DS8922_15 TI1 | Alldatasheet
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DS8922,DS8922A,DS8923A www.ti.com SNLS373B –JUNE 1998–REVISED APRIL 2013 DS8922/DS8922A/DS8923ATRI-STATERS-422DualDifferentialLineDriverandReceiver Pairs Check forSamples: DS8922 ,DS8922A ,DS8923A 1FEATURES
DESCRIPTION
2• 12 ns TypicalPropagationDelay The DS8922/22A and DS8923A are Dual Differential• Output Skew — ±0.5ns Typical Line Driverand Receiverpairs.These devicesare
- Meets theRequirements ofEIA Standard RS- designed specificallyfor applicationsmeeting the 422 ST506, ST412 and ESDI Disk DriveStandards.In addition,the devicesmeet the requirementsof the• Complementary DriverOutputs EIA StandardRS-422.• High Differentialor Common-Mode Input These devicesofferan inputsensitivityof 200 mVVoltageRanges of±7V over a ±7V common mode operating range.• ±0.2VReceiverSensitivityover theInput Hysteresisis incorporated(typically70 mV) toVoltageRange improve noise margin for slowly changing input
- ReceiverInputFail-SafeCircuitry waveforms.An inputfail-safecircuitisprovidedsuch that if the receiverinputsare open the output• ReceiverInputHysteresis— 70 mV typical assumes thelogicalone state.• GlitchFree Power Up/Down The DS8922A and DS8923A driversare designedto• TRI-STATE Outputs provideunipolardifferentialdriveto twistedpairor parallelwire transmissionlines.Complementary outputsare logicallyANDed and providean output skew of 0.5 ns (typ.)withpropagationdelaysof 12 ns. Both devices feature TRI-STATE outputs.The DS8922/22A have independent controlfunctions common toa driverand receiverpair.The DS8923A has separatedriverand receivercontrolfunctions. Power up/down circuitryisfeaturedwhich willTRI- STATE theoutputsand preventerroneousglitcheson the transmissionlinesduringsystem power up or power down operation. The DS8922/22A and DS8923A are designedto be compatiblewithTTL and CMOS. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1998–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
DS8922,DS8922A,DS8923A SNLS373B –JUNE 1998–REVISED APRIL 2013 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. DS8922A Dual-In-Line Top View See Package Number D (R-PDSO-G16) or NFG0016E DS8923A Dual-In-Line Top View See Package Number D (R-PDSO-G16) or NFG0016E
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ProductFolderLinks:DS8922 DS8922A DS8923A
DS8922,DS8922A,DS8923A www.ti.com SNLS373B –JUNE 1998–REVISED APRIL 2013 DS8922/22A EN1 EN2 RO1 RO2 DO1 DO2 0 0 ACTIVE ACTIVE ACTIVE ACTIVE 1 0 HI-Z ACTIVE HI-Z ACTIVE 0 1 ACTIVE HI-Z ACTIVE HI-Z 1 1 HI-Z HI-Z HI-Z HI-Z DS8923A DEN REN RO1 RO2 DO1 DO2 0 0 ACTIVE ACTIVE ACTIVE ACTIVE 1 0 ACTIVE ACTIVE HI-Z HI-Z 0 1 HI-Z HI-Z ACTIVE ACTIVE 1 1 HI-Z HI-Z HI-Z HI-Z AbsoluteMaximum Ratings (1)(2) SupplyVoltage 7V DriveInputVoltage −0.5Vto+7V OutputVoltage 5.5V ReceiverOutputSinkCurrent 50 mA ReceiverInputVoltage ±10V DifferentialInputVoltage ±12V Maximum Package Power Dissipation@ +25°C D Package 1300 mW DerateD Package 10.4mW/ °C above +25°C DerateNFG Package 11.6mW/ °C above +25°C StorageTemperatureRange −65°C to+165°C Lead Temp. (Soldering,4 seconds) 260°C ESD Rating(HBM) 2000V+ (1) “AbsoluteMaximum Ratings”arethosevaluesbeyond whichthesafetyofthedevicecannotbe ensured.They arenotmeant toimply thatthedeviceshouldbe operatedattheselimits.The TableofElectricalCharacteristicsprovidesconditionsforactualdeviceoperation. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. Recommended OperatingConditions Min Max Units SupplyVoltage 4.5 5.5 V Temperature(TA) 0 70 °C Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS8922 DS8922A DS8923A
DS8922,DS8922A,DS8923A SNLS373B –JUNE 1998–REVISED APRIL 2013 www.ti.com DS8922/22A and DS8923A ElectricalCharacteristics(1)(2)(3) Symbol Conditions Min Typ Max Units RECEIVER VTH −7V ≤ VCM ≤ +7V −200 ±35 +200 mV VHYST −7V ≤ VCM ≤ +7V 15 70 mV R IN V IN = −7V,+7V (OtherInput= GND) 4.0 6.0 kΩ IIN VIN = 10V 3.25 mA VIN = −10V −3.25 mA VOH V CC = MIN, IOH = − 400 μA 2.5 V VOL V CC = MAX, IOL = 8 mA 0.5 V ISC V CC = MAX, VOUT = 0V −15 −100 mA DRIVER VOH V CC = MIN, IOH = −20 mA 2.5 V VOL V CC = MIN, IOL = +20 mA 0.5 V IOFF V CC = 0V,VOUT = 5.5V 100 μA VT 2.0 V |VOS – VOS | 0.4 V ISC V CC = MAX, VOUT = 0V −30 −150 mA DRIVER and RECEIVER IOZ VOUT = 2.5V 50 μA TRI-STATE VCC = MAX VOUT = 0.4V −50 μA Leakage ICC VCC = MAX ACTIVE 76 mA TRI-STATE 78 mA DRIVER and ENABLE INPUTS VIH 2.0 V VIL 0.8 V IIL V CC = MAX, VIN = 0.4V −40 −200 μA IIH V CC = MAX, VIN = 2.7V 20 μA II V CC = MAX, VIN = 7.0V 100 μA VCL V CC = MIN, IIN = −18 mA −1.5 V (1) Allcurrentsintodevicepinsareshown as positivevalues;allcurrentsoutofthedeviceareshown as negative;allvoltagesare referencedtogroundunlessotherwisespecified.Allvaluesshown as max ormin areclassifiedon absolutevaluebasis. (2) AlltypicalvaluesareVCC = 5V,TA = 25°C. (3) Onlyone outputata timeshouldbe shorted. ReceiverSwitchingCharacteristics(Figure1)(Figure2)(Figure2) Parameter Conditions Min Typ Max Units 8922 8922A/23A TpLH CL = 30 pF 12 22.5 20 ns TpHL CL = 30 pF 12 22.5 20 ns |TpLH –T pHL | CL = 30 pF 0.5 5 3.5 ns Skew (ChanneltoChannel) CL = 30 pF 0.5 3.0 2.0 ns TpLZ CL = 15 pF S2 Open 15 ns TpHZ CL = 15 pF S1 Open 15 ns TpZL CL = 30 pF S2 Open 20 ns TpZH CL = 30 pF S1 Open 20 ns
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ProductFolderLinks:DS8922 DS8922A DS8923A
equations: Where: Tcp = CrossingPoint Tra,Trb,Tfaand Tfbaretimemeasurements withrespecttothe DS8922,DS8922A,DS8923A www.ti.com SNLS373B –JUNE 1998–REVISED APRIL 2013 DriverSwitchingCharacteristics Parameter Conditions Min Typ Max Units 8922 8922A/23A SINGLE ENDED CHARACTERISTICS (Figure4,Figure5,Figure6,and Figure8) TpLH CL = 30 pF 12 15 15 ns TpHL CL = 30 pF 12 15 15 ns TTLH CL = 30 pF 5 10 10 ns TTHL CL = 30 pF 5 10 10 ns |TpLH –T pHL | CL = 30 pF 0.5 ns Skew CL = 30 pF (1) 0.5 5 3.5 ns Skew (ChanneltoChannel) 0.5 3.0 2.0 ns TpLZ CL = 30 pF 15 ns TpHZ CL = 30 pF 15 ns TpZL CL = 30 pF 20 ns TpZH CL = 30 pF 20 ns DIFFERENTIAL SWITCHING CHARACTERISTICS (2),(Figure4) TpLH CL = 30 pF 12 15 15 ns TpHL CL = 30 pF 12 15 15 ns |TpLH –T pHL | CL = 30 pF 0.5 6.0 2.75 ns (1) Differencebetween complementaryoutputsatthe50% point. (2) DifferentialDelaysaredefinedas calculatedresultsfromsingleended riseand falltimemeasurements.Thisapproachinestablishing AC performancespecificationshas been takendue tolimitationsofavailableAutomaticTestEquipment(ATE).The calculatedATE resultsassume a lineartransitionbetween measurement pointsand area resultofthefollowing input. SwitchingTime Waveforms AC TestCircuitsand SwitchingWaveforms Figure1. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS8922 DS8922A DS8923A
DS8922,DS8922A,DS8923A SNLS373B –JUNE 1998–REVISED APRIL 2013 www.ti.com Figure2. Figure3. S1 S2 S3 TPLZ Closed Open +2.5V TPHZ Open Closed −2.5V TPZL Closed Open +2.5V TPZH Open Closed −2.5V Figure4. Figure5.
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ProductFolderLinks:DS8922 DS8922A DS8923A
DS8922,DS8922A,DS8923A www.ti.com SNLS373B –JUNE 1998–REVISED APRIL 2013 Figure6. Figure7. Figure8. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS8922 DS8922A DS8923A
DS8922,DS8922A,DS8923A SNLS373B –JUNE 1998–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristics (DS8923A) DriverVOH vs IOH vs Temperature DriverVOH vs IOH vs VCC Figure9. Figure10. DriverVOL vs IOL vs Temperature DriverVOL vs IOL vs VCC Figure11. Figure12. ReceiverV OH vs IOH vs Temperature ReceiverVOH vs IOH vs VCC Figure13. Figure14.
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ProductFolderLinks:DS8922 DS8922A DS8923A
DS8922,DS8922A,DS8923A www.ti.com SNLS373B –JUNE 1998–REVISED APRIL 2013 TypicalPerformance Characteristics(continued) (DS8923A) ReceiverV OL vs IOL vs Temperature ReceiverVOL vs IOL vs VCC Figure15. Figure16. DriverDifferentialPropagationDelay vs Temperature DriverDifferentialPropagationDelay vs VCC Figure17. Figure18. ReceiverPropagationDelay vs Temperature ReceiverPropagationDelay vs VCC Figure19. Figure20. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:DS8922 DS8922A DS8923A
DS8922,DS8922A,DS8923A SNLS373B –JUNE 1998–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristics(continued) (DS8923A) DriverVOD vs Temperature DriverVOD vs VCC Figure21. Figure22. DriverDifferentialTransitionTime vs DriverVOD vs R L Temperature Figure23. Figure24. Supply Currentvs DriverDifferentialTransitionTime vs VCC Temperature Figure25. Figure26.
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ProductFolderLinks:DS8922 DS8922A DS8923A
DS8922,DS8922A,DS8923A www.ti.com SNLS373B –JUNE 1998–REVISED APRIL 2013 TypicalPerformance Characteristics(continued) (DS8923A) ICC vs Supply Currentvs V CC DriverSwitchingFrequency Figure27. Figure28. DriverShortCircuitCurrent vs Temperature DriverShortCircuitCurrentvs VCC Figure29. Figure30. ReceiverShortCircuit Current vs Temperature ReceiverShortCircuitCurrentvs VCC Figure31. Figure32. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:DS8922 DS8922A DS8923A
DS8922,DS8922A,DS8923A SNLS373B –JUNE 1998–REVISED APRIL 2013 www.ti.com TYPICAL APPLICATIONS Figure33. ESDI Application Figure34. Figure35. ST504 and ST412 Applications Figure36.
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ProductFolderLinks:DS8922 DS8922A DS8923A
DS8922,DS8922A,DS8923A www.ti.com SNLS373B –JUNE 1998–REVISED APRIL 2013
REVISION HISTORY
Changes from RevisionA (April2013)toRevisionB Page Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:DS8922 DS8922A DS8923A
www.ti.com 16-Oct-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples DS8922AM LIFEBUY SOIC D 16 48 TBD Call TI Call TI 0 to 70 DS8922AM DS8922AM/NOPB ACTIVE SOIC D 16 48 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS8922AM DS8922AMX/NOPB ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS8922AM DS8923AM LIFEBUY SOIC D 16 48 TBD Call TI Call TI 0 to 70 DS8923AM DS8923AM/NOPB ACTIVE SOIC D 16 48 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS8923AM DS8923AN LIFEBUY PDIP NFG 16 25 TBD Call TI Call TI 0 to 70 DS8923AN DS8923AN/NOPB ACTIVE PDIP NFG 16 25 Pb-Free (RoHS) CU SN Level-1-NA-UNLIM 0 to 70 DS8923AN (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
www.ti.com 16-Oct-2015 Addendum-Page 2 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS8922AMX/NOPB SOIC D 16 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 2
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