DS485TMX

DS485_15 TI1 | Alldatasheet

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www.ti.com SNLS122C –JULY 1998–REVISED APRIL 2013 DS485LowPowerRS-485/RS-422MultipointTransceiver Check forSamples: DS485 1FEATURES DESCRIPTION The DS485 is a low-powertransceiverforRS-485• Meets TIA/EIARS-485 MultipointStandard and RS-422 communication.The devicecontainsone• ensured FullLoad Output Voltage(V OD3 ) driverand one receiver.The driversslew rateallows

• Low QuiescentCurrent:200 μA typ for operationup to 2.5 Mbps (see Applications Informationsection).• −7V to+12V Common-Mode InputVoltage Range The transceiverdraws 200 μA ofsupplycurrentwhen unloadedor fullyloadedwiththedriverdisabledand• TRI-STATE Outputs on Driverand Receiver operatesfroma single+5V supply.• AC Performance: The driveris short-circuitcurrentlimitedand is– DriverTransitionTime: 25 ns typ protectedagainstexcessivepower dissipationby– DriverPropagationDelay:40 ns typ thermal shutdown circuitrythat places the driver– DriverSkew: 1 ns typ outputs into TRI-STATE (High Impedance state) underfaultconditions.The driverensuresa minimum– ReceiverPropagationDelay:200 ns typ of 1.5V differentialoutput voltagewith maximum– ReceiverSkew: 20 ns typ loadingacrossthecommon mode range(VOD3 ).• Half-DuplexFlow Through Pinout The receiverhas a failsafefeaturethatensures a• Operates From a Single5V Supply logic-highoutputiftheinputisopen circuit.• Allows Up To 32 Transceiverson theBus The DS485 is availablein 8-pinSOIC and PDIP• Current-Limitingand Thermal Shutdown For packages and is characterizedfor IndustrialandDriverOverload Protection Commercialtemperaturerangeoperation.
• IndustrialTemperature Range Operation
• Pin and FunctionalCompatible With MAX485 and LTC485 TRUTH TABLEConnection and Logic Diagram DRIVER SECTION RE* DE DI A B X H H H L X H L L H X L X Z Z RECEIVER SECTION RE* DE A-B RO L L ≥+0.2V H L L ≤−0.2V L H X X Z L L OPEN* (1) H (1) Non Terminated,Open Inputonly Figure1. 8-PinSOIC or PDIP X = indeterminate See D or P Package Z = TRI-STATE Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1998–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SNLS122C –JULY 1998–REVISED APRIL 2013 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. ABSOLUTE MAXIMUM RATINGS (1)(2) SupplyVoltage(VCC ) +12V EnableInputVoltage(RE*,DE) −0.5Vto(VCC + 0.5V) DriverInputVoltage(DI) −0.5Vto(VCC + 0.5V) DriverOutputVoltage(A,B) −14V to+14V ReceiverInputVoltage(A,B) −14V to+14V ReceiverOutputVoltage(RO) −0.5Vto(VCC + 0.5V) Maximum Package Power Dissipation@ +25°C SOIC Package 1.19W DerateSOIC Package 9.5mW/ °C above +25°C DeratePDIP Package 6.0mW/ °C above +25°C Maximum Package Power Dissipation@ +70°C SOIC Package 0.76W StorageTemperatureRange −65°C to+150°C Lead TemperatureRange Soldering,4 sec +260°C ESD (HBM) ≥2 kV (1) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. (2) AbsoluteMaximum Ratingsarethosevaluesbeyond whichthesafetyofthedevicecannotbe ensured.They arenotmeant toimplythat thedevicesshouldbe operatedattheselimits.The tableofELECTRICAL CHARACTERISTICS specifiesconditionsofdeviceoperation. RECOMMENDED OPERATING CONDITIONS Min Typ Max Units SupplyVoltage(VCC ) +4.75 +5.0 +5.25 V OperatingFreeAirTemperature(TA) DS485 0 +25 +70 °C DS485T −40 +25 +85 °C Bus Common Mode Voltage −7 +12 V

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ELECTRICAL CHARACTERISTICS

Over SupplyVoltageand OperatingTemperatureRanges,unlessotherwisespecified(1)(2) Symbol Parameter Conditions Pin Min Typ Max Units VOD1 DifferentialDriverOutputVoltage (No Load) A,B 5 V VOD2 DifferentialDriverOutputVoltage R L = 50Ω,(RS422),See Figure2 2 2.8 V withLoad R L = 27Ω,(RS485),See Figure2 1.5 2.3 5 V ΔVOD Change inMagnitudeofOutput R L = 27Ω or50Ω(3) 0.2 |V|DifferentialVoltage VOD3 DifferentialDriverOutputVoltage— R1 = 54Ω,R2 = 375Ω 1.5 2.0 5 VFullLoad withMax VCM VTEST = −7V to+12V, See Figure6 VOC DriverCommon-Mode OutputVoltage R L = 27Ω or50Ω,See Figure2 3 V ΔVOC Change inMagnitudeofCommon-Mode R L = 27Ω or50Ω,See Figure2(3) 0.2 |V|OutputVoltage VIH InputHighVoltage DI, 2.0 V DE,VIL InputLow Voltage 0.8 VRE* IIN1 InputCurrent VIN = 0V orVCC ±2 μA IIN2 InputCurrent(4) VIN = +12V A,B 1.0 mA DE = 0V,VCC = 0V or5.25V VIN = −7V −0.8 mA VTH ReceiverDifferentialThresholdVoltage −7V ≤ VCM ≤ +12V −0.2 0.2 V ΔVTH ReceiverInputHysteresis VCM = 0V 70 mV VOH ReceiverOutputHighVoltage IO = −4 mA, VID = 0.2V RO 3.5 V VOL ReceiverOutputLow Voltage IO = 4 mA, VID = −0.2V 0.4 V IOZR TRI-STATE OutputCurrentatReceiver 0.4V≤ VO ≤ 2.4V ±1 μA R IN ReceiverInputResistance −7V ≤ VIN ≤ +12V A,B 12 kΩ ICC No-Load SupplyCurrent(5) DE = VCC ,RE* = 0V orVCC VCC 200 900 μA DE = 0V,RE* = 0V orVCC 200 500 μA IOSD1 DriverShortCircuitCurrent,VO = HIGH −7V ≤ VO ≤ +12V A,B 35 250 mA IOSD2 DriverShortCircuitCurrent,VO = LOW −7V ≤ VO ≤ +12V 35 250 mA IOSR ReceiverShortCircuitCurrent 0V ≤ VO ≤ VCC RO 7 85 mA (1) Currentintodevicepinsisdefinedas positive.Currentoutofdevicepinsisdefinedas negative.Allvoltagesarereferencedtoground exceptVOD1/2/3 and VID. (2) Alltypicalsaregivenfor:VCC = +5.0V,TA = +25°C. (3) Δ|VOD |and Δ|VOC |arechanges inmagnitudeofV OD and VOC respectively,thatoccurwhen theinputchanges state. (4) IIN2 includesthereceiverinputcurrentand driverTRI-STATE leakagecurrent. (5) Supplycurrentspecificationisvalidforloadedtransmitterswhen DE = 0V orenabled(DE = H) withno load. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS485

SNLS122C –JULY 1998–REVISED APRIL 2013 www.ti.com SWITCHING CHARACTERISTICS Over SupplyVoltageand OperatingTemperatureRanges,unlessotherwisespecified(1)(2)(3) Symbol Parameter Conditions Min Typ Max Units tPLHD DriverDifferentialPropagationDelay— Low toHigh R L = 54Ω,C L = 100 pF 10 40 65 ns tPHLD DriverDifferentialPropagationDelay— HightoLow 10 39 65 ns tSKEW DifferentialSkew |tPHLD − tPLHD | 1 10 ns tr DriverRiseTime 3 25 40 ns tf DriverFallTime 3 25 40 ns tZH DriverEnabletoOutputHigh C L = 100 pF 170 ns tZL DriverEnabletoOutputLow C L = 100 pF 170 ns tLZ DriverDisablefromOutputLow C L = 15 pF 170 ns tHZ DriverDisablefromOutputHigh C L = 15 pF 170 ns tPLHD ReceiverDifferentialPropagationDelay— Low toHigh C L = 15 pF (RO) 70 190 320 ns tPHLD ReceiverDifferentialPropagationDelay— HightoLow 70 210 320 ns tSKEW DifferentialSkew |tPHLD − tPLHD | 20 50 ns tZH ReceiverEnabletoOutputHigh C L = 15 pF 110 ns tZL ReceiverEnabletoOutputLow 110 ns tLZ ReceiverDisablefromOutputLow 110 ns tHZ ReceiverDisablefromOutputHigh 110 ns fmax Maximum Data Rate See (4) 2.5 Mbps (1) Alltypicalsaregivenfor:VCC = +5.0V,TA = +25°C. (2) f= 1 MHz, tr and tf≤ 6 ns,ZO = 50Ω. (3) C L includesjigand probecapacitance. (4) fmax istheensureddataratefor50 ftoftwistedpaircable.fmax may be conservativelydeterminedfromtheratioofdrivertransitiontime (tr)tothedatarateunitinterval(1/fmax ).Usinga 10% ratioyieldsfmax = (0.1)/40ns = 2.5Mb/s.Higherdataratesmay be supportedby allowinglargerratios.

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www.ti.com SNLS122C –JULY 1998–REVISED APRIL 2013 PARAMETER MEASUREMENT INFORMATION Figure2.VOD Figure3. Figure4. Figure5. Figure6. VOD3 Figure7. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS485

SNLS122C –JULY 1998–REVISED APRIL 2013 www.ti.com Figure8. Figure9. Figure10. Figure11. Figure12. Figure13.

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www.ti.com SNLS122C –JULY 1998–REVISED APRIL 2013 Figure14. PIN DESCRIPTIONS Pin # I/O Name Function 1 O RO ReceiverOutput:IfA > B by 200 mV, RO willbe high;IfA < B by 200 mV, RO willbe low.RO willbe highalsoif theinputs(A and B) areopen (non-terminated). 2 I RE* ReceiverOutputEnable:RO isenabledwhen RE* islow;RO isinTRI-STATE when RE* ishigh. 3 I DE DriverOutputEnable:The driveroutputs(A and B) areenabledwhen DE ishigh;theyareinTRI-STATE when DE islow.PinsA and B alsofunctionas thereceiverinputpins(seebelow). 4 I DI DriverInput:A lowon DI forcesA lowand B highwhilea highon DI forcesA highand B lowwhen thedriveris enabled.

5 NA GND Ground

6 I/O A Non-invertingDriverOutputand ReceiverInputpin.DriveroutputlevelsconformtoRS-485 signalinglevels. 7 I/O B InvertingDriverOutputand ReceiverInputpin.DriveroutputlevelsconformtoRS-485 signalinglevels. 8 NA VCC Power Supply:4.75V≤ VCC ≤ 5.25V RelatedTILow Power RS-485 Transceivers PartNumber Temperature Range Number ofXCVRs on Bus Comments DS36C278 0°C to+70°C 128 UltraLow Power Transceiver DS36C278T −40°C to+85°C 64 UltraLow Power Transceiver DS36C279 0°C to+70°C 128 Auto-SleepMode DS36C279T −40°C to+85°C 64 Auto-SleepMode DS36C280 0°C to+70°C 128 AdjustableSlew Rate Control DS36C280T −40°C to+85°C 64 AdjustableSlew Rate Control Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS485

SNLS122C –JULY 1998–REVISED APRIL 2013 www.ti.com APPLICATIONS INFORMATION The DS485 isa low power transceiverdesignedforuse in RS-485 multipointapplications.The DS485 can transmitdataup to2.5Mbps based on a ratioofdrivertransitiontimetotheunitinterval(bittime)of10%. This maximum data ratemay be furtherlimitedby the interconnectingmedia.The DS485 providesa standardunit loadto the RS-485 bus acrossthe common mode range of −7V to +12V. Thisallowsup to 32 transceivers (standardunitload)tobe connectedtothebus.More transceiversmay be connectedtothebus iftheysupporta reducedunitload(seeRelatedTILow Power RS-485 Transceivers).The DS485 alsoensuresthedriver'soutput differentialvoltageintoa worstcase loadthatmodels standardterminationloadsand 32 unitloadsreferencedto themaximum common mode voltageextremes.Witha minimum of1.5V swingintothisload,a 1.3V differential noisemarginissupportedalongwiththestandardcommon mode rejectionrangeofthereceivers. Due tothemultipointnatureofthebus,contentionbetween driversmay occur.Thiswillnotcause damage tothe driverssincethey featureshort-circuitprotectionand also thermalshutdown protection.Thermal shutdown senses die temperatureand puts the driveroutputsintoTRI-STATE ifa faultconditionoccursthatcauses excessivepower dissipationwhichcan elevatethejunctiontemperatureto+150°C. A typicalmultipointapplicationisshown inthefollowingfigure.Note thatterminationistypicallyrequiredbutis onlylocatedatthetwo ends ofthecable(noton everynode).Commonly pullup and pulldown resistorsmay be requiredat one end of the bus to providea failsafebias.These resistorsprovidea biasto the linewhen all driversareinTRI-STATE. See ApplicationNote AN-847(SNLA031 )fora completediscussionoffailsafebiasing ofdifferentionbuses. Figure15. MultipointRS-485 Application

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REVISION HISTORY

Changes from RevisionB (April2013)toRevisionC Page Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:DS485

www.ti.com 19-Mar-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples DS485M NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 DS485 M DS485M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS485 M DS485MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS485 M DS485N/NOPB ACTIVE PDIP P 8 40 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 DS485 N DS485TM NRND SOIC D 8 95 TBD Call TI Call TI -40 to 85 DS485 TM DS485TM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS485 TM DS485TMX NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 85 DS485 TM DS485TMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS485 TM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

www.ti.com 19-Mar-2015 Addendum-Page 2 (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS485MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 DS485TMX SOIC D 8 2500 367.0 367.0 35.0 DS485TMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 Pack Materials-Page 2

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