DS9637AQML TI | Alldatasheet

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www.ti.com SNLS388D –MAY 1998–REVISED APRIL 2013 DS9637ADualDifferentialLineReceiver Check forSamples: DS9637A 1FEATURES DESCRIPTION The DS9637A is a Schottkydual differentialline 2• Dual Channel receiverwhich has been specificallydesigned to• Single5V Supply satisfythe requirementsof EIA Standards RS-422

  • SatisfiesEIA Standards RS-422 and RS423 and RS-423. In addition,the DS9637A satisfiesthe requirementsofMIL-STD 188-114 and iscompatible• Built-in±35 mV Hysteresis with the International Standard CCITT• High InputCommon Mode VoltageRange recommendations.The DS9637A issuitableforuse
  • High Inputimpedance as a linereceiverindigitaldatasystems,usingeither single ended or differential,unipolaror bipolar• TTL Compatible Outputs transmission.Itrequiresa single5V power supply• SchottkyTechnology and has Schottky TTL compatibleoutputs.The• Extended Temperature Range DS9637A has an operationalinputcommon mode rangeof±7V eitherdifferentiallyortoground. Connection Diagram Top View Figure1. 8-Lead SOIC (D Package) 8-Lead PDIP (P Package) For Complete MilitaryProduct Specifications, refertotheappropriateSMD or MDS. 8-Lead CDIP (NAB Package) Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1998–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SNLS388D –MAY 1998–REVISED APRIL 2013 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings(1)(2) StorageTemperatureRange CDIP −65°C to+ 175°C PDIP −65°C to+ 150°C Lead Temperature CDIP (Soldering,30 seconds) 300°C PDIP and SOIC Packages (Soldering,10 seconds) 265°C Maximum Power Dissipation(3)at25°C CDIP 1300 mW PDIP 930 mW SOIC 810 mW VCC Lead PotentialtoGround −0.5Vto7.0V InputPotentialtoGround ±15V DifferentialInputVoltage ±15V OutputPotentialtoGround −0.5Vto+5.5V OutputSinkCurrent 50 mA ESD Susceptibility,HBM ≥2 kV (1) AbsoluteMaximum Ratingsarethosevaluesbeyond whichthesafetyofthedevicecannotbe ensured.They arenotmeant toimplythat thedevicesshouldbe operatedattheselimits.The tablesof“ElectricalCharacteristics”provideconditionsforactualdeviceoperation. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) DerateCDIP 8.7mW/ °C above 25°C; deratePDIP 7.5mW/ °C above 25°C; derateSOIC package 6.5mW/ °C above 25°C. Recommended OperatingConditions DS9637AM Min Max Units SupplyVoltage(VCC ) 4.5 5.5 V OperatingTemperature(TA) −55 +125 °C DS9637AC SupplyVoltage(VCC ) 4.75 5.25 V OperatingTemperature(TA) 0 +70 °C

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www.ti.com SNLS388D –MAY 1998–REVISED APRIL 2013 ElectricalCharacteristics(1)(2) Over recommended operatingtemperatureand supplyvoltageranges,unlessotherwisespecified Symbol Parameter Conditions Min Typ Max Units VTH DifferentialInputThreshold −7.0V≤ VCM ≤ +7.0V −0.2 +0.2 VVoltage(3) VTH(R) DifferentialInputThreshold −7.0V≤ VCM ≤ +7.0V −0.4 +0.4 VVoltage(4) II InputCurrent(5) VI= 10V,0V ≤ VCC ≤ +5.5V 1.1 3.25 mA VOL OutputVoltageLOW IOL = 20 mA, VCC = Min 0.35 0.5 V VOH OutputVoltageHIGH IOH = −1.0mA, VCC = Min 2.5 3.5 V IOS OutputShortCircuitCurrent(6) VO = 0V,VCC = Max −40 −75 −100 mA ICC SupplyCurrent VCC = Max, VI+ = 0.5V, 35 50 mA VI− = GND VHYST InputHysteresis VCM = ±7.0V(See Curves) 70 mV (1) UnlessotherwisespecifiedMin/Max limitsapplyacrossthe−55°C to+125°C temperaturerangeforDS9637AM and acrossthe0°C to +70°C rangefortheDS9637ASC. AlltypicalsaregivenforVCC = 5V and TA = 25°C. (2) Allcurrentsintothedevicepinsarepositive;allcurrentsoutofthedevicepinsarenegative.Allvoltagesarereferencedtoground unlessotherwisespecified. (3) VDIFF (DifferentialInputVoltage)= (VI+)− (VI−).VCM (Common Mode InputVoltage)= VI+ orVI−. (4) 500Ω ±1% inserieswithinputs. (5) The inputnotundertestistiedtoground. (6) Onlyone outputata timeshouldbe shorted. SwitchingCharacteristics VCC = 5.0V,TA = 25°C Symbol Parameter Conditions Min Typ Max Units tPLH PropagationDelayTime See AC TestCircuit 15 25 nsLow toHigh tPHL PropagationDelayTime See AC TestCircuit 13 25 nsHightoLow Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS9637A

SNLS388D –MAY 1998–REVISED APRIL 2013 www.ti.com EquivalentCircuit Figure2. EquivalentCircuit TypicalInput/OutputTransferCharacteristics Figure3. Figure4.

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www.ti.com SNLS388D –MAY 1998–REVISED APRIL 2013 AC TEST CIRCUIT AND WAVEFORMS Notes: C L includesjigand probecapacitance. AlldiodesareFD700 orequivalent. Figure5. AC TestCircuitand Waveforms VI Amplitude:1.0V Offset:0.5V PulseWidth:100 ns PRR: 5.0MHz tr = tf≤ 5.0ns Figure6. TypicalApplications Notes: R T ≥ 50Ω forRS-422 operation. R T combined withinputimpedance ofreceiversmust be greaterthan90Ω. Figure7. RS-422 System Application(FIPS1020)DifferentialSimplex Bus Transmission Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS9637A

SNLS388D –MAY 1998–REVISED APRIL 2013 www.ti.com

REVISION HISTORY

Changes from RevisionC (April2013)toRevisionD Page

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www.ti.com 7-Oct-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) 5962-8752401PA Active Production CDIP (NAB) | 8 40 | TUBE No SNPB Level-1-NA-UNLIM See DS9637AMJ/883 DS9637AMJ/883 5962-87524 01PA Q ACO 01PA Q >T DS9637AMJ/883 Active Production CDIP (NAB) | 8 40 | TUBE No SNPB Level-1-NA-UNLIM - DS9637AMJ/883 5962-87524 01PA Q ACO 01PA Q >T (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

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PACKAGE MATERIALS INFORMATION www.ti.com 25-Aug-2025 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) 5962-8752401PA NAB CDIP 8 40 506.98 15.24 13440 NA DS9637AMJ/883 NAB CDIP 8 40 506.98 15.24 13440 NA Pack Materials-Page 1

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