DS481

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www.ti.com SNLS131B –JULY 2000–REVISED MARCH 2013 DS481LowPowerRS-485/RS-422MultipointTransceiverwithSleepMode Check forSamples: DS481 1FEATURES DESCRIPTION The DS481 is a low-powertransceiverforRS-485 2• Meets TIA/EIARS-485 MultipointStandard and RS-422 communication.The devicecontainsone• Sleep Mode Reduces ICC to0.2μA driverand one receiver.The driversslew rateallows

• Guaranteed FullLoad Output Voltage(VOD3 ) for operationup to 2.0 Mbps (see Applications Information).• Low QuiescentCurrent:200 μA typ
• −7V to+12V Common-mode InputVoltage The transceiverdraws 200 μA ofsupplycurrentwhen unloaded or 0.2 μA when in the automaticsleepRange mode. Sleep mode isactivatedby inactivityon the• TRI-STATE Outputs on Driverand Receiver enables(DE and RE (1)).HoldingDE =L and RE (1)=H• AC Performance: forgreaterthan 600 ns willenablethe sleepmode. – DriverTransitionTime: 25 ns typ The DS481 operatesfroma single+5V supply. – DriverPropagationDelay:40 ns typ The driveris short-circuitcurrentlimitedand is protectedagainstexcessivepower dissipationby– DriverSkew: 1 ns typ thermal shutdown circuitrythat places the driver– ReceiverPropagationDelay:200 ns typ outputs into TRI-STATE (High Impedance state)– ReceiverSkew: 20 ns typ under faultconditions.The driverguarantees a
• Half-duplexFlow Through Pinout minimum of 1.5V differentialoutput voltagewith maximum loadingacross the common mode range• Operates From a Single5V Supply (VOD3 ).• Allows up to64 Transceiverson theBus The receiverhas a failsafefeaturethatguaranteesa• Current-limitingand Thermal Shutdown for logic-highoutputiftheinputisopen circuit.DriverOverload Protection The DS481 isavailableina surfacemount package• IndustrialTemperature Range Operation and ischaracterizedforIndustrialtemperaturerange• Pin and FunctionalCompatible withMAX481C operation.and MAX481E (1) Non Terminated,Open Inputonly Connection and Logic Diagram *Non Terminated,Open Inputonly Figure1. SOIC Package Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2000–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SNLS131B –JULY 2000–REVISED MARCH 2013 www.ti.com Table1.Pin Descriptions Pin Name Number DESCRIPTION ReceiverOutput:When RE (ReceiverEnable)isLOW, thereceiverisenabled(ON),ifDO/RI RO 1 ≥ DO (1)/RI(1)by 200 mV, RO willbe HIGH. IfDO/RI ≤ DO (1)/RI(1)by 200 mV, RO willbe LOW. AdditionallyRO willbe HIGH forOPEN (Non-terminated)Inputs. ReceiverOutputEnable:When RE (1)isLOW thereceiveroutputisenabled.When RE (1)is RE (1) 2 HIGH, thereceiveroutputisinTRI-STATE (OFF).When RE (1)isHIGH and DE isLOW, the devicewillentera low-currentsleepmode after600 ns. DriverOutputEnable:When DE isHIGH, thedriveroutputsareenabled.When DE isLOW, DE 3 thedriveroutputsareinTRI-STATE (OFF).When RE (1)isHIGH and DE isLOW, thedevice willentera low-currentsleepmode after600 ns. DriverInput:When DE (DriverEnable)isHIGH, thedriverisenabled,ifDI isLOW, then DI 4 DO/RI willbe LOW and DO (1)/RI(1)willbe HIGH. IfDI isHIGH, thenDO/RI isHIGH and DO (1)/RI(1)isLOW. GND 5 Ground Connection. DO/RI 6 DriverOutput/ReceiverInput,485 Bus Pin. DO (1) 7 DriverOutput/ReceiverInput,485 Bus Pin./RI(1) PositivePower SupplyConnection:Recommended operatingrangeforVCC is+4.75V toVCC 8 +5.25V. (1) Non Terminated,Open Inputonly TruthTable DRIVER SECTION RE (1) DE DI A B X (2) H H H L X (2) H L L H RECEIVER SECTION RE (1) DE A-B RO L L ≥+0.2V H L L ≤−0.2V L L L OPEN (1) H (1) Non Terminated,Open Inputonly (2) X = indeterminate Z = TRI-STATE (3) Deviceenterssleepmode ifenableconditionsareheld> 600 ns,DE = L and RE = H. RE isNon Terminatedand Open Inputonly. These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates.

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www.ti.com SNLS131B –JULY 2000–REVISED MARCH 2013 AbsoluteMaximum Ratings (1)(2) SupplyVoltage(VCC ) +12V EnableInputVoltage (RE (3),DE) −0.5Vto(VCC + 0.5V) DriverInputVoltage(DI) −0.5Vto(VCC + 0.5V) DriverOutputVoltage(A,B) −14V to+14V ReceiverInputVoltage(A,B) −14V to+14V ReceiverOutputVoltage(RO) −0.5Vto(VCC + 0.5V) Maximum Package Power Dissipation@ +25°C DerateD0008A Package 9.5mW/ °C above +25°C Maximum Package Power Dissipation@ +70°C StorageTemperatureRange −65°C to+150°C Lead TemperatureRange (Soldering,4 sec.) +260°C ESD (HBM) ≥2 kV (1) “AbsoluteMaximum Ratings”arethosevaluesbeyond whichthesafetyofthedevicecannotbe guaranteed.They arenotmeant to implythatthedevicesshouldbe operatedattheselimits.The tableof“ElectricalCharacteristics”specifiesconditionsofdevice operation. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) Non Terminated,Open Inputonly Recommended OperatingConditions Min Typ Max Units SupplyVoltage(VCC ) +4.75 +5.0 +5.25 V OperatingFreeAir Temperature(TA) DS481T −40 +25 +85 °C Bus Common Mode Voltage −7 +12 V ElectricalCharacteristics Over SupplyVoltageand OperatingTemperatureRanges,unlessotherwisespecified(1)(2) Parameter TestConditions Pin Min Typ Max Units VOD1 DifferentialDriverOutputVoltage (No Load) A,B 1.5 5 V VOD2 DifferentialDriverOutputVoltage R L = 50Ω,(RS422),Figure2 2 2.8 V withLoad R L = 27Ω,(RS485),Figure2 1.5 2.3 5 V ΔVOD Change inMagnitudeofOutput R L = 27Ω or50Ω (3) 0.2 |V| DifferentialVoltage VOD3 DifferentialDriverOutputVoltage— R1 = 54Ω,R2 = 375Ω 1.5 2.0 5 VFullLoad withMax VCM VTEST = −7V to+12V, Figure3 VOC DriverCommon-Mode Output R L = 27Ω or50Ω,Figure2 0 3 V Voltage ΔVOC Change inMagnitudeofCommon- R L = 27Ω or50Ω,Figure2 0.2 |V| Mode (3) OutputVoltage (1) Currentintodevicepinsisdefinedas positive.Currentoutofdevicepinsisdefinedas negative.Allvoltagesarereferencedtoground exceptVOD1/2/3and VID. (2) Alltypicalsaregivenfor:VCC = +5.0V,TA = +25°C. (3) Δ|VOD |and Δ|VOC |arechanges inmagnitudeofV OD and VOC respectively,thatoccurwhen theinputchanges state. Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS481

SNLS131B –JULY 2000–REVISED MARCH 2013 www.ti.com ElectricalCharacteristics(continued) Over SupplyVoltageand OperatingTemperatureRanges,unlessotherwisespecified(1)(2) Parameter TestConditions Pin Min Typ Max Units VIH InputHighVoltage DI,DE, 2.0 V RE (4) VIL InputLow Voltage 0.8 V IIN1 InputCurrent VIN = 0V orVCC ±2 μA IIN2 InputCurrent(5) VIN = +12V DS481T A,B 0 190 500 μA DE = 0V,VCC = 0V or5.25V VIN = −7V 0 −100 −400 μA VTH ReceiverDifferentialThreshold −7V ≤ VCM ≤ +12V −0.2 0.2 V Voltage ΔVTH ReceiverInputHysteresis VCM = 0V 70 mV VOH ReceiverOutputHighVoltage IO = −4 mA, VID = 0.2V RO 3.5 V VOL ReceiverOutputLow Voltage IO = 4 mA, VID = −0.2V 0.5 V IOZR TRI-STATE OutputCurrentat 0.4V≤ V O ≤ 2.4V ±1 μA Receiver R IN ReceiverInputResistance −7V ≤ VIN ≤ +12V DS481T A,B 24 kΩ ICC No-Load SupplyCurrent(6) DE = V CC ,RE (4)= 0V orV CC VCC 200 500 μA DE = 0V,RE (4)= 0V orVCC 200 500 μA ICCX SleepMode SupplyCurrent DE = GND VCC 0.2 10 μARE (4)= VCC (Figure15) IOSD1 DriverShortCircuitCurrent,VO = −7V ≤ VO ≤ +12V A,B 250 mA HIGH IOSD2 DriverShortCircuitCurrent,VO = −7V ≤ VO ≤ +12V −250 mA LOW IOSR ReceiverShortCircuitCurrent VO = GND RO 7 85 mA (4) Non Terminated,Open Inputonly. (5) IIN2 includesthereceiverinputcurrentand driverTRI-STATE leakagecurrent. (6) Supplycurrentspecificationisvalidforloadedtransmitterswhen DE = 0V orenabled(DE = H) withno load.

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www.ti.com SNLS131B –JULY 2000–REVISED MARCH 2013 SwitchingCharacteristics Over SupplyVoltageand OperatingTemperatureRanges,unlessotherwisespecified(1)(2)(3) Parameter TestConditions Min Typ Max Units tPLHD DriverDifferentialPropagationDelay— Low toHigh R L = 54Ω,C L = 100 pF 10 40 80 ns tPHLD DriverDifferentialPropagationDelay— HightoLow 10 39 80 ns tSKEW DifferentialSkew |tPHLD − tPLHD | 0 1 10 ns tr DriverRiseTime 3 25 50 ns tf DriverFallTime 3 25 50 ns tZH DriverEnabletoOutputHigh C L = 100 pF 50 200 ns tZL DriverEnabletoOutputLow C L = 100 pF 65 200 ns tLZ DriverDisablefromOutputLow C L = 15 pF 80 200 ns tHZ DriverDisablefromOutputHigh C L = 15 pF 80 200 ns tPSH DriverEnablefromSleep C L = 100 pF 70 98 250 nsMode toOutputHigh (4)(Figure6,Figure7) tPSL DriverEnablefromSleep C L = 100 pF 70 98 250 nsMode toOutputLow (4)(Figure8 ,Figure9) tPLHD ReceiverDifferentialPropagationDelay— Low toHigh C L = 15 pF (RO) 30 190 400 ns tPHLD ReceiverDifferentialPropagationDelay— HightoLow 30 210 400 ns tSKEW DifferentialSkew |tPHLD − tPLHD | 0 20 50 ns tZH ReceiverEnabletoOutputHigh C L = 15 pF 45 150 ns tZL ReceiverEnabletoOutputLow 40 150 ns tLZ ReceiverDisablefromOutputLow 50 150 ns tHZ ReceiverDisablefromOutputHigh 55 150 ns tPSH ReceiverEnablefromSleep C L = 15 pF 70 97 250 nsMode toOutputHigh (4)(Figure12,Figure14) tPSL ReceiverEnablefromSleep C L = 15 pF 70 95 250 nsMode toOutputLow (4)(Figure12,Figure13) tSLEEP Time toSleep(Device) DE = L and RE (5)= H 50 600 ns(Figure15) fmax Maximum Data Rate (6) 2.0 Mbps (1) Alltypicalsaregivenfor:VCC = +5.0V,TA = +25°C. (2) f= 1 MHz, tr and tf≤ 6 ns,ZO = 50Ω. (3) C L includesjigand probecapacitance. (4) Forenablefromsleepmode delaysDE = L and RE = H forgreaterthan600 ns priortotest(deviceisinsleepmode).RE isNon Terminated,Open Inputonly. (5) Non Terminated,Open Inputonly (6) fmax istheguaranteeddataratefor50 ftoftwistedpaircable.fmax may be conservativelydeterminedfromtheratioofdrivertransition time(tr)tothedatarateunitinterval(1/fmax ).Usinga 10% ratioyieldsfmax = (0.1)/50ns = 2.0Mb/s.Higherdataratesmay be supported by allowinglargerratios. Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS481

SNLS131B –JULY 2000–REVISED MARCH 2013 www.ti.com PARAMETER MEASUREMENT INFORMATION Figure2.VOD Figure3.VOD3 Figure4. Figure5.

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www.ti.com SNLS131B –JULY 2000–REVISED MARCH 2013 Figure6. Figure7. Figure8. Figure9. Figure10. Figure11. Figure12. Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS481

SNLS131B –JULY 2000–REVISED MARCH 2013 www.ti.com Figure13. Figure14. *Note:Non Terminated,Open Inputonly Figure15. EnteringSleep Mode Conditions(modes and exitparametersshown)

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www.ti.com SNLS131B –JULY 2000–REVISED MARCH 2013 UnitLoad A unitload foran RS-485 receiverisdefinedby the inputcurrentversusthe inputvoltagecurve.The gray shaded regionisthedefinedoperatingrangefrom−7V to+12V. The topborderextendingfrom−3V at0 mA to +12V at+1 mA isdefinedas one unitload.Likewise,thebottomborderextendingfrom+5V at0 mA to−7V at −0.8mA isalsodefinedas one unitload(seeFigure16 ).An RS-485 driveriscapableofdrivingup to32 unit loads.Thisallowsup to 32 nodes on a singlebus.Althoughsufficientformany applications,itissometimes desirabletohave even more nodes. The DS481 has ½ unitloadand willallowup to64 nodes guaranteedovertemperature. For a ½ UL devicethetopand bottombordersshown inFigure16 are scaled.Both 0 mA referencepointsat +5V and −3V staythesame. The otherreferencepointsare+12V at+0.5mA forthetopborderand −7V at−0.4 mA forthebottomborder(seeFigure16).Again,both0 mA referencepointsat+5V and −3V staythesame. The otherreferencepointsare+12V at+0.25mA forthetopborderand −7V at−0.2mA forthebottomborder(see Figure16). The advantageofthe½ UL deviceistheincreasednumber ofnodes on one bus.Ina singlemastermulti-slave typeofapplicationwhere thenumber ofslavesexceeds 32,theDS481 may save inthecostofextradeviceslike repeaters,extramedia likecable,and/orextracomponents likeresistors. Figure16. InputCurrentvs InputVoltageOperatingRange Sleep Mode The DS481 featuresan automaticsleepmode thatallowsthedevicetosave power when nottransmittingdata. Sincethesleepmode isautomatic,no externalcomponents arerequired.Itmay be used as littleoras much as theapplicationrequires.The more thefeatureisutilized,themore power itsaves. The sleepmode isautomaticallyenteredwhen boththedriverand receiveraredisabled.Thisoccurswhen both theDE pinisassertedtoa logiclow and theRE (7)pinisassertedtoa logichigh.Once bothpinsareasserted thedevicewillentersleepmode after50 ns.The DS481 isguaranteedtogo intosleepmode within600 ns after bothpinsareasserted.The devicewakes up (comes outofsleepmode) when eithertheDE pinisassertedtoa logichighand/ortheRE (7)pinisassertedtoa logiclow.Afterthedeviceenterssleepmode itwilltakelongerfor thedevicetowake up thanitdoes forthedevicetoenablefrom TRI-STATE. Refertodatasheetspecifications tPSL and tPSH and compare withtPZL and tPZH fortimingdifferences. The benefitoftheDS481 isdefinitelyitspower savings.When activethedevicehas a maximum ICC of500 μA. When insleepmode the devicehas a maximum ICC of only10 μA, which is50 timeslesspower than when active.The ICC when thedeviceisactiveisalreadyverylowbutwhen insleepmode theICC isultralow. (7) Non Terminated,Open Inputonly Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:DS481

SNLS131B –JULY 2000–REVISED MARCH 2013 www.ti.com APPLICATIONS INFORMATION Figure17. MultipointRS-485 Application

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www.ti.com SNLS131B –JULY 2000–REVISED MARCH 2013

REVISION HISTORY

Changes from RevisionA (March 2013)toRevisionB Page Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:DS481

www.ti.com 12-Oct-2014 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples DS481TM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS481 TM DS481TMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS481 TM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

www.ti.com 12-Oct-2014 Addendum-Page 2 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS481TMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 Pack Materials-Page 2

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