DS92001 TI | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 17
Technical content
www.ti.com SNLS147F –JUNE 2002–REVISED APRIL 2013 DS920013.3VB/LVDS-BLVDSBuffer Check forSamples: DS92001 1FEATURES DESCRIPTION The DS92001 B/LVDS-BLVDS Buffertakesa BLVDS 2• Single+3.3V Supply inputsignaland providesa BLVDS outputsignal.In• ReceiverInputsAccept LVDS/CML/LVPECL many largesystems,signalsare distributedacrossSignals backplanes.One of the limitingfactorsforsystem
- TRI-STATE Outputs speed isthe "stublength"or the distancebetween thetransmissionlineand theunterminatedreceivers• ReceiverInputThreshold< ±100 mV on individualcards. Although it is generally• FastPropagationDelay of1.4ns (typ) recognizedthatthisdistanceshouldbe as shortas
- Low Jitter400 Mbps FullyDifferentialData possibletomaximizesystem performance,real-world Path packagingconcernsoftenmake itdifficulttomake the stubsas shortas thedesignerwouldlike.• Compatible withBLVDS 10-bitSerDes (40MHz) The DS92001 has edge transitionsoptimizedfor• Compatible withANSI/TIA/EIA-644-ALVDS multidropbackplaneswhere the switchingfrequencyStandard isinthe200 MHz rangeorless.The outputedge rate• AvailableinSOIC and Space Saving WSON iscriticalinsome systems where longstubsmay bePackage present,and utilizinga slow transitionallowsfor
- IndustrialTemperature Range longerstublengths. The DS92001, availableinthe WSON package,will allowthe receiverinputsto be placedverycloseto the main transmissionline,thus improvingsystem performance. A wide inputdynamic range allowsthe DS92001 to receivedifferentialsignalsfrom LVPECL, CML as wellas LVDS sources.Thiswillallowthe deviceto also fillthe roleof an LVPECL-BLVDS or CML- BLVDS translator. Connection and Block Diagrams Figure1.SOIC Package Number D0008A Figure2.WSON Package Number NGK0008A Top View Top View Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2002–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SNLS147F –JUNE 2002–REVISED APRIL 2013 www.ti.com Table1.FunctionalOperation BLVDS Inputs BLVDS Outputs [IN+]− [IN−] OUT+ OUT − VID ≥ 0.1V H L VID ≤ −0.1V L H −0.1V≤ VID ≤ 0.1V Undefined Undefined These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings(1)(2) SupplyVoltage(VCC ) −0.3Vto+4V LVCMOS/LVTTL InputVoltage(EN) −0.3Vto(VCC + 0.3V) B/LVDS ReceiverInputVoltage(IN+,IN−) −0.3Vto+4V BLVDS DriverOutputVoltage(OUT+, OUT −) −0.3Vto+4V BLVDS OutputShortCircuitCurrent Continuous JunctionTemperature +150°C StorageTemperatureRange −65°C to+150°C Lead TemperatureRange Soldering(4sec.) +260°C Maximum Package Power Dissipationat D Package 726 mW 25°C DerateD Package 5.8mW/ °C above +25°C DerateNGK Package 19.49mW/ °C above +25°C ESD Ratings (HBM, 1.5kΩ,100pF) ≥2.5kV (EIAJ,0Ω,200pF) ≥250V (1) “AbsoluteMaximum Ratings”arethosevaluesbeyond whichthesafetyofthedevicecannotbe ensured.They arenotmeant toimply thatthedeviceshouldbe operatedattheselimits.The tableof“ElectricalCharacteristics”specifiesconditionsofdeviceoperation. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityand specifications. Recommended OperatingConditions Min Typ Max Units SupplyVoltage(VCC ) 3.0 3.3 3.6 V ReceiverDifferentialInputVoltage(VID)withVCM =1.2V 0.1 2.4 |V| OperatingFreeAirTemperature −40 +25 +85 °C B/LVDS InputRise/Fall20% to80% 2 20 ns
2 SubmitDocumentationFeedback Copyright© 2002–2013,Texas InstrumentsIncorporated
ProductFolderLinks:DS92001
www.ti.com SNLS147F –JUNE 2002–REVISED APRIL 2013 ElectricalCharacteristics Over recommended operatingsupplyand temperaturerangesunlessotherwisespecified.(1)(2) Symbol Parameter Conditions Min Typ Max Units LVCMOS/LVTTL DC SPECIFICATIONS (EN) VIH HighLevelInputVoltage 2.0 VCC V VIL Low LevelInputVoltage GND 0.8 V IIH HighLevelInputCurrent VIN = VCC or2.0V +7 +20 μA IIL Low LevelInputCurrent VIN = GND or0.8V −10 ±1 +10 μA VCL InputClamp Voltage ICL = −18 mA −0.6 −1.5 V BLVDS OUTPUT DC SPECIFICATIONS (OUT) |VOD | DifferentialOutputVoltage(1) R L = 27Ω 250 350 500 mV R L = 50Ω 350 450 600 mV ΔVOD Change inMagnitudeofVOD forComplimentaryOutput RL = 27Ω or50Ω See Figure3 and Figure4 20 mV States VOS OffsetVoltage R L = 27Ω orR L = 50Ω 1.1 1.25 1.375 V ΔVOS Change inMagnitudeofVOS See Figure3 forComplimentaryOutput 2 20 mV States IOZ OutputTRI-STATE Current EN = 0V,VOUT = VCC orGND −20 ±5 +20 μA IOFF Power-OffLeakage Current VCC = 0V orOpen Circuit,VOUT = 3.6V −20 ±5 +20 μA IOS1 OutputShortCircuit EN = VCC ,VCM = 1.2V,VID = 200mV, VOUT+ = 0V,or −30 −60 mACurrent(3) VID = −200mV, VCM = 1.2V,VOUT − = 0V VID = −200mV, VCM = 1.2V,VOUT+ = VCC ,or 53 80 mAVID = 200mV, VCM =1.2V,VOUT − = VCC IOSD DifferentialOutputShort EN = VCC ,VID = |200mV|,VCM .= 1.2V,VOD = 0V CircuitCurrent(3) (connecttrueand complement outputsthrougha |30| |42| mA currentmeter) B/LVDS RECEIVER DC SPECIFICATIONS (IN) VTH DifferentialInputHigh VCM = +0.05V,+1.2V or+3.25V −30 −5 mV Threshold(4) VTL DifferentialInputLow −70 −30 mV Threshold(4) VCMR Common Mode Voltage |VID|/2 VCC V Range (4) −|VID|/2 IIN InputCurrent VIN = VCC VCC = 3.6Vor0V |1.5| |20| μA VIN = 0V |1.5| |20| μA ΔIIN Change inMagnitudeofIIN VIN = VCC 1 6 μA VIN = 0V 1 6 μA SUPPLY CURRENT ICCD TotalDynamic Supply EN = VCC ,R L = 27Ω or50Ω,C L = 15 pF, 50 65 mA Current(includesload Freq.= 200MHz 50% dutycycle, current) VID = 200mV, VCM = 1.2V ICCZ TRI-STATE SupplyCurrent EN = 0V,Freq.= 200MHz 50% dutycycle, 36 46 mA VID = 200mV, VCM = 1.2V (1) Currentintodevicepinsisdefinedas positive.Currentoutofdevicepinsisdefinedas negative.Allvoltagesarereferencedtoground exceptVID,VOD ,VTH ,VTL,and ΔVOD .VOD has a valueand direction.Positivedirectionmeans OUT+ isa more positivevoltagethan OUT −. (2) AlltypicalaregivenforVCC = +3.3V and TA = +25°C, unlessotherwisestated. (3) Outputshortcircuitcurrent(IOS )isspecifiedas magnitudeonly,minus signindicatesdirectiononly. (4) The parametersarespecifiedby design.The limitsarebased on statisticalanalysisofthedeviceperformanceoverthePVT (process, voltageand temperature)range. Copyright© 2002–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS92001
SNLS147F –JUNE 2002–REVISED APRIL 2013 www.ti.com AC ElectricalCharacteristics Over recommended operatingsupplyand temperaturerangesunlessotherwisespecified.(1) Symbol Parameter Conditions Min Typ Max Units LVDS OUTPUT AC SPECIFICATIONS (OUT) tPHLD DifferentialPropagationDelayHigh VID = 200mV, VCM = 1.2V, 1.0 1.4 2.0 ns toLow (2) R L = 27Ω or50Ω,C L = 15pF See Figure5 and Figure6tPLHD DifferentialPropagationDelayLow 1.0 1.4 2.0 ns toHigh(2) tSKD1 PulseSkew |tPLHD − tPHLD | 0 20 200 ps (measureofdutycycle)(3)(4) tSKD3 Part-to-PartSkew (3)(5) 0 200 300 ps tSKD4 Part-to-PartSkew (3)(6) 0 1 ns tLHT RiseTime(3)(2) R L = 50Ω or27Ω,C L = 15pF 0.350 0.6 1.0 ns 20% to80% points See Figure5 and Figure7 tHLT FallTime(3)(2) 0.350 0.6 1.0 ns 80% to20% points tPHZ DisableTime (ActiveHightoZ) R L = 50Ω,C L = 15pF See Figure8 and Figure9 3 25 ns tPLZ DisableTime (ActiveLow toZ) 3 25 ns tPZH EnableTime (ZtoActiveHigh) 100 120 ns tPZL EnableTime (ZtoActiveLow) 100 120 ns tDJ LVDS Data Jitter,Deterministic VID = 300mV; PRBS = 223 − 1 data;VCM = 1.2Vat 78 ps(Peak-to-Peak)(7) 400Mbps (NRZ) tRJ LVDS ClockJitter,Random (7) VID = 300mV; VCM = 1.2Vat200MHz clock 36 ps fMAX Maximum specifiedfrequency(8) VID = 200mV, VCM = 1.2V 200 300 MHz (1) AlltypicalaregivenforVCC = +3.3V and TA = +25°C, unlessotherwisestated. (2) Propagationdelay,riseand falltimesarespecifiedby designand characterizationto200MHz. Generatorforthesetests:50MHz ≤ f≤ 200MHz, Zo = 50Ω,tr,tf≤ 0.5ns.Generatorused was HP8130A (300MHz capability). (3) The parametersarespecifiedby design.The limitsarebased on statisticalanalysisofthedeviceperformanceoverthePVT (process, voltageand temperature)range. (4) tSKD1 ,|tPLHD − tPHLD |,isthemagnitudedifferenceindifferentialpropagationdelaytimebetween thepositivegoingedge and thenegative goingedge ofthesame channel(ameasure ofdutycycle). (5) tSKD3 ,ParttoPartSkew, isdefinedas thedifferencebetween theminimum and maximum specifieddifferentialpropagationdelays.This specificationappliestodevicesatthesame VCC and within5°C ofeach otherwithintheoperatingtemperaturerange.Thisparameter specifiedby designand characterization. (6) tSKD4 ,ParttoPartSkew, isthedifferentialchannel-to-channelskew ofany eventbetween devices.Thisspecificationappliestodevices overrecommended operatingtemperatureand voltageranges,and acrossprocessdistribution.tSKD4 isdefinedas |Max − Min| differentialpropagationdelay. (7) The parametersarespecifiedby design.The limitsarebased on statisticalanalysisofthedeviceperformanceoverthePVT rangewith thefollowingtestequipmentsetup:Agilent86130A used as stimulus,5 feetofRG142B cablewithDUT testboardand Agilent86100A (digitalscope mainframe)withAgilent86122A (20GHz scope module).Data inputjitterpk topk = 22 picoseconds;Clockinputjitter= 24 picoseconds;tDJ measured 100 picoseconds,tRJ measured 60 picoseconds. (8) fMAX test:Generator(HP8133A orequivalent),Inputdutycycle= 50%. Outputcriteria:VOD ≥ 200mV, DutyCyclebetterthan45/55%. Thisspecificationisspecifiedby designand characterization.A minimum isspecified,whichmeans thatthedevicewilloperateto specifiedconditionsfromDC totheminimum specifiedAC frequency.The typicalvalueisalwaysgreaterthantheminimum specification.
4 SubmitDocumentationFeedback Copyright© 2002–2013,Texas InstrumentsIncorporated
ProductFolderLinks:DS92001
www.ti.com SNLS147F –JUNE 2002–REVISED APRIL 2013 DC TestCircuits Figure3. DifferentialDriverDC TestCircuit Figure4. DifferentialDriverFullLoad DC TestCircuit AC TestCircuitsand Timing Diagrams Figure5. BLVDS Output Load Figure6. PropagationDelay Low-to-Highand High-to-Low Figure7. BLVDS Output TransitionTime Copyright© 2002–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS92001
SNLS147F –JUNE 2002–REVISED APRIL 2013 www.ti.com Figure8. TRI-STATE Delay TestCircuit Figure9. Output activetoTRI-STATE and TRI-STATE toactiveoutputtime PIN DESCRIPTIONS Input/OutpPin Name Pin # Descriptionut GND 1 P Ground IN − 2 I InvertingreceiverB/LVDS inputpin IN+ 3 I Non-invertingreceiverB/LVDS inputpin N/C 4 NA "NO CONNECT" pin VCC 5 P Power Supply,3.3V± 0.3V. OUT+ 6 O Non-invertingdriverBLVDS outputpin OUT - 7 O InvertingdriverBLVDS outputpin EN 8 I Enablepin.When EN isLOW, thedriverisdisabledand theBLVDS outputs areinTRI-STATE. When EN isHIGH, thedriverisenabled.LVCMOS/LVTTL levels.
6 SubmitDocumentationFeedback Copyright© 2002–2013,Texas InstrumentsIncorporated
ProductFolderLinks:DS92001
connector connector connector Redundant Serializer DS92001 www.ti.com SNLS147F –JUNE 2002–REVISED APRIL 2013 TypicalApplications Figure10. Backplane Stub-HiderApplication Figure11. Cable RepeaterApplication Copyright© 2002–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS92001
SNLS147F –JUNE 2002–REVISED APRIL 2013 www.ti.com
APPLICATION INFORMATION
The DS92001 can be used as a "stub-hider."Inmany systems,signalsare distributedacrossbackplanes,and one ofthelimitingfactorsforsystem speed isthe"stublength"orthedistancebetween thetransmissionlineand theunterminatedreceiverson theindividualcards.See Figure10.Althoughitisgenerallyrecognizedthatthis distanceshouldbe as shortas possibletomaximize system performance,real-worldpackagingconcernsand PCB designsoftenmake itdifficultto make the stubsas shortas the designerwould like.The DS92001, availableinthe WSON package,can improvesystem performanceby allowingthe receiverto be placedvery closeto the main transmissionlineeitheron the backplaneitselfor verycloseto the connectoron the card. LongertracestotheLVDS receivermay be placedaftertheDS92001. ThisverysmallWSON package isa 75% space savingsovertheSOIC package. The DS92001 may alsobe used as a repeateras shown inFigure11.The signalisrecoveredand redrivenatfull strengthdown thefollowingsegment.The DS92001 may alsobe used as a leveltranslator,as itacceptsLVDS, BLVDS, and LVPECL inputs. POWER DECOUPLING RECOMMENDATIONS Bypass capacitorsmust be used on power pins.Use highfrequencyceramic(surfacemount isrecommended) 0.1μF and 0.01μF capacitorsinparallelatthepower supplypinwiththesmallestvaluecapacitorclosesttothe devicesupplypin.Additionalscatteredcapacitorsovertheprintedcircuitboardwillimprovedecoupling.Multiple viasshouldbe used to connectthe decouplingcapacitorsto the power planes.A 10μF (35V)or greatersolid tantalumcapacitorshouldbe connectedatthepower entrypointon theprintedcircuitboardbetween thesupply and ground. PC BOARD CONSIDERATIONS Use atleast4 PCB boardlayers(toptobottom):LVDS signals,ground,power,TTL signals. IsolateTTL signalsfromLVDS signals,otherwisetheTTL signalsmay coupleontotheLVDS lines.Itisbestto putTTL and LVDS signalson differentlayerswhichareisolatedby a power/groundplane(s). Keep driversand receiversas closetothe(LVDS portside)connectorsas possible. For PC board considerationsforthe WSON package, please referto applicationnote AN-1187 “Leadless Leadframe Package” (LiteratureNumber SNOA401). Itis importantto note thatto optimizesignalintegrity (minimizejitterand noisecoupling),theWSON thermallandpad,whichisa metal(normallycopper)rectangular regionlocatedunderthepackage as seen inFigure12,shouldbe attachedtogroundand match thedimensions oftheexposed pad on thePCB (1:1ratio). Figure12. WSON Thermal Land Pad and Pin Pads DIFFERENTIAL TRACES Use controlledimpedance traceswhichmatch thedifferentialimpedance ofyourtransmissionmedium (ie.cable) and terminationresistor.Run thedifferentialpairtracelinesas closetogetheras possibleas soon as theyleave the IC (stubsshouldbe < 10mm long).This willhelp eliminatereflectionsand ensure noiseiscoupledas common-mode. Infact,we have seen thatdifferentialsignalswhich are 1mm apartradiatefarlessnoisethan traces3mm apartsincemagneticfieldcancellationismuch betterwiththe closertraces.In addition,noise induced on the differentiallinesis much more likelyto appear as common-mode which is rejectedby the receiver.
8 SubmitDocumentationFeedback Copyright© 2002–2013,Texas InstrumentsIncorporated
ProductFolderLinks:DS92001
www.ti.com SNLS147F –JUNE 2002–REVISED APRIL 2013 Match electricallengthsbetween tracesto reduce skew. Skew between the signalsof a pairmeans a phase differencebetween signalswhichdestroysthemagneticfieldcancellationbenefitsofdifferentialsignalsand EMI willresult.Do not relysolelyon the auto-routefunctionfordifferentialtraces.Carefullyreviewdimensionsto match differentialimpedance and provideisolationforthe differentiallines.Minimizethe number of viasand otherdiscontinuitieson theline. Avoid90° turns(thesecause impedance discontinuities).Use arcsor45° bevels. Withina pairof traces,the distancebetween the two tracesshouldbe minimizedto maintaincommon-mode rejectionof the receivers.On the printedcircuitboard, thisdistanceshould remain constantto avoid discontinuitiesindifferentialimpedance.Minorviolationsatconnectionpointsareallowable. TERMINATION Use a terminationresistorwhichbestmatches thedifferentialimpedance oryourtransmissionline.The resistor should be between 90Ω and 130Ω forpoint-to-pointlinks.Multidrop(driverin the middle)or multipoint configurationsare typicallyterminatedat both ends. The terminationvaluemay be lowerthan 100Ω due to loadingeffectsand inthe50Ω to100Ω range.Remember thatthecurrentmode outputsneed thetermination resistortogeneratethedifferentialvoltage. Surface mount 1% - 2% resistorsare the best.PCB stubs,component lead,and the distancefrom the terminationtothereceiverinputsshouldbe minimized.The distancebetween theterminationresistorand the receivershouldbe < 10mm (12mm MAX). PROBING LVDS TRANSMISSION LINES Always use highimpedance (> 100kΩ),low capacitance(< 2 pF) scope probeswitha wide bandwidth(1 GHz) scope.Improperprobingwillgivedeceivingresults. Copyright© 2002–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:DS92001
SNLS147F –JUNE 2002–REVISED APRIL 2013 www.ti.com
REVISION HISTORY
Changes from RevisionE (April2013)toRevisionF Page
10 SubmitDocumentationFeedback Copyright© 2002–2013,Texas InstrumentsIncorporated
ProductFolderLinks:DS92001
www.ti.com 22-Apr-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Top-Side Markings (4) Samples DS92001TLD ACTIVE WSON NGK 8 1000 TBD Call TI Call TI -40 to 85 92001 DS92001TLD/NOPB ACTIVE WSON NGK 8 1000 Green (RoHS & no Sb/Br) SN Level-3-260C-168 HR -40 to 85 92001 DS92001TMA ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 85 92001 TMA DS92001TMA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 92001 TMA DS92001TMAX ACTIVE SOIC D 8 2500 TBD Call TI Call TI -40 to 85 92001 TMA DS92001TMAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 92001 TMA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
www.ti.com 22-Apr-2013 Addendum-Page 2 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS92001TLD WSON NGK 8 1000 210.0 185.0 35.0 DS92001TLD/NOPB WSON NGK 8 1000 213.0 191.0 55.0 DS92001TMAX SOIC D 8 2500 349.0 337.0 45.0 DS92001TMAX/NOPB SOIC D 8 2500 349.0 337.0 45.0 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 Pack Materials-Page 2
www.ti.com LDA08A (Rev C)
Texas InstrumentsIncorporatedand itssubsidiaries(TI)reservetherighttomake corrections,enhancements,improvementsand other changes toitssemiconductorproductsand servicesperJESD46, latestissue,and todiscontinueany productorserviceperJESD48, latest issue.Buyersshouldobtainthelatestrelevantinformationbeforeplacingordersand shouldverifythatsuch informationiscurrentand complete.Allsemiconductorproducts(alsoreferredtohereinas “components”)aresoldsubjecttoTI’s termsand conditionsofsale suppliedatthetimeoforderacknowledgment. TIwarrantsperformanceofitscomponents tothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI’s terms and conditionsofsaleofsemiconductorproducts.Testingand otherqualitycontroltechniquesareused totheextentTIdeems necessary tosupportthiswarranty.Exceptwhere mandated by applicablelaw,testingofallparametersofeach component isnotnecessarily performed. TIassumes no liabilityforapplicationsassistanceorthedesignofBuyers’products.Buyersareresponsiblefortheirproductsand applicationsusingTIcomponents.To minimizetherisksassociatedwithBuyers’productsand applications,Buyersshouldprovide adequatedesignand operatingsafeguards. TIdoes notwarrantorrepresentthatany license,eitherexpressorimplied,isgrantedunderany patentright,copyright,mask work right,or otherintellectualpropertyrightrelatingtoany combination,machine,orprocessinwhichTIcomponents orservicesareused.Information publishedby TIregardingthird-partyproductsorservicesdoes notconstitutea licensetouse such productsorservicesora warrantyor endorsementthereof.Use ofsuch informationmay requirea licensefroma thirdpartyunderthepatentsorotherintellectualpropertyofthe thirdparty,ora licensefromTIunderthepatentsorotherintellectualpropertyofTI. ReproductionofsignificantportionsofTIinformationinTIdatabooks ordatasheetsispermissibleonlyifreproductioniswithoutalteration and isaccompaniedby allassociatedwarranties,conditions,limitations,and notices.TIisnotresponsibleorliableforsuch altered documentation.Informationofthirdpartiesmay be subjecttoadditionalrestrictions. ResaleofTIcomponents orserviceswithstatementsdifferentfromorbeyond theparametersstatedby TIforthatcomponent orservice voidsallexpressand any impliedwarrantiesfortheassociatedTIcomponent orserviceand isan unfairand deceptivebusinesspractice. TIisnotresponsibleorliableforany such statements. Buyeracknowledgesand agreesthatitissolelyresponsibleforcompliancewithalllegal,regulatoryand safety-relatedrequirements concerningitsproducts,and any use ofTIcomponents initsapplications,notwithstandingany applications-relatedinformationorsupport thatmay be providedby TI.Buyerrepresentsand agreesthatithas allthenecessaryexpertisetocreateand implementsafeguardswhich anticipatedangerousconsequencesoffailures,monitorfailuresand theirconsequences,lessenthelikelihoodoffailuresthatmightcause harm and takeappropriateremedialactions.BuyerwillfullyindemnifyTIand itsrepresentativesagainstany damages arisingoutoftheuse ofany TIcomponents insafety-criticalapplications. Insome cases,TIcomponents may be promotedspecificallytofacilitatesafety-relatedapplications.Withsuch components,TI’s goalisto helpenablecustomerstodesignand createtheirown end-productsolutionsthatmeet applicablefunctionalsafetystandardsand requirements.Nonetheless,such components aresubjecttotheseterms. No TIcomponents areauthorizedforuse inFDA ClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersoftheparties have executeda specialagreementspecificallygoverningsuch use. OnlythoseTIcomponents whichTIhas specificallydesignatedas militarygradeor“enhanced plastic”aredesignedand intendedforuse in military/aerospaceapplicationsorenvironments.Buyeracknowledgesand agreesthatany militaryoraerospaceuse ofTIcomponents whichhave not been so designatedissolelyattheBuyer's risk,and thatBuyerissolelyresponsibleforcompliancewithalllegaland regulatoryrequirementsinconnectionwithsuch use. TIhas specificallydesignatedcertaincomponents as meetingISO/TS16949 requirements,mainlyforautomotiveuse.Inany case ofuse of non-designatedproducts,TIwillnotbe responsibleforany failuretomeet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotiveand Transportationwww.ti.com/automotive Amplifiers amplifier.ti.com Communicationsand Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP ® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energyand Lighting www.ti.com/energy Clocksand Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space,Avionicsand Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Videoand Imaging www.ti.com/video RFID www.ti-rfid.com OMAP ApplicationsProcessors www.ti.com/omap TIE2E Community e2e.ti.com WirelessConnectivity www.ti.com/wirelessconnectivity MailingAddress:Texas Instruments,PostOfficeBox 655303,Dallas,Texas 75265 Copyright© 2013,Texas InstrumentsIncorporated