 tPLH PropagationDelay C L = 15pF 30 ns 2,3 16 ns 1 tPZH PropagationDelay C L = 15pF 27 ns 2,3 18 ns 1 tPZL PropagationDelay C L = 15pF 27 ns 2,3 20 ns 1 C L = 5pF See (1) 27 ns 2,3 tPHZ PropagationDelay 30 ns 1 C L = 20pF 37 ns 2,3 18 ns 1 tPLZ PropagationDelay C L = 5pF 30 ns 2,3 3.0 ns 1 tPW PropagationDelay 8.0 ns 2 5.0 ns 3 (1) Testingat20pF assuresconformancetospec at5pF.
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DS96F173MQML,DS96F175MQML www.ti.com SNOSAS9A –APRIL 2011–REVISED APRIL 2013 PARAMETER MEASUREMENT INFORMATION Figure5. tPLH ,tPHL (2)(3) Figure6. tHZ ,tZH (2)(3)(4)(5) Figure7. tZL,tLZ (2)(3)(4)(5) (2) The inputpulseissuppliedby a generatorhavingthefollowingcharacteristics:f= 1.0MHz, 50% dutycycle,tr ≤ 6.0ns,tf≤ 6.0ns,ZO = 50Ω. (3) C L includesprobeand straycapacitance. (4) Alldiodesare1N916 orequivalent. (5) To testtheactivelowEnableE ofDS96F173, groundE and applyan invertedinputwaveform toE .DS96F175 has activehighenable only. Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS96F173MQML DS96F175MQML
DS96F173MQML,DS96F175MQML SNOSAS9A –APRIL 2011–REVISED APRIL 2013 www.ti.com TypicalApplication Figure8. NOTE The linelengthshouldbe terminatedat both ends initscharacteristicimpedance.Stub lengthsoffthemain lineshouldbe keptas shortas possible.
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DS96F173MQML,DS96F175MQML www.ti.com SNOSAS9A –APRIL 2011–REVISED APRIL 2013
REVISION HISTORY
Released Revision Section Changes 28–Apr-11 A New Release,Corporateformat 2 MDS datasheetsconvertedintoone Corp.data sheetformat.MNDS96F173M-X Rev 0A0 & MNDS96F175M-X Rev 0B0 willbe archived. Changes from Original(April2013)toRevisionA Page Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:DS96F173MQML DS96F175MQML
www.ti.com 18-Apr-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Top-Side Markings (4) Samples 5962-9076601M2A ACTIVE LCCC NAJ 20 50 TBD Call TI Call TI -55 to 125 DS96F175ME /883 Q 5962-90766 01M2A ACO 01M2A >T 5962-9076601VEA ACTIVE CDIP NFE 16 25 TBD Call TI Call TI -55 to 125 DS96F175MJ-QMLV 5962-9076601VEA Q 5962-9076602M2A ACTIVE LCCC NAJ 20 50 TBD Call TI Call TI -55 to 125 DS96F173ME /883 Q 5962-90766 02M2A ACO 02M2A >T 5962-9076602MEA ACTIVE CDIP NFE 16 25 TBD Call TI Call TI -55 to 125 DS96F173MJ/883 5962-9076602MEA Q DS96F173ME/883 ACTIVE LCCC NAJ 20 50 TBD Call TI Call TI -55 to 125 DS96F173ME /883 Q 5962-90766 02M2A ACO 02M2A >T DS96F173MJ/883 ACTIVE CDIP NFE 16 25 TBD Call TI Call TI -55 to 125 DS96F173MJ/883 5962-9076602MEA Q DS96F175ME/883 ACTIVE LCCC NAJ 20 50 TBD Call TI Call TI -55 to 125 DS96F175ME /883 Q 5962-90766 01M2A ACO 01M2A >T DS96F175MJ-QMLV ACTIVE CDIP NFE 16 25 TBD Call TI Call TI -55 to 125 DS96F175MJ-QMLV 5962-9076601VEA Q (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
www.ti.com 18-Apr-2013 Addendum-Page 2 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF DS96F175MQML, DS96F175MQML-SP :
- Military: DS96F175MQML
- Space: DS96F175MQML-SP NOTE: Qualified Version Definitions:
- Military - QML certified for Military and Defense Applications
- Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
www.ti.com J16A (REV L)
www.ti.com E20A (Rev F)
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