DS56-0002 MACOM | Alldatasheet

Document overview

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Technical content

Features

  • Small Size, Low Profile
  • Industry Standard SOW-16 SMT Plastic Package
  • Superior Repeatability
  • Insertion Loss: 1.1 dB Typical
  • Isolation: 22 dB Typical
  • Low Cost

Description

M/A-COM’s DS56-0002 is an IC-based monolithic power divider in a low cost SOW-16 -lead plastic package. This 6-way power divider is ideally suited for applications where small size, low profile and low cost, without sacrificing performance, are re- quired. Typical applications include base stations, portables and PCMCIA cards for wireless standards such as DCS-1800, PCN, PCS, DECT and PHS. Available in tape and reel. The DS56-0002 is fabricated using a passive-integrated circuit process. The process features full-chip passivation for increased performance and reliability. SOW-16 1. If specific reel size is required, consult factory for part number assignment. Part Number Package DS56-0002 DS56-0002-TR DS56-0002-RTR SOW 16-Lead Plastic Packa ge Forward Tape and Reel Reverse Tape and Reel 1. All specifications apply with a 50-ohm source and load impedance. Typical Electrical Specifications , TA= +25ºC Parameters Units Min. Typ. Max. Insertion Loss dB — 1.2 1.5 Isolation dB 18 22 — Amplitude Balance dB — 0.5 1.0 Phase Balance ° — 8° 15°

Ordering Information

Low Cost Six-Way Power Splitter/Combiner 1700 - 2000 MHz DS56-0002 .013-.020 TYP (0.33-0.51) .0040-.0118 (0.10-0.30) .394-.419 (10.00-10.65) Pin 16 Orientation Mark .010(0.25) M B M -B- .3977-.4133 (10.10-10.50) -A- 0.050(1.27) BSC. .0926-.1043 (7.40-7.60) .010(0.25) M C A M B S 16-Lead SOP outline dimensions Wide body (.300) (All dimensions per JEDEC No. MS-013-AA, Issue C) Dimensions in ( ) are in mm. 0-8 .010-.029 x

45 Chamfer

(0.25-0.75) .016-.050 (0.40-1.27) .0091-.0125 (0.23-0.32) -C- Pin 1 Unless Otherwise Noted: .xxx = 0.010 (.xx = 0.25) .004 (0.10) Preliminary Specifications

Six-Way Power Splitter/Combiner DS56-0002 M/A-COM Division of AMP Incorporated ■ North America: Tel. (800) 366-2266, Fax (800) 618-8883 ■ Asia/Pacific: Tel.+85 2 2111 8088, Fax +85 2 2111 8087 ■ Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 www.macom.com AMP and Connecting at a Higher Level are trademarks. The Preliminary Specifications Data Sheet contains typical electrical specifications which may change prior to final introduction. V1.B 0.0 -0.5 -1.0 -1.5 -2.0 1700 1750 1800 1850 1900 1950 2000 FREQUENCY (MH z) INSERTION LOSS (dB) Absolute Maximum Ratings Parameter Absolute Maximum Input Power Operating Temperature Storage Temperature 1W CW -40°C to +85°C -65°C to 150°C 1. Exceeding these limits may cause permanent damage. 2. With internal load dissipation of 0.125 W maximum. Functional Diagram 3. Pins 1, 3, 5, 7, 9, 10, 12, 14 and 16 must be DC and RF grounded. Typical Performance @ +25°C Isolation vs. Frequency Insertion Loss vs. Frequency Recommended PCB Configuration (Dimensions in Inches ) mm FREQUENCY (MH z) -10 -20 -30 -40 1700 1750 1800 1850 1900 1950 2000 ISOLATION (dB) FREQUENCY (MH z) 2.0 1.8 1.6 1.4 1.2 1.0 1700 1750 1800 1850 1900 1950 2000 VSWR Input Output VSWR vs. Frequency RF 6 (OUT) RF 5 (OUT) RF 4 (OUT)RF 3 (OUT) RF 2 (OUT) RF 1 (OUT) RF IN GND GND GND GND GNDGND GND GND GND CIRCUIT MA TERIAL: FR-4 .016 THICK RF IN RF 1 RF 2 RF 3 RF 4 RF 5 RF 6 .016 DIA. PLATED THRU (21X) .050 DIA. PLATED THRU (3X) .030 TYP . .067 TYP . .093 TYP. .428 .041 .335