DS96172_15 TI1 | Alldatasheet
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Technical content
- Transmission Rate to 10 Mbs and are optimized for balanced multipoint data bus transmission at rates up to 10 Mbps. The drivers• Tri-state Outputs have wide positive and negative common mode• Designed for Multipoint Bus Transmission range for multipoint applications in noisy
- Common Mode Output Voltage Range: −7V to environments. Positive and negative current-limiting +12V is provided which protects the drivers from line fault conditions over a +12V to−7.0V common mode• Operates from Single +5V Supply range. A thermal shutdown feature is also provided• Thermal Shutdown Protection and occurs at junction temperature of approximately
- DS96172/DS96174 are Lead and Function 160°C. The DS96172 features an active high and Compatible with the SN75172/75174 or the active low Enable, common to all four drivers. The AM26LS31/MC3487, Respectively DS96174 features separate active high Enables for each driver pair. Compatible RS-485 receivers, transceivers, and repeaters are also offered to provide optimum bus performance. The respective device types are DS96173, DS96175, DS96176, AND DS96177. Connection Diagrams
Figure 1. 16-Lead PDIP DS96172 Figure 2. 16-Lead PDIP DS96174 Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2All trademarks are the property of their respective owners. necessarily include testing of all parameters.
DS96172, DS96174 SNLS390D –JUNE 1998–REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings(1)(2) Storage Temperature Range Molded PDIP −65°C to +150°C Operating Temperature Range 0°C to +70°C Lead Temperature Molded PDIP (soldering, 10 sec.) 265°C Supply Voltage 7V Enable Input Voltage 5.5V Maximum Power Dissipation(3) 25°C (1) Absolute Maximum Ratings are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that the devices should be operated at these limits. The tables of Electrical Characteristics provide conditions for actual device operation. (2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. (3) Derate molded PDIP package 16mW/°C above 25°C. Recommended OperatingConditions Min Typ Max Units Supply Voltage (VCC ) 4.75 5 5.25 V Common Mode Output Voltage (VOC ) −7 +12 V Output Current HIGH (IOH ) −60 mA Output Current LOW (IOL ) 60 mA Operating Temperature (TA) 0 25 70 °C
2 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links:DS96172 DS96174 DS96172 - Obsolete DS96174 - Not Recommended For New Designs
DS96172, DS96174 www.ti.com SNLS390D –JUNE 1998–REVISED APRIL 2013 Electrical Characteristics(1)(2) over recommended temperature and supply voltage ranges, unless otherwise specified Symbol Parameter Conditions Min Typ Max Units VIH Input Voltage HIGH 2 V VIL Input Voltage LOW 0.8 V VOH Output Voltage HIGH IOH = −20 mA 3.1 V VOL Output Voltage LOW IOL = 20 mA 0.8 V VIC Input Clamp Voltage II= −18 mA −1.5 V |VOD1 | Differential Output Voltage IO = 0 mA 6 V |VOD2 | Differential Output Voltage R L = 54Ω,SeeFigure 3 1.5 2 V R L = 100Ω,See Figure 3 2 2.3 V Δ|VOD | Change in Magnitude of Differential Output RL = 54Ω or 100Ω,See Figure 3 ±0.2 VVoltage(3) VOC Common Mode Output Voltage(4) R L = 54Ω,SeeFigure 3 3 V Δ|VOC | Change in Magnitude of Common Mode Output ±0.2 VVoltage(3) IO Output Current with Power Off VCC = 0V, VO = −7.0V to 12V ±100 μA IOZ High Impedance State Output Current VO = −7.0V to 12V ±50 ±200 μA IIH Input Current HIGH VI= 2.7V 20 μA IIL Input Current LOW VI= 0.5V −100 μA IOS Short Circuit Output Current(5) VO = −7.0V −250 VO = 0V −150 mA VO = VCC 150 VO = 12V 250 ICC Supply Current (All Drivers) No Load Outputs Enabled 50 70 mA Output Disabled 50 60 (1) Unless otherwise specified min/max limits apply across the 0°C to +70°C range for the DS96172/DS96174. All typicals are given for VCC = 5V and TA = 25°C. (2) All currents into the device pins are positive; all currents out of the device pins are negative. All voltages are referenced to ground unless otherwise specified. (3) Δ |VOD | andΔ|VOC | are the changes in magnitude of VOD and VOC respectively, that occur when the input is changed from a high level to a low level. (4) In EIA Standards RS-422A and RS-485, VOC, which is the average of the two output voltages with respect to ground, is called output offset voltage, VOS . (5) Only one output at a time should be shorted. Copyright © 1998–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links:DS96172 DS96174 DS96172 - Obsolete DS96174 - Not Recommended For New Designs
Figure 3. Differential and Common Mode Output Voltage (2) C L includes probe and jig capacitance. (3) DS96172 with active high and active low Enables is shown here. DS96174 has active high Enable only. (4) To test the active low Enable E of DS96172, ground E and apply an inverted waveform to E. DS96174 has active high Enable only.
4 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated
Figure 7. tPZL and tPLZ Table 1. DS96172
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Table 2. DS96174(1)
DS96172, DS96174 SNLS390D –JUNE 1998–REVISED APRIL 2013 www.ti.com Typical Application Figure 8. NOTE The line length should be terminated at both ends in its characteristic impedance. Stub lengths off the main line should be kept as short as possible.
8 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links:DS96172 DS96174 DS96172 - Obsolete DS96174 - Not Recommended For New Designs
DS96172, DS96174 www.ti.com SNLS390D –JUNE 1998–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision C (April 2013) to Revision D Page Copyright © 1998–2013, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Links:DS96172 DS96174 DS96172 - Obsolete DS96174 - Not Recommended For New Designs
www.ti.com 16-Oct-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples DS96174CN LIFEBUY PDIP NFG 16 25 TBD Call TI Call TI 0 to 70 DS96174CN DS96174CN/NOPB LIFEBUY PDIP NFG 16 25 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 DS96174CN (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
www.ti.com 16-Oct-2015 Addendum-Page 2 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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