DS96F174ME/883

DS96F172MQML_13 TI1 | Alldatasheet

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DS96F172MQML,DS96F174MQML www.ti.com SNOSAS8A –APRIL 2011–REVISED APRIL 2013 DS96F172MQML/DS96F174MQMLEIA-485/EIA-422QuadDifferentialDrivers Check forSamples: DS96F172MQML ,DS96F174MQML 1FEATURES DESCRIPTION The DS96F172 and the DS96F174 are high speed 2• Meets EIA-485and EIA-422Standards quad differentiallinedriversdesignedto meet EIA-• Monotonic DifferentialOutput Switching 485 Standards.The DS96F172 and the DS96F174

• TRI-STATE Outputs offerimprovedperformancedue totheuse ofL-FAST bipolartechnology.The use of LFAST technology• Designed forMultipointbus Transmission allowsthe DS96F172 and DS96F174 to operateat• Common Mode Output VoltageRange: −7.0V higherspeeds whileminimizingpower consumption.to+12V The DS96F172 and theDS96F174 have TRI-STATE• Operates from Single+5.0V Supply outputsand are optimizedforbalanced multipoint• Reduced Power Consumption data bus transmissionat ratesup to 15 Mbps. The
• Thermal Shutdown Protection drivershave wide positiveand negativecommon mode range for multipointapplicationsin noisy• DS96F172 and DS96F174 areLead and environments.Positiveand negativecurrent-limitingFunctionCompatible withtheSN75172/174 or isprovidedwhich protectsthe driversfrom linefaulttheAM26LS31/MC3487 conditionsover a +12V to −7.0V common mode range.A thermalshutdown featureisalsoprovided. The DS96F172 featuresan activehighand activelow Enable,common to allfourdrivers.The DS96F174 featuresseparateactivehighEnablesforeach driver pair. Connection Diagrams Figure1.16-Lead CDIP Package-Top View Figure2.16-Lead CDIP Package-Top View DS96F172 DS96F174 (See Package Number NFE0016A) (See Package Number NFE0016A) Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2011–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

DS96F172MQML,DS96F174MQML SNOSAS8A –APRIL 2011–REVISED APRIL 2013 www.ti.com NC = No connection Figure3.20-Lead LCCC Package-Top View Figure4.20-Lead LCCC Package-Top View DS96F172 DS96F174 (seePackage Number NAJ0020A) (seePackage Number NAJ0020A) Logic Diagrams Figure5.DS96F172 Figure6.DS96F174

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DS96F172MQML,DS96F174MQML www.ti.com SNOSAS8A –APRIL 2011–REVISED APRIL 2013 FunctionTables(Each Driver) Table1.DS96F172 (1) Input Enable Outputs A E E Y Z H H X H L L H X L H H X L H L L X L L H X L H Z Z (1) H = HighLevel L = Low Level X = Don 'tCare Z = HighImpedance (Off) Table2.DS96F174 (1) Input Enable Outputs A E Y Z H H H L L H L H X L Z Z (1) H = HighLevel L = Low Level X = Don 'tCare Z = HighImpedance (Off) These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings(1) StorageTemperatureRange (TStg) −65°C ≤ TA ≤ +175°C Lead Temperature(Soldering,60 sec.) 300°C Maximum Package Power Dissipationat25°C (2) LCCC package 2,000mW CDIP package 1,800mW CeramicFlatpackpackage 1,000mW SupplyVoltage 7.0V EnableInputVoltage 5.5V (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisfunctional,butdo notverifyspecificperformancelimits.Forverifiedspecificationsand testconditions,see the ElectricalCharacteristics.The verifiedspecificationsapplyonlyforthetestconditionslisted.Some performancecharacteristicsmay degradewhen thedeviceisnotoperatedunderthelistedtestconditions. (2) Above TA = 25°C, derateLCCC package 13.3,CDIP package 12.5,Ceramicflatpackpackage 7.1mW/ °C Recommended OperatingConditions Min Max Units SupplyVoltage(VCC ) 4.50 5.50 V Common Mode OutputVoltage(VOC ) −7.0 +12.0 V OutputCurrentHigh(IOH ) −60 mA OutputCurrentLow (IOL ) 60 mA OperatingTemperature(TA) −55 +125 °C Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS96F172MQML DS96F174MQML

DS96F172MQML,DS96F174MQML SNOSAS8A –APRIL 2011–REVISED APRIL 2013 www.ti.com QualityConformance Inspection Table3.Mil-Std-883,Method 5005 -Group A Subgroup Description Temp (°C)

1 Statictestsat +25

2 Statictestsat +125

3 Statictestsat -55

4 Dynamic testsat +25

5 Dynamic testsat +125

6 Dynamic testsat -55

7 Functionaltestsat +25

9 Switchingtestsat +25

10 Switchingtestsat +125

11 Switchingtestsat -55

12 Settlingtimeat +25

13 Settlingtimeat +125

14 Settlingtimeat -55

DS96F172/DS96F174 ElectricalCharacteristicsAC/DC Parameters(1) The followingconditionsapply,unlessotherwisespecified. DC: VCC = 5.5V AC: VCC = 5.0V Sub-Parameter TestConditions Notes Min Max Units groups

0.8 V 1

0.7 V 2,3

VIH Logical1 InputVoltage 2.0 V 1,2,3 VIC InputClamp Voltage I= -18mA -1.5 V 1,2,3 VOD1 DifferentialOutputVoltage IO = 0mA 6.0 V 1,2,3 1.5 V 1,2VCC = 4.5V,R L = 54ΩVOD2 DifferentialOutputVoltage Figure7 See (2) 1.2 V 3 VOD2 DifferentialOutputVoltage VCC = 4.5V,R L = 100Ω 2.0 V 1,2,3 Figure7 See (3) -200 200 mV 1,2 ΔVOD1 Change InMagnitudeofVOD2 VCC = 4.5V,R L = 54Ω See (2)(3) -400 400 mV 3 See (3) -200 200 mV 1,2 ΔVOD2 Change InMagnitudeofVOD2 VCC = 4.5V,R L = 100Ω See (2)(3) -400 400 mV 3 VOC Common Mode OutputVoltage R L = 54Ω 3.0 V 1,2,3 Figure7 VOC Common Mode OutputVoltage R L = 100Ω 3.0 V 1,2,3 Figure7 ΔVOC Change inMagnitudeofVOC VCC = 4.5V,R L = 54Ω -200 200 mV 1,2,3See (3) Figure7 ΔVOC Change inMagnitudeofVOC VCC = 4.5V,R L = 100Ω -200 200 mV 1,2,3See (4) Figure7 IO OutputCurrentWithPower Off VCC = 0V,VO = -7V to12V -50 50 µA 1,2,3 (1) Allcurrentsintothedevicepinsarepositive;allcurrentsoutofthedevicepinsarenegative.Allvoltagesarereferencetogroundunless otherwisespecified. (2) −55°C limitexceedsEIA standardRS −485 specification (3) Δ|VOD |isthechange inmagnitudeofVOD ,thatoccurswhen theinputischanged between highand lowlevels. (4) Δ|VOC |isthechange inmagnitudeoftheVOC thatoccurswhen theinputischanged between highand lowlevels.

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DS96F172MQML,DS96F174MQML www.ti.com SNOSAS8A –APRIL 2011–REVISED APRIL 2013 DS96F172/DS96F174 ElectricalCharacteristicsAC/DC Parameters(1)(continued) The followingconditionsapply,unlessotherwisespecified. DC: VCC = 5.5V AC: VCC = 5.0V Sub-Parameter TestConditions Notes Min Max Units groups IOZ HighImpedance StateOutputCurrent VO = -7V to12V -50 50 µA 1,2,3 IIH Logical1 InputCurrent VI= 2.4V 20 µA 1,2,3 IIL Logical0 InputCurrent VI= 0.4V -50 µA 1,2,3 ICC SupplyCurrent OutputsEnabled 50 mA 1,2,3 ICCX SupplyCurrent OutputsDisabled 30 mA 1,2,3 IOS1 ShortCircuitOutputCurrent VO = -7V See (5) -250 mA 1,2,3 IOS2 ShortCircuitOutputCurrent VO = 0V See (5) -150 mA 1,2,3 IOS3 ShortCircuitOutputCurrent VO = VCC See (5) 150 mA 1,2,3 IOS4 ShortCircuitOutputCurrent VO = 12V See (5) 250 mA 1,2,3 R L = 27Ω,C L = 15pF 25 ns 10,11 tPLH PropagationDelayLo toHilevel Figure10 16 ns 9 R L = 27Ω,C L = 15pF 25 ns 10,11 tPHL PropagationDelayHitoLow Level Figure10 16 ns 9 R L = 60Ω 10 ns 10,11 SKEW OutputtoOutputDelayTime 4 ns 9 OutputDisableTime From Low Level 40 ns 10,11R L = 110Ω,C L = 50pFtLZ Figure12 25 ns 9 OutputDisableTime From HighLevel 80 ns 10,11R L = 110Ω,C L = 50pFtHZ Figure11 30 ns 9 OutputEnableTime toLow Level R L = 110Ω,C L = 50pF 100 ns 10,11 tZL Figure12 40 ns 9 OutputEnableTime toHighLevel R L = 110Ω,C L = 50pF 40 ns 10,11 tZH Figure10 32 ns 9 30 ns 10,11R L = 60Ω,C L = 15pFtDD DifferentialOutputDelayTime Figure9 22 ns 9 DifferentialOutputTransitionTime 40 ns 10,11R L = 60Ω,C L = 15pFtTD Figure9 22 ns 9 (5) 0.2µF cap isconnectedbetween theoutputand Gnd toreduceoscillation. Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS96F172MQML DS96F174MQML

DS96F172MQML,DS96F174MQML SNOSAS8A –APRIL 2011–REVISED APRIL 2013 www.ti.com PARAMETER MEASUREMENT INFORMATION Note 10:DS96F172 withactivehighand activelowEnablesisNote 10:DS96F172 withactivehighand activelowEnablesis shown.DS96F174 has activehighEnableonly.shown.DS96F174 has activehighEnableonly. Figure7.Differentialand Common Mode Output Figure8.DifferentialOutput VoltagewithVarying Voltage Common Mode Voltage Note 8:The inputpulseissuppliedby a generatorhavingthefollowingcharacteristics:f= 1.0MHz, dutycycle= 50%, tr ≤ 5.0ns,tf≤ 5.0ns,ZO = 50Ω. Note 9:C L includesprobeand jigcapacitance. Note 10:DS96F172 withactivehighand activelowEnablesisshown.DS96F174 has activehighEnableonly. Figure9. DifferentialOutput Delay and TransitionTimes Note 8:The inputpulseissuppliedby a generatorhavingthefollowingcharacteristics:f= 1.0MHz, dutycycle= 50%, tr ≤ 5.0ns,tf≤ 5.0ns,ZO = 50Ω. Note 9:C L includesprobeand jigcapacitance. Note 10:DS96F172 withactivehighand activelowEnablesisshown.DS96F174 has activehighEnableonly. Figure10. PropagationDelay Times

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DS96F172MQML,DS96F174MQML www.ti.com SNOSAS8A –APRIL 2011–REVISED APRIL 2013 PARAMETER MEASUREMENT INFORMATION (continued) Note 8:The inputpulseissuppliedby a generatorhavingthefollowingcharacteristics:f= 1.0MHz, dutycycle= 50%, tr ≤ 5.0ns,tf≤ 5.0ns,ZO = 50Ω. Note 9:C L includesprobeand jigcapacitance. Note 11:To testtheactivelowEnableE ofDS96F172 groundE and applyan invertedwaveform toE .DS96F174 has activehighEnableonly. Figure11. tZH and tHZ Note 8:The inputpulseissuppliedby a generatorhavingthefollowingcharacteristics:f= 1.0MHz, dutycycle= 50%, tr ≤ 5.0ns,tf≤ 5.0ns,ZO = 50Ω. Note 9:C L includesprobeand jigcapacitance. Note 11:To testtheactivelowEnableE ofDS96F172 groundE and applyan invertedwaveform toE .DS96F174 has activehighEnableonly. Figure12. tZL,tLZ,tLZL NOTE Formore informationsee ApplicationBulletin,ContactProductMarketing. Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS96F172MQML DS96F174MQML

DS96F172MQML,DS96F174MQML SNOSAS8A –APRIL 2011–REVISED APRIL 2013 www.ti.com TYPICAL APPLICATION The linelengthshouldbe terminatedatbothends initscharacteristicimpedance. Stublengthsoffthemain lineshouldbe keptas shortas possible.

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DS96F172MQML,DS96F174MQML www.ti.com SNOSAS8A –APRIL 2011–REVISED APRIL 2013

REVISION HISTORY

Released Revision Section Changes 8–Apr-11 A New Release,Corporateformat 2 MDS datasheetsconvertedintoone Corp.data sheetformat.MNDS96F172M-X Rev 1A0 & MNDS96F174M-X Rev 1B0 willbe archived. Changes from Original(April2013)toRevisionA Page Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:DS96F172MQML DS96F174MQML

www.ti.com 18-Apr-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Top-Side Markings (4) Samples 5962-9076501M2A ACTIVE LCCC NAJ 20 50 TBD Call TI Call TI -55 to 125 DS96F172ME /883 Q 5962-90765 01M2A ACO 01M2A >T 5962-9076501MEA ACTIVE CDIP NFE 16 25 TBD Call TI Call TI -55 to 125 DS96F172MJ/883 5962-9076501MEA Q 5962-9076502M2A ACTIVE LCCC NAJ 20 50 TBD Call TI Call TI -55 to 125 DS96F174ME /883 Q 5962-90765 02M2A ACO 02M2A >T 5962-9076502MEA ACTIVE CDIP NFE 16 25 TBD Call TI Call TI -55 to 125 DS96F174MJ/883 5962-9076502MEA Q 5962-9076502VEA ACTIVE CDIP NFE 16 25 TBD Call TI Call TI -55 to 125 DS96F174MJ-QMLV 5962-9076502VEA Q DS96F172ME/883 ACTIVE LCCC NAJ 20 50 TBD Call TI Call TI -55 to 125 DS96F172ME /883 Q 5962-90765 01M2A ACO 01M2A >T DS96F172MJ/883 ACTIVE CDIP NFE 16 25 TBD Call TI Call TI -55 to 125 DS96F172MJ/883 5962-9076501MEA Q DS96F174ME/883 ACTIVE LCCC NAJ 20 50 TBD Call TI Call TI -55 to 125 DS96F174ME /883 Q 5962-90765 02M2A ACO 02M2A >T DS96F174MJ-QMLV ACTIVE CDIP NFE 16 25 TBD Call TI Call TI -55 to 125 DS96F174MJ-QMLV 5962-9076502VEA Q DS96F174MJ/883 ACTIVE CDIP NFE 16 25 TBD Call TI Call TI -55 to 125 DS96F174MJ/883 5962-9076502MEA Q (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

www.ti.com 18-Apr-2013 Addendum-Page 2 PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF DS96F174MQML, DS96F174MQML-SP :

• Military: DS96F174MQML
• Space: DS96F174MQML-SP NOTE: Qualified Version Definitions:
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

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