DS8921AM-NOPB TI | Alldatasheet
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DS8921,DS8921A,DS8921AT www.ti.com SNLS374C –MAY 1998–REVISED APRIL 2013 DS8921/DS8921A/DS8921ATDifferentialLineDriverandReceiverPair Check forSamples: DS8921 ,DS8921A ,DS8921AT 1FEATURES DESCRIPTION The DS8921, DS8921A are DifferentialLine Driver 2• 12 ns TypicalPropagationDelay and Receiver pairs designed specificallyfor• Output Skew -0.5ns Typical applicationsmeeting the ST506, ST412 and ESDI
- Meet theRequirements ofEIA Standard RS- DiskDriveStandards.Inaddition,thesedevicesmeet 422 therequirementsoftheEIA StandardRS-422.
- Complementary DriverOutputs The DS8921, DS8921A receiversofferan input sensitivityof 200 mV over a ±7V common mode• High Differentialor Common-Mode Input operatingrange.Hysteresisisincorporated(typicallyVoltageRanges of±7V 70 mV) toimprovenoisemarginforslowlychanging• ±0.2VReceiverSensitivityover theInput inputwaveforms.VoltageRange The DS8921, DS8921A driversare designed to• ReceiverInputHysteresis-70mV Typical provideunipolardifferentialdriveto twistedpairor• DS8921AT IndustrialTemperature Operation: parallelwire transmissionlines.Complementary(−40°C to+85°C) outputsare logicallyANDed and providean output skew of 0.5 ns (typ.)with propagationdelays of 12 ns. The DS8921, DS8921A are designed to be compatiblewithTTL and CMOS. Connection Diagram DS8921/DS8921A/DS8921AT See Package Number D (R-PDSO-G8) or P (R-PDIP-T8) TruthTable Receiver Driver Input VOUT Input VOUT VOUT VID ≥ VTH (MAX) 1 1 1 0 VID ≤ VTH (MIN) 0 0 0 1 Open 1 Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1998–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
DS8921,DS8921A,DS8921AT SNLS374C –MAY 1998–REVISED APRIL 2013 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings (1)(2) SupplyVoltage 7V DriverInputVoltage −0.5Vto+7V OutputVoltage 5.5V ReceiverOutputSinkCurrent 50 mA ReceiverInputVoltage ±10V DifferentialInputVoltage ±12V Maximum Package Power Dissipation@ +25°C D Package 730 mW P Package 1160 mW DerateD Package 9.3mW/ °C above +25°C DerateP Package 5.8mW/ °C above +25°C StorageTemperatureRange −65°C to+165°C Lead Temperature +260°C (Soldering,4 sec.) +260°C Maximum Junction Temperature +150°C (1) “AbsoluteMaximum Ratings”arethosevaluesbeyond whichthesafetyofthedevicecannotbe ensured.They arenotmeant toimply thatthedeviceshouldbe operatedattheselimits.The TableofElectricalCharacteristicsprovidesconditionsforactualdeviceoperation. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentSalesOffice/Distributorsforavailabilityand specifications. Recommended OperatingConditions Min Max Units SupplyVoltage 4.5 5.5 V Temperature(TA) DS8921/DS8921A 0 70 °C DS8921AT −40 +85 °C
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DS8921,DS8921A,DS8921AT www.ti.com SNLS374C –MAY 1998–REVISED APRIL 2013 DS8921/DS8921A ElectricalCharacteristics(1)(2)(3) Symbol Conditions Min Typ Max Units RECEIVER VTH −7V ≤ VCM ≤ +7V −200 ±35 +200 mV VHYST −7V ≤ VCM ≤ +7V 15 70 mV R IN VIN = −7V,+7V 4.0 6.0 kΩ (OtherInput= GND) IIN VIN = 10V 3.25 mA VIN = −10V −3.25 mA VOH IOH = −400 μA 2.5 V VOL IOL = 8 mA 0.5 V ISC VCC = MAX, VOUT = 0V −15 −100 mA DRIVER VIH 2.0 V VIL 0.8 V IIL VCC = MAX, VIN = 0.4V −40 −200 μA IIH VCC = MAX, VIN = 2.7V 20 μA II VCC = MAX, VIN = 7.0V 100 μA VCL VCC = MIN, IIN = −18 mA −1.5 V VOH VCC = MIN, IOH = −20 mA 2.5 V VOL VCC = MIN, IOL = +20 mA 0.5 V IOFF VCC = 0V,V OUT = 5.5V 100 μA VT 2.0 V |VOS – VOS | 0.4 V ISC VCC = MAX, VOUT = 0V −30 −150 mA DRIVER and RECEIVER ICC VCC = MAX, VOUT = Logic0 35 mA (1) Allcurrentsintodevicepinsareshown as positivevalues;allcurrentsoutofthedeviceareshown as negative;allvoltagesare referencedtogroundunlessotherwisespecified.Allvaluesshown as max ormin areclassifiedon absolutevaluebasis. (2) AlltypicalvaluesareVCC = 5V,TA = 25°C. (3) Onlyone outputata timeshouldbe shorted. ReceiverSwitchingCharacteristics Symbol Conditions Min Typ Max Units 8921 8921A 8921AT TpLH C L = 30 pF 14 22.5 20 20 ns (Figure1 and Figure2 ) TpHL C L = 30 pF 14 22.5 20 20 ns (Figure1 and Figure2) |TpLH –T pHL | C L = 30 pF 0.5 5 3.5 5 ns (Figure1 and Figure2 ) DriverSwitchingCharacteristics SINGLE ENDED CHARACTERISTICS Symbol Conditions Min Typ Max Units 8921 8921A 8921AT TpLH C L = 30 pF 10 15 15 15 ns (Figure3 and Figure4) TpHL C L = 30 pF 10 15 15 15 ns Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS8921 DS8921A DS8921AT
resultsassume a lineartransitionbetween measurement pointsand area resultofthefollowingequations: Where: DS8921,DS8921A,DS8921AT SNLS374C –MAY 1998–REVISED APRIL 2013 www.ti.com DriverSwitchingCharacteristics(continued) SINGLE ENDED CHARACTERISTICS Symbol Conditions Min Typ Max Units 8921 8921A 8921AT (Figure3 and Figure4) TTLH C L = 30 pF 5 8 8 9.5 ns (Figure7 and Figure8) TTHL C L = 30 pF 5 8 8 9.5 ns (Figure7 and Figure8) Skew CL = 30 pF (1) 1 5 3.5 3.5 ns (Figure3 and Figure4) (1) Differencebetween complementaryoutputsatthe50% point. DriverSwitchingCharacteristics(1) DIFFERENTIAL CHARACTERISTICS Symbol Conditions Min Typ Max Units 8921 8921A 8921AT TpLH C L = 30 pF 10 15 15 15 ns (Figure3,Figure5,and Figure6) TpHL C L = 30 pF 10 15 15 15 ns (Figure3,Figure5,and Figure6) |TpLH –T pHL | C L = 30 pF 0.5 6 2.75 2.75 ns (Figure3,Figure5,and Figure6) (1) DifferentialDelaysaredefinedas calculatedresultsfromsingleended riseand falltimemeasurements.Thisapproachinestablishing AC performancespecificationshas been takendue tolimitationsofavailableAutomaticTestEquipment(ATE).The calculatedATE Tcr= CrossingPoint Tra,Trb,Tfaand T fbaretimemeasurements withrespecttotheinput.See Figure6. AC TestCircuitsand SwitchingDiagrams Figure1.
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DS8921,DS8921A,DS8921AT www.ti.com SNLS374C –MAY 1998–REVISED APRIL 2013 Figure2. Figure3. Figure4. Figure5. Figure6. Figure7. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS8921 DS8921A DS8921AT
DS8921,DS8921A,DS8921AT SNLS374C –MAY 1998–REVISED APRIL 2013 www.ti.com Figure8. TYPICAL APPLICATIONS Figure9. ST506 and ST412 Application
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DS8921,DS8921A,DS8921AT www.ti.com SNLS374C –MAY 1998–REVISED APRIL 2013 Figure10. Figure11. ESDI Application Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS8921 DS8921A DS8921AT
DS8921,DS8921A,DS8921AT SNLS374C –MAY 1998–REVISED APRIL 2013 www.ti.com
REVISION HISTORY
Changes from RevisionB (April2013)toRevisionC Page
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www.ti.com 18-Apr-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Top-Side Markings (4) Samples DS8921AM ACTIVE SOIC D 8 95 TBD Call TI Call TI 0 to 70 DS89 21AM DS8921AM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS89 21AM DS8921AMX ACTIVE SOIC D 8 2500 TBD Call TI Call TI 0 to 70 DS89 21AM DS8921AMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS89 21AM DS8921ATM ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 85 DS892 1ATM DS8921ATM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS892 1ATM DS8921M ACTIVE SOIC D 8 95 TBD Call TI Call TI 0 to 70 DS892 DS8921M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS892 DS8921MX ACTIVE SOIC D 8 2500 TBD Call TI Call TI 0 to 70 DS892 DS8921MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS892 DS8921N ACTIVE PDIP P 8 40 TBD Call TI Call TI 0 to 70 DS8921N DS8921N/NOPB ACTIVE PDIP P 8 40 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM 0 to 70 DS8921N (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined.
www.ti.com 18-Apr-2013 Addendum-Page 2 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS8921AMX SOIC D 8 2500 349.0 337.0 45.0 DS8921AMX/NOPB SOIC D 8 2500 349.0 337.0 45.0 DS8921MX SOIC D 8 2500 349.0 337.0 45.0 DS8921MX/NOPB SOIC D 8 2500 349.0 337.0 45.0 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 Pack Materials-Page 2
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