DS75176B TI | Alldatasheet
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DS75176B,DS75176BT www.ti.com SNLS381C –JULY 1998–REVISED APRIL 2013 DS75176B/DS75176BTMultipointRS-485/RS-422Transceivers Check forSamples: DS75176B ,DS75176BT 1FEATURES DESCRIPTION The DS75176B is a high speed differentialTRI- 23• Meets EIA Standard RS485 forMultipointBus STATE ® bus/linetransceiverdesigned to meet theTransmissionand isCompatible withRS-422. requirementsof EIA standardRS485 withextended• Small Outline(SOIC)Package Option Available common mode range (+12V to −7V), formultipoint forMinimum Board Space. data transmission.In addition,itis compatiblewith RS-422.• 22 ns DriverPropagationDelays.
- Single+5V Supply. The driverand receiveroutputsfeatureTRI-STATE capability,for the driveroutputs over the entire• −7V to+12V Bus Common Mode Range common mode rangeof+12V to−7V. Bus contentionPermits±7V Ground DifferenceBetween or faultsituationsthat cause excessive powerDevices on theBus. dissipationwithinthedevicearehandledby a thermal• Thermal Shutdown Protection. shutdown circuit,which forcesthedriveroutputsinto
- High Impedance toBus withDriverinTRI- thehighimpedance state. STATE or withPower Off,Over theEntire DC specificationsare guaranteedoverthe0 to70°CCommon Mode Range Allows theUnused temperatureand 4.75V to 5.25V supply voltageDevices on theBus tobe Powered Down. range.
- Pin Out Compatible withDS3695/A and SN75176A/B.
- Combined Impedance ofa DriverOutput and ReceiverInputisLess Than One RS485 Unit Load, Allowingup to32 Transceiverson the Bus.
- 70 mV TypicalReceiverHysteresis. Connection and Logic Diagram Figure1. Top View See Package Number P0008E or D0008A These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2TRI-STATE isa registeredtrademarkofTexas Instruments. 3Allothertrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1998–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
DS75176B,DS75176BT SNLS381C –JULY 1998–REVISED APRIL 2013 www.ti.com AbsoluteMaximum Ratings (1)(2) SupplyVoltage,VCC 7V ControlInputVoltages 7V DriverInputVoltage 7V DriverOutputVoltages +15V/ −10V ReceiverInputVoltages(DS75176B) +15V/ −10V ReceiverOutputVoltage 5.5V ContinuousPower Dissipation@ 25°C forSOIC Package 675 mW (3) forPDIP Package 900 mW (4) StorageTemperatureRange −65°C to+150°C Lead Temperature (Soldering,4 seconds) 260°C ESD Rating(HBM) 500V (1) “AbsoluteMaximum Ratings”arethosebeyond whichthesafetyofthedevicecannotbe verified.They arenotmeant toimplythatthe deviceshouldbe operatedattheselimits.The tablesof“ElectricalCharacteristics”provideconditionsforactualdeviceoperation. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityand specifications. (3) Deratelinearly@ 6.11mW/ °C to400 mW at70°C. (4) Deratelinearlyat5.56mW/ °C to650 mW at70°C. Recommended OperatingConditions Min Max Units SupplyVoltage,VCC 4.75 5.25 V VoltageatAny Bus Terminal −7 +12 V (SeparateorCommon Mode) OperatingFreeAirTemperatureTA DS75176B 0 +70 °C DS75176BT −40 +85 °C DifferentialInputVoltage,VID (1) −12 +12 V (1) Differential-Input/Outputbus voltageismeasured atthenoninvertingterminalA withrespecttotheinvertingterminalB. ElectricalCharacteristics(1)(2) 0°C ≤ TA≤ 70°C, 4.75V < VCC < 5.25Vunlessotherwisespecified Symbol Parameter Conditions Min Typ Max Units VOD1 DifferentialDriverOutput IO = 0 5 VVoltage(Unloaded) VOD2 DifferentialDriverOutput See (Figure2) R = 50Ω;(RS-422)(3) 2 V Voltage(withLoad) R = 27Ω;(RS-485) 1.5 V ΔVOD Change inMagnitudeofDriver DifferentialOutputVoltageFor 0.2 V ComplementaryOutputStates VOC DriverCommon Mode OutputVoltage See (Figure2) R = 27Ω 3.0 V Δ|VOC | Change inMagnitudeofDriver Common Mode OutputVoltage 0.2 V ForComplementaryOutputStates (1) Allcurrentsintodevicepinsarepositive;allcurrentsoutofdevicepinsarenegative.Allvoltagesarereferencedtodevicegroundunless otherwisespecified. (2) AlltypicalsaregivenforVCC = 5V and TA = 25°C. (3) Allworstcase parametersforwhichthisnoteisapplied,must be increasedby 10% forDS75176BT. The otherparametersremainvalid for−40°C < TA < +85°C.
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DS75176B,DS75176BT www.ti.com SNLS381C –JULY 1998–REVISED APRIL 2013 ElectricalCharacteristics(1)(2)(continued) 0°C ≤ TA≤ 70°C, 4.75V < VCC < 5.25Vunlessotherwisespecified Symbol Parameter Conditions Min Typ Max Units VIH InputHighVoltage 2 V VIL InputLow Voltage 0.8 DI,DE,VCL InputClamp Voltage IIN = −18 mA −1.5RE ,E IIL InputLow Current VIL= 0.4V −200 μA IIH InputHighCurrent VIH = 2.4V 20 μA IIN InputCurrent DO/RI,DO/RI VCC = 0V or5.25V VIN = 12V +1.0 mA DE = 0V VIN = −7V −0.8 mA VTH DifferentialInputThresholdVoltagefor −7V ≤ VCM ≤ + 12V −0. +0.2 VReceiver 2 ΔVTH ReceiverInputHysteresis VCM = 0V 70 mV VOH ReceiverOutputHighVoltage IOH = −400 μA 2.7 V VOL OutputLow Voltage RO IOL = 16 mA (3) 0.5 V IOZR OFF-State(HighImpedance) VCC = Max ±20 μA OutputCurrentatReceiver 0.4V≤ VO ≤ 2.4V R IN ReceiverInputResistance −7V ≤ VCM ≤ +12V 12 kΩ ICC SupplyCurrent No Load(3) DriverOutputsEnabled 55 mA DriverOutputsDisabled 35 mA IOSD DriverShort-Circuit VO = −7V (3) −250 mA OutputCurrent VO = +12V (3) +250 mA IOSR ReceiverShort-Circuit VO = 0V −15 −85 mA OutputCurrent SwitchingCharacteristics VCC = 5.0V,TA = 25°C Symbol Parameter Conditions Min Typ Max Units tPLH DriverInputtoOutput R LDIFF = 60Ω 12 22 ns tPHL DriverInputtoOutput C L1 = C L2 = 100 pF 17 22 ns tr DriverRiseTime R LDIFF = 60Ω 18 ns tf DriverFallTime C L1 =C L2 = 100 pF 18 ns (Figure4 and Figure6) tZH DriverEnabletoOutputHigh C L = 100 pF (Figure5 and Figure7)S1 29 100 ns Open tZL DriverEnabletoOutputLow C L = 100 pF (Figure5 and Figure7)S2 31 60 ns Open tLZ DriverDisableTime fromLow C L = 15 pF (Figure5 and Figure7)S2 13 30 ns Open tHZ DriverDisableTime fromHigh C L = 15 pF (Figure5 and Figure7)S1 19 200 ns Open tPLH ReceiverInputtoOutput C L = 15 pF (Figure3 and Figure8) 30 37 ns S1 and S2 ClosedtPHL ReceiverInputtoOutput 32 37 ns tZL ReceiverEnabletoOutputLow C L = 15 pF (Figure3 and Figure9)S2 15 20 ns Open tZH ReceiverEnabletoOutputHigh C L = 15 pF (Figure3 and Figure9)S1 11 20 ns Open tLZ ReceiverDisablefromLow C L = 15 pF (Figure3 and Figure9)S2 28 32 ns Open tHZ ReceiverDisablefromHigh C L = 15 pF (Figure3 and Figure9)S1 13 35 ns Open Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS75176B DS75176BT
DS75176B,DS75176BT SNLS381C –JULY 1998–REVISED APRIL 2013 www.ti.com AC TEST CIRCUITS Note:S1 and S2 ofloadcircuitareclosedexceptas otherwise mentioned. Figure2. Figure3. Note:Unlessotherwisespecifiedtheswitchesareclosed. Figure4. Figure5. SwitchingTime Waveforms Figure6. DriverPropagationDelays and TransitionTimes Figure7. DriverEnable and DisableTimes
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DS75176B,DS75176BT www.ti.com SNLS381C –JULY 1998–REVISED APRIL 2013 Note:Differentialinputvoltagemay may be realizedby groundingRI and pulsingRI between +2.5V and −2.5V Figure8. ReceiverPropagationDelays Figure9. ReceiverEnable and DisableTimes FunctionTables Table1.DS75176B Transmitting(1) Inputs LineCondition Outputs RE DE DI DO DO X 1 1 No Fault 0 1 X 1 0 No Fault 1 0 X 0 X X Z Z X 1 X Fault Z Z (1) X — Don 'tcarecondition Z — Highimpedance state Fault— Improperlineconditonscausingexcessivepower dissipation inthedriver,such as shortsorbus contentionsituations **Thisisa failsafecondition Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS75176B DS75176BT
DS75176B,DS75176BT SNLS381C –JULY 1998–REVISED APRIL 2013 www.ti.com Table2.DS75176B Receiving(1) Inputs Outputs RE DE RI-RI RO 0 0 ≥ +0.2V 1 0 0 ≤ −0.2V 0 0 0 InputsOpen 1 1 0 X Z (1) X — Don 'tcarecondition Z — Highimpedance state Fault— Improperlineconditonscausingexcessivepower dissipation inthedriver,such as shortsorbus contentionsituations Thisisa failsafecondition TYPICAL APPLICATION
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DS75176B,DS75176BT www.ti.com SNLS381C –JULY 1998–REVISED APRIL 2013
REVISION HISTORY
Changes from RevisionB (April2013)toRevisionC Page Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS75176B DS75176BT
www.ti.com 15-Apr-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Top-Side Markings (4) Samples DS75176BM ACTIVE SOIC D 8 95 TBD Call TI Call TI 0 to 70 DS751 76BM DS75176BM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS751 76BM DS75176BMX ACTIVE SOIC D 8 2500 TBD Call TI Call TI 0 to 70 DS751 76BM DS75176BMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS751 76BM DS75176BN ACTIVE PDIP P 8 40 TBD Call TI Call TI 0 to 70 DS75176BN DS75176BN/NOPB ACTIVE PDIP P 8 40 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM 0 to 70 DS75176BN DS75176BTM ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 85 DS751 76BTM DS75176BTM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS751 76BTM DS75176BTMX ACTIVE SOIC D 8 2500 TBD Call TI Call TI -40 to 85 DS751 76BTM DS75176BTMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS751 76BTM DS75176BTN ACTIVE PDIP P 8 40 TBD Call TI Call TI -40 to 85 DS75176 BTN DS75176BTN/NOPB ACTIVE PDIP P 8 40 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 85 DS75176 BTN (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined.
www.ti.com 15-Apr-2013 Addendum-Page 2 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS75176BMX SOIC D 8 2500 349.0 337.0 45.0 DS75176BMX/NOPB SOIC D 8 2500 349.0 337.0 45.0 DS75176BTMX SOIC D 8 2500 349.0 337.0 45.0 DS75176BTMX/NOPB SOIC D 8 2500 349.0 337.0 45.0 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 Pack Materials-Page 2
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