Driver IC

DS91D180TMA/NOPB

Texas Instruments

100 MHz M-LVDS Line Driver/Receiver Pair

Manufacturer: Texas Instruments

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CLK1A (8 KHz) CLK1B (8 KHz) CLK2A (19.44 MHz) CLK2B (19.44 MHz) CLK3A (User Defined up to 100 MHz) CLK3B (User Defined up to 100 MHz) 80W RT 80W RT 80W RT 80W RT 80W RT 80W RT 80W RT 80W RT 80W RT 80W RT 80W RT 80W RT ATCA Backplane Slot Card N Slot Card N+1 MLVDS Drivers/ReceiversMLVDS Drivers/Receivers DS91C180,DS91D180 www.ti.com SNLS158M –MARCH 2006–REVISED APRIL 2013 DS91D180/DS91C180100MHzM-LVDSLineDriver/ReceiverPair Check forSamples: DS91C180 ,DS91D180 1FEATURES DESCRIPTION The DS91D180 and DS91C180 are 100 MHz M- 2• DC to100+ MHz /200+ Mbps Low Power, Low LVDS (MultipointLow VoltageDifferentialSignaling)EMI Operation linedriver/receiverpairsdesigned for applications• OptimalforATCA, uTCA Clock Distribution thatutilizemultipointnetworks(e.g.clockdistribution Networks in ATCA and uTCA based systems).M-LVDS is a bus interfacestandard(TIA/EIA-899)optimizedfor• Meets or Exceeds TIA/EIA-899M-LVDS multidropnetworks.Controllededge rates,tightinputStandard receiverthresholdsand increaseddrivestrengthare• Wide InputCommon Mode Voltagefor sone of the key enhancments thatmake M-LVDSIncreasedNoise Immunity devicesan idealchoicefordistributingsignalsvia

DS91D180 has Type 1 ReceiverInput multipointnetworks.
DS91C180 has Type 2 ReceiverInputforFail- The DS91D180/DS91C180 driver input acceptsSafe Functionality LVTTL/LVCMOS signals and converts them to differentialM-LVDS signal levels. The• IndustrialTemperature Range DS91D180/DS91C180 receiveracceptslow voltage• Space Saving SOIC-14 Package (JEDEC MS- differentialsignals(LVDS, B-LVDS, M-LVDS, LV-012) PECL and CML) and convertsthem to3V LVCMOS signals.The DS91D180 devicehas a M-LVDS type1 receiverinputwithno offset.TheDS91C180 device has a type 2 receiverinputwhich enable failsafe functionality. TypicalApplicationinan ATCA Clock DistributionNetwork Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2006–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

2.4 V -2.4 V 50 mV -50 mV 150 mV Transition Region Type 1 Type 2 VID DS91C180,DS91D180 SNLS158M –MARCH 2006–REVISED APRIL 2013 www.ti.com Figure1. Connection Diagram Top View See Package Number D0014A Logic Diagram M-LVDS ReceiverTypes The EIA/TIA-899M-LVDS standardspecifiestwo differenttypesofreceiverinputstages.A type1 receiverhas a conventionalthresholdthatiscenteredatthemidpointoftheinputamplitude,VID/2.A type2 receiverhas a built inoffsetthatis100mV greaterthanVID/2.The type2 receiveroffsetactsas a failsafecircuitwhere open orshort circuitsattheinputwillalwaysresultintheoutputstagebeingdriventoa lowlogicstate. Figure2. M-LVDS ReceiverInputThresholds These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates.

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DS91C180,DS91D180 www.ti.com SNLS158M –MARCH 2006–REVISED APRIL 2013 AbsoluteMaximum Ratings (1)(2) SupplyVoltage,VCC −0.3Vto+4V ControlInputVoltages −0.3Vto(VCC + 0.3V) DriverInputVoltage −0.3Vto(VCC + 0.3V) DriverOutputVoltages −1.8Vto+4.1V ReceiverInputVoltages −1.8Vto+4.1V ReceiverOutputVoltage −0.3Vto(VCC + 0.3V) Maximum Package Power Dissipationat+25°C SOIC Package 1.1W DerateSOIC Package 8.8mW/ °C above +25°C ThermalResistance(4-Layer,2 oz.Cu, JEDEC) θJA 113.7°C/W θJC 36.9°C/W Maximum JunctionTemperature 150°C StorageTemperatureRange −65°C to+150°C Lead Temperature(Soldering,4 seconds) 260°C ESD Ratings: (HBM 1.5kΩ,100pF) ≥ 5 kV (EIAJ0Ω,200pF) ≥ 250 V (CDM 0Ω,0pF) ≥ 1000 V (1) “AbsoluteMaximum Ratings”arethosebeyond whichthesafetyofthedevicecannotbe ensured.They arenotmeant toimplythatthe deviceshouldbe operatedattheselimits.The tablesof“ElectricalCharacteristics”provideconditionsforactualdeviceoperation. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityand specifications. Recommended OperatingConditions Min Typ Max Units SupplyVoltage,VCC 3.0 3.3 3.6 V VoltageatAny Bus Terminal(SeparateorCommon-Mode) −1.4 +3.8 V DifferentialInputVoltageVID 2.4 V HighLevelInputVoltageVIH 2.0 VCC V Low LevelInputVoltageVIL 0 0.8 V OperatingFreeAirTemperatureTA −40 +25 +85 °C ElectricalCharacteristics Over recommended operatingsupplyand temperaturerangesunlessotherwisespecified.(1)(2)(3)(4) Symbol Parameter Conditions Min Typ Max Units M-LVDS Driver |VYZ | Differentialoutputvoltagemagnitude R L = 50Ω,C L = 5pF 480 650 mV Figure3 and Figure5ΔVYZ Change indifferentialoutputvoltagemagnitude −50 0 +50 mVbetween logicstates VOS(SS) Steady-statecommon-mode outputvoltage R L = 50Ω,C L = 5pF 0.3 1.8 2.1 V Figure3 and Figure4|ΔVOS(SS)| Change insteady-statecommon-mode outputvoltage 0 +50 mVbetween logicstates VOS(PP) Peak-to-peakcommon-mode outputvoltage (VOS(pp) @ 500KHz clock) 143 mV VY(OC) Maximum steady-stateopen-circuitoutputvoltage Figure6 0 2.4 V VZ(OC) Maximum steady-stateopen-circuitoutputvoltage 0 2.4 V VP(H) Voltageovershoot,low-to-highleveloutput R L = 50Ω,C L = 5pF, 1.2VSS V C D = 0.5pFVP(L) Voltageovershoot,high-to-lowleveloutput −0.2VSS VFigure8 and Figure9(5) IIH High-levelinputcurrent(LVTTL inputs) VIH = 2.0V -15 15 μA (1) Allcurrentsintodevicepinsarepositive;allcurrentsoutofdevicepinsarenegative.Allvoltagesarereferencedtodevicegroundunless otherwisespecified. (2) AlltypicalsaregivenforVCC = 3.3Vand TA = 25°C. (3) The algebraicconvention,inwhichtheleastpositive(mostnegative)limitisdesignatedas minimum, isused inthisdatasheet. (4) C L includesfixturecapacitanceand C D includesprobecapacitance. (5) Not productiontested.Ensuredby a statisticalanalysison a sample basisatthetimeofcharacterization. Copyright© 2006–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS91C180 DS91D180

DS91C180,DS91D180 SNLS158M –MARCH 2006–REVISED APRIL 2013 www.ti.com ElectricalCharacteristics(continued) Over recommended operatingsupplyand temperaturerangesunlessotherwisespecified.(1)(2)(3)(4) Symbol Parameter Conditions Min Typ Max Units IIL Low-levelinputcurrent(LVTTL inputs) VIL= 0.8V -15 15 μA VIKL InputClamp Voltage(LVTTL inputs) IIN = -18mA -1.5 V IOS Differentialshort-circuitoutputcurrent Figure7 -43 43 mA M-LVDS Receiver VIT+ Positive-goingdifferentialinputvoltagethreshold See FunctionTables Type 1 20 50 mV Type 2 94 150 mV VIT− Negative-goingdifferentialinputvoltagethreshold See FunctionTables Type 1 −50 20 mV Type 2 50 94 mV VOH High-leveloutputvoltage IOH = −8mA 2.4 2.7 V VOL Low-leveloutputvoltage IOL = 8mA 0.28 0.4 V IOZ TRI-STATE outputcurrent VO = 0V or3.6V −10 10 μA IOSR ShortcircuitRrceiveroutputcurrent(LVTTL Output) VO = 0V -90 -48 mA M-LVDS Bus (Inputand Output)Pins IA,IY Receiverinputordriverhigh-impedanceoutput VA,Y = 3.8V,VB,Z = 1.2V, 32 µAcurrent DE = GND VA,Y = 0V or2.4V,VB,Z = 1.2V,DE −20 +20 µA= GND VA,Y = −1.4V,VB,Z = 1.2V, −32 µADE = GND IB,IZ Receiverinputordriverhigh-impedanceoutput VB,Z = 3.8V,VA,Y = 1.2V, 32 µAcurrent DE = GND VB,Z = 0V or2.4V,VA,Y = 1.2V,DE −20 +20 µA= GND VB,Z = −1.4V,VA,Y = 1.2V, −32 µADE = GND IAB ,IYZ Receiverinputordriverhigh-impedanceoutput VA,Y = VB,Z,−1.4V≤ V ≤ 3.8V,DE −4 +4 µAdifferentialcurrent(IA − IB orIY − IZ) = GND IA(OFF), Receiverinputordriverhigh-impedanceoutput VA,Y = 3.8V,VB,Z = 1.2V, IY(OFF) power-offcurrent DE = 0V 32 µA 0V ≤ VCC ≤ 1.5V VA,Y = 0V or2.4V,VB,Z = 1.2V, DE = 0V −20 +20 µA 0V ≤ VCC ≤ 1.5V VA,Y = −1.4V,VB,Z = 1.2V, DE = 0V −32 µA 0V ≤ VCC ≤ 1.5V IB(OFF), Receiverinputordriverhigh-impedanceoutput VB,Z = 3.8V,VA,Y = 1.2V, IZ(OFF) power-offcurrent DE = 0V 32 µA 0V ≤ VCC ≤ 1.5V VB,Z = 0V or2.4V,VA,Y = 1.2V, DE = 0V −20 +20 µA 0V ≤ VCC ≤ 1.5V VB,Z = −1.4V,VA,Y = 1.2V, DE = 0V −32 µA 0V ≤ VCC ≤ 1.5V IAB(OFF), Receiverinputordriverhigh-impedanceoutput VA,Y = VB,Z,−1.4V≤ V ≤ 3.8V, IYZ(OFF) power-offdifferentialcurrent DE = 0V −4 +4 µA (IA(OFF) − IB(OFF) orIY(OFF) − IZ(OFF)) 0V ≤ VCC ≤ 1.5V C A,C B Receiverinputcapacitance VCC = OPEN 5.1 pF C Y,C Z Driveroutputcapacitance 8.5 pF C AB Receiverinputdifferentialcapacitance 2.5 pF C YZ Driveroutputdifferentialcapacitance 5.5 pF

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DS91C180,DS91D180 www.ti.com SNLS158M –MARCH 2006–REVISED APRIL 2013 ElectricalCharacteristics(continued) Over recommended operatingsupplyand temperaturerangesunlessotherwisespecified.(1)(2)(3)(4) Symbol Parameter Conditions Min Typ Max Units C A/B, Receiverinputordriveroutputcapacitancebalance 1.0C Y/Z (CA/CB orC Y/CZ) SUPPLY CURRENT (VCC ) ICCD DriverSupplyCurrent R L = 50Ω,DE = VCC ,RE = VCC 17 29.5 mA ICCZ TRI-STATE SupplyCurrent DE = GND, RE = VCC 7 9.0 mA ICCR ReceiverSupplyCurrent DE = GND, RE = GND 14 18.5 mA ICCB SupplyCurrent,Driverand ReceiverEnabled DE = VCC ,RE = GND 20 29.5 mA SwitchingCharacteristics Over recommended operatingsupplyand temperaturerangesunlessotherwisespecified.(1)(2) Symbol Parameter Conditions Min Typ Max Units DRIVER AC SPECIFICATION tPLH DifferentialPropagationDelayLow toHigh R L = 50Ω,C L = 5 pF, 1.0 3.4 5.5 ns tPHL DifferentialPropagationDelayHightoLow C D = 0.5pF 1.0 3.1 5.5 ns tSKD1 (tsk(p)) PulseSkew |tPLHD − tPHLD |(3)(4) Figure8 and Figure9 300 420 ps tSKD3 Part-to-PartSkew (5)(4) 1.9 ns tTLH (tr) RiseTime (4) 1.0 1.8 3.0 ns tTHL (tf) FallTime (4) 1.0 1.8 3.0 ns tPZH EnableTime (ZtoActiveHigh) R L = 50Ω,C L = 5 pF, 8 ns tPZL EnableTime (ZtoActiveLow ) C D = 0.5pF 8 ns tPLZ DisableTime (ActiveLow toZ) Figure10 and Figure11 8 ns tPHZ DisableTime (ActiveHightoZ) 8 ns tJIT Random Jitter,RJ (4) 100MHz clockpattern(6) 2.5 5.5 psrms fMAX Maximum Data Rate 200 Mbps RECEIVER AC SPECIFICATION tPLH PropagationDelayLow toHigh C L = 15 pF 2.0 4.7 7.5 ns tPHL PropagationDelayHightoLow Figure12 Figure13 and Figure14 2.0 5.3 7.5 ns tSKD1 (tsk(p)) PulseSkew |tPLHD − tPHLD |(3)(4) 0.6 1.9 ns tSKD3 Part-to-PartSkew (5)(4) 1.5 ns tTLH (tr) RiseTime(4) 0.5 1.2 3.0 ns tTHL (tf) FallTime(4) 0.5 1.2 3.0 ns tPZH EnableTime (ZtoActiveHigh) R L = 500Ω,C L = 15 pF 10 ns tPZL EnableTime (ZtoActiveLow) Figure15 and Figure16 10 ns tPLZ DisableTime (ActiveLow toZ) 10 ns tPHZ DisableTime (ActiveHightoZ) 10 ns fMAX Maximum Data Rate 200 Mbps (1) AlltypicalsaregivenforV = 3.3Vand TA = 25°C. (2) C L includesfixturecapacitanceand C D includesprobecapacitance. (3) tSKD1 ,|tPLHD − tPHLD |,isthemagnitudedifferenceindifferentialpropagationdelaytimebetween thepositivegoingedge and thenegative goingedge ofthesame channel. (4) Not productiontested.Ensuredby a statisticalanalysison a sample basisatthetimeofcharacterization. (5) tSKD3 ,Part-to-PartSkew, isdefinedas thedifferencebetween theminimum and maximum specifieddifferentialpropagationdelays.This specificationappliestodevicesatthesame VCC and within5°C ofeach otherwithintheoperatingtemperaturerange. (6) Stimulusand fixturejitterhas been subtracted. Copyright© 2006–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS91C180 DS91D180

A B ~ 2.1V ~ 1.5V 'VOS(SS) VOS(PP)VOS DS91C180,DS91D180 SNLS158M –MARCH 2006–REVISED APRIL 2013 www.ti.com TestCircuitsand Waveforms Figure3. DifferentialDriverTestCircuit Figure4. DifferentialDriverWaveforms Figure5. DifferentialDriverFullLoad TestCircuit Figure6. DifferentialDriverDC Open TestCircuit

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DS91C180,DS91D180 www.ti.com SNLS158M –MARCH 2006–REVISED APRIL 2013 Figure7. DifferentialDriverShort-CircuitTestCircuit Figure8. DriverPropagationDelay and TransitionTime TestCircuit Figure9. DriverPropagationDelays and TransitionTime Waveforms Figure10. DriverTRI-STATE Delay TestCircuit Copyright© 2006–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS91C180 DS91D180

DS91C180,DS91D180 SNLS158M –MARCH 2006–REVISED APRIL 2013 www.ti.com Figure11. DriverTRI-STATE Delay Waveforms Figure12. ReceiverPropagationDelay and TransitionTime TestCircuit Figure13. Type 1 ReceiverPropagationDelay and TransitionTime Waveforms

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DS91C180,DS91D180 www.ti.com SNLS158M –MARCH 2006–REVISED APRIL 2013 Figure14. Type 2 ReceiverPropagationDelay and TransitionTime Waveforms Figure15. ReceiverTRI-STATE Delay TestCircuit Figure16. ReceiverTRI-STATE Delay Waveforms Copyright© 2006–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:DS91C180 DS91D180

DS91C180,DS91D180 SNLS158M –MARCH 2006–REVISED APRIL 2013 www.ti.com FUNCTION TABLES Table1.DS91D180/DS91C180 Transmitting(1) Inputs Outputs DE D Z Y 2.0V 2.0V L H 2.0V 0.8V H L 0.8V X Z Z (1) X — Don 'tcarecondition Z — Highimpedance state Table2.DS91D180 Receiving(1) Inputs Output RE A − B R 0.8V ≥ +0.05V H 0.8V ≤ −0.05V L 0.8V 0V X 2.0V X Z (1) X — Don 'tcarecondition Z — Highimpedance state Table3.DS91C180 Receiving(1) Inputs Output RE A − B R 0.8V ≥ +0.15V H 0.8V ≤ +0.05V L 0.8V 0V L 2.0V X Z (1) X — Don 'tcarecondition Z — Highimpedance state Table4.DS91D180 ReceiverInputThresholdTestVoltages(1) AppliedVoltages ResultingDifferentialInputVoltage ResultingCommon-Mode Input ReceiverOutput Voltage VIA VIB VID VIC R 2.400V 0.000V 2.400V 1.200V H 0.000V 2.400V −2.400V 1.200V L 3.800V 3.750V 0.050V 3.775V H 3.750V 3.800V −0.050V 3.775V L −1.400V −1.350V −0.050V −1.375V H −1.350V −1.400V 0.050V −1.375V L (1) H — HighLevel L — Low Level Outputstateassumes thatthereceiverisenabled(RE = L)

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DS91C180,DS91D180 www.ti.com SNLS158M –MARCH 2006–REVISED APRIL 2013 Table5.DS91C180 ReceiverInputThresholdTestVoltages(1) AppliedVoltages ResultingDifferentialInputVoltage ResultingCommon-Mode Input ReceiverOutput Voltage VIA VIB VID VIC R 2.400V 0.000V 2.400V 1.200V H 0.000V 2.400V −2.400V 1.200V L 3.800V 3.650V 0.150V 3.725V H 3.800V 3.750V 0.050V 3.775V L −1.250V −1.400V 0.150V −1.325V H −1.350V −1.400V 0.050V −1.375V L (1) H — HighLevel L — Low Level Outputstateassumes thatthereceiverisenabled(RE = L) PIN DESCRIPTIONS Pin No. Name Description 1,8 NC No connect.

2 R Receiveroutputpin

3 RE Receiverenablepin:When RE ishigh,thereceiverisdisabled.When RE isloworopen,the receiverisenabled. 4 DE Driverenablepin:When DE islow,thedriverisdisabled.When DE ishigh,thedriverisenabled.

5 D Driverinputpin

6,7 GND Ground pin

9 Y Non-invertingdriveroutputpin

10 Z Invertingdriveroutputpin

11 B Invertingreceiverinputpin

12 A Non-invertingreceiverinputpin

DS91C180,DS91D180 SNLS158M –MARCH 2006–REVISED APRIL 2013 www.ti.com

REVISION HISTORY

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www.ti.com 1-Nov-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples DS91C180TMA/NOPB ACTIVE SOIC D 14 55 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS91C180 TMA DS91C180TMAX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS91C180 TMA DS91D180TMA NRND SOIC D 14 55 TBD Call TI Call TI -40 to 85 DS91D180 TMA DS91D180TMA/NOPB ACTIVE SOIC D 14 55 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS91D180 TMA DS91D180TMAX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS91D180 TMA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.

www.ti.com 1-Nov-2013 Addendum-Page 2 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS91C180TMAX/NOPB SOIC D 14 2500 367.0 367.0 35.0 DS91D180TMAX/NOPB SOIC D 14 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 2

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