DS54-0002 MA-COM | Alldatasheet

Document overview

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Technical content

Features

  • Small Size and Low Profile
  • Industry Standard SOW-16 SMT Plastic Package
  • Excellent Repeatability (Lot-to-Lot Variation)
  • Typical Isolation: 18 dB
  • Typical Amplitude Balance: 0.1 dB
  • Low Cost
  • Typical Insertion Loss: 1.0 dB
  • SOW-16 Package

Description

M/A-COM’s DS54-0002 is an IC-based monolithic power splitter/combiner in a low cost SOW-16 plastic package. This device is ideally suited for applica- tions where PCB real estate is at a premium and standard packaging for automated assembly and low cost are critical. Typical applications include infra- structure, portables and peripheral devices (PCMCIA cards) for wireless standards such as GSM, AMPS, CDPD, RAM and ARDIS. Available in tape and reel. The DS54-0002 is fabricated using a passive- integrated circuit process. The process features full- chip passivation for increased performance and reli- ability.

Ordering Information

DS54-0002-TR 1000 piece reel DS54-0002SAM Sample Test Board Note: Reference Application Note M513 for reel size information. Functional Block Diagram Pin Configuration Pin No. Function Pin No. Function

1 GND 9 GND

2 GND 10 GND

3 RF2 (OUT) 11 GND

4 GND 12 RF4 (OUT)

5 RF1 (OUT) 13 GND

6 GND 14 RF3 (OUT)

7 RF IN 15 GND

8 GND 16 GND

Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Low Cost Four-Way SMT Power Splitter/Combiner, 1700 - 2000 MHz Rev. V5 DS54-0002 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Electrical Specifications: TA = 25°C1 Parameter Test Conditions Frequency Units Min Typ Max Insertion Loss (Above 6.0 dB) — — dB — 1.0 1.5 Isolation — 1700 - 1800 MHz 1801 - 2000 MHz dB dB Input VSWR — — Ratio — 1.5:1 1.7:1 Output VSWR — 1700 - 1800 MHz 1801 - 2000 MHz Ratio Ratio 1.3:1 1.5:1 Amplitude Balance — — dB — 0.1 0.7 Phase Balance — — Deg — 4 7 Recommended PCB Configuration Absolute Maximum Ratings 2,3 Parameter Absolute Maximum Input Power 4 1W CW Operating Temperature -40°C to +85°C Storage Temperature -65°C to +150°C 2. Exceeding any one or combination of these limits may cause permanent damage to this device. 3. M/A-COM does not recommend sustained operation near these survivability limits. 4. With internal load dissipation of 0.125W maximum. Handling Procedures Please observe the following precautions to avoid damage: Static Sensitivity GMIC Circuits are sens itive to electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques should be used when handling these devices. 1. All specifications apply with a 50-ohm source and load impedance.

Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Low Cost Four-Way SMT Power Splitter/Combiner, 1700 - 2000 MHz Rev. V5 DS54-0002 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. SOW-16† † Reference Application Note M538 for lead-free solder reflow recommendations.