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www.ti.com SNLS389D –MAY 1998–REVISED APRIL 2013 DS9638RS-422DualHighSpeedDifferentialLineDriver Check forSamples: DS9638 1FEATURES DESCRIPTION The DS9638 is a Schottky,TTL compatible,dual 2• Single5V Supply differentiallinedriverdesigned specificallyto meet• SchottkyTechnology the EIA Standard RS-422 specifications.It is
- TTL and CMOS Compatible Inputs designed to provide unipolardifferentialdrive to twistedpairor parallelwiretransmissionlines.The• Output ShortCircuitProtection inputsareTTL compatible.The outputsaresimilarto• InputClamp Diodes totempoleTTL outputs,withactivepull-upand pull-
- Complementary Outputs down. The devicefeaturesa shortcircuitprotected activepull-upwith low output impedance and is• Minimum Output Skew (<1.0ns typical) specifiedto drive50Ω transmissionlinesat high• 50 mA Output DriveCapabilityfor50Ω speed.The mini-DIPprovideshighpackage density.TransmissionLines
- Meets EIA RS-422 Specifications
- PropagationDelay ofLess Than 10 ns
- “Glitchless” DifferentialOutput
- Delay Time StablewithVCC and Temperature Variations(<2.0ns typical)(See Figure4 )
- Extended Temperature Range Connection Diagram Figure1. 8-Lead PDIP or CDIP or SOIC (Top View) See P or NAB0008A or D Package Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1998–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SNLS389D –MAY 1998–REVISED APRIL 2013 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings(1)(2) StorageTemperatureRange CeramicDIP −65°C to+175°C Molded DIP and SO-8 −65°C to+150°C Lead Temperature CDIP (Soldering,60 sec.) 300°C PDIP (Soldering,10 sec.) 265°C Maximum Power Dissipationat25°C (3) CDIP Package 1300 mW VCC Lead PotentialtoGround −0.5Vto7V InputVoltage −0.5Vto+7V (1) “AbsoluteMaximum Ratings”arethosevaluesbeyond whichthesafetyofthedevicecannotbe verified.They arenotmeant toimply thatthedevicesshouldbe operatedattheselimits.The tablesof“ElectricalCharacteristicsprovideconditionsforactualdevice operation. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) DerateCDIP package 8.7mW/ °C above 25°C; deratePDIP package 7.5mW/ °C above 25°C; derateSOIC package 6.5mW °C above 25°C. Recommended OperatingConditions DS9638M DS9638C Min Typ Max Min Typ Max Units OutputCurrentHIGH (IOH ) −50 −50 mA OutputCurrentLOW (IOL ) 50 40 50 mA OperatingTemperature(TA) −55 25 125 0 25 70 °C
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www.ti.com SNLS389D –MAY 1998–REVISED APRIL 2013 ElectricalCharacteristics(1)(2) Over recommended operatingtemperatureand supplyvoltageranges,unlessotherwisespecified Symbol Parameter Conditions Min Typ Max Units VIH InputVoltageHIGH 2.0 V VIL InputVoltageLOW 0°C to+70°C 0.8 V −55°C to+125°C 0.5 VIC InputClamp Voltage V CC = Min,II= −18 mA −1.0 −1.2 V VOH OutputVoltageHIGH VCC = Min, IOH = −10 mA 2.5 3.5 VIH = VIH Min, VIOH = −40 mA 2.0VIL= VILMax VOL OutputVoltageLOW V CC = Min,VIH = VIH Min, 0.5 VV IL= VILMax ,IOL = 40 mA II InputCurrentatMaximum Input V CC = Max, VIMax = 5.5V 50 μAVoltage IIH InputCurrentHIGH V CC = Max, VIH = 2.7V 25 μA IIL InputCurrentLOW V CC = Max, VIL= 0.5V −200 μA IOS OutputShortCircuitCurrent V CC = Max, VO = 0V (2) −50 −150 mA VT,V T TerminatedOutputVoltage See Figure2 2.0 V VT–V T OutputBalance 0.4 V VOS ,V OS OutputOffsetVoltage 3.0 V VOS –V OS OutputOffsetBalance 0.4 V IX OutputLeakage Current T A = 25°C 100 μA−0.25V< VX < 5.5V ICC SupplyCurrent(BothDrivers) VCC = 5.5V, 45 65 mA Allinputat0V, No Load (1) Unlessotherwisespecifiedmin/max limitsapplyacrossthe−55°C to+125°C temperaturerangefortheDS9638M and acrossthe0°C to +70°C rangefortheDS9638C. AlltypicalsaregivenforVCC = 5V and TA = 25°C. (2) Allcurrentsintothedevicepinsarepositive;allcurrentsoutofthedevicepinsarenegative.Allvoltagesarereferencedtoground unlessotherwisespecified. SwitchingCharacteristics VCC = 5.0V,TA = 25°C. Symbol Parameter Conditions Min Typ Max Units tPHL PropagationDelay C L = 15 pF 10 20 ns R L = 100Ω,See Figure3tPLH 10 20 ns tf FallTime,90% –10% 10 20 ns tr RiseTime,10% –90% 10 20 ns tPO –tPO Skew Between Outputs 1.0 nsA/A and B/B Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS9638
SNLS389D –MAY 1998–REVISED APRIL 2013 www.ti.com Figure2. EquivalentCircuit DC TestCircuit Figure3. TerminatedOutput Voltageand Output Balance (1) The pulsegeneratorhas thefollowingcharacteristics: C L includesprobeand jigcapacitance. PRR = 500 kHz,tW = 100 ns, tr ≤ 5.0ns,ZO = 50Ω. Figure4. AC TestCircuitand VoltageWaveform
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www.ti.com SNLS389D –MAY 1998–REVISED APRIL 2013 TypicalCharacteristics Figure5.TypicalDelay Characteristics(a) Figure6.TypicalDelay Characteristics(b) Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS9638
SNLS389D –MAY 1998–REVISED APRIL 2013 www.ti.com
REVISION HISTORY
Changes from RevisionC (April2013)toRevisionD Page
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www.ti.com 1-Nov-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples DS9638CM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 DS963 8CM DS9638CM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS963 8CM DS9638CMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS963 8CM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
www.ti.com 1-Nov-2013 Addendum-Page 2 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS9638CMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 Pack Materials-Page 2
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