DS3695A_14 TI1 | Alldatasheet
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DS3695A,DS3695AT,DS3696A www.ti.com SNLS353C –FEBRUARY 1996–REVISED APRIL 2013 DS3695A/DS3695AT/DS3696AMultipointRS485/RS422Transceivers Check forSamples: DS3695A ,DS3695AT ,DS3696A 1FEATURES DESCRIPTION The DS3695A and DS3696A are high speed 2• Meets EIA Standard RS485 forMultipointBus differentialTRI-STATE bus/linetransceiversdesignedTransmissionand isCompatible withRS-422 tomeet therequirementsofEIA standardRS485 with• 10 Ns DriverPropagationDelays (Typical) extended common mode range (+12V to −7V), for
- Single+5V Supply multipointdata transmission.In additionthey are compatiblewithrequirementsofRS-422.• −7V to+12V Bus Common Mode Range Permits±7V Ground Differencebetween The driverand receiveroutputsfeatureTRI-STATE Devices on theBus capability.The driveroutputsremain in over the entirecommon mode range of +12V to −7V. Bus• Thermal Shutdown Protection faultsthatcause excessivepower dissipationwithin• High Impedance toBus withDriverinTRI- the devicetriggera thermalshutdown circuit,whichSTATE or withPower Off,over theEntire forcesthe driveroutputsintothe high impedanceCommon Mode Range Allows theUnused state.The DS3696A providesan outputpin (TS) Devices on theBus tobe Powered Down whichreportsthethermalshutdown ofthedevice.TS isan “open collector” pinwithan internal10 kΩ pull-• Combined Impedance ofa DriverOutput and up resistor.This allowsthe TS outputsof severalReceiverInputislessthan One RS485 Unit devicestobe wireOR-ed.Load, Allowingup to32 Transceiverson the Bus Both AC and DC specificationsare guaranteedover the 0°C to 70°C temperatureand 4.75V to 5.25V• 70 mV TypicalReceiverHysteresis supplyvoltagerange.• AvailableinSOIC Packaging Connection and Logic Diagrams Figure1.Molded Package, Small Outline(D0008A) Figure2.Top View Top View (See Package Number D0008A) TS was LF (LineFault)on previousdatasheets,TS goes lowupon thermalshutdown. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1996–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
DS3695A,DS3695AT,DS3696A SNLS353C –FEBRUARY 1996–REVISED APRIL 2013 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings (1)(2) SupplyVoltage,VCC 7V ControlInputVoltages 7V DriverInputVoltage 7V DriverOutputVoltages +15V/−10V ReceiverInputVoltages +15V/−10V ReceiverOutputVoltage 5.5V ContinuousPower Dissipation@ 25°C StorageTemp. Range −65°C to+150°C Lead Temp. (Soldering4 seconds) 260°C (1) “Absolutemaximum ratings”arethosebeyond whichthesafetyofthedevicecannotbe verified.They arenotmeant toimplythatthe deviceshouldbe operatedattheselimits.The tablesof“ElectricalCharacteristics”provideconditionsforactualdeviceoperation. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) Deratelinearlyat6.5mW/ °C to337 mW at70°C. Recommended OperatingConditions Min Max Units SupplyVoltage,VCC 4.75 5.25 V Bus Voltage −7 +12 V OperatingFreeAirTemperature(TA) Commercial(DS3695AM) 0 +70 °C Industrial(DS3695ATM) −40 +85 °C Commercial(DS3696AM) 0 +70 °C ElectricalCharacteristics(1)(2) 0°C ≤ TA ≤ 70°C, 4.75V < VCC < 5.25Vunlessotherwisespecified Parameter TestConditions Min Typ Max Units VOD1 DifferentialDriverOutputVoltage(Unloaded) IO = 0 5 V VOD2 DifferentialDriverOutputVoltage(withLoad) R = 50Ω;(RS-422)(3) 2 V ΔVOD ComplementaryOutputStates R = 27Ω 0.2 V DifferentialOutputVoltageFor Change inMagnitudeofDriver VOC DriverCommon Mode OutputVoltage 3.0 V Δ|VOC | Change inMagnitudeofDriver 0.2 V Common Mode OutputVoltage ForComplementaryOutputStates VIH InputHighVoltage DI,DE, RE , 2 V RE/DEVIL InputLow Voltage 0.8 V VCL InputClamp Voltage IIN = −18 mA −1.5 V IIL InputLow Current VIL= 0.4V −200 μA IIH InputHighCurrent VIH = 2.4V 20 μA (1) Allcurrentsintodevicepinsarepositive;allcurrentsoutofdevicepinsarenegative.Allvoltagesarereferencedtodevicegroundunless otherwisespecified. (2) AlltypicalsaregivenforVCC = 5V and TA = 25°C. (3) Alllimitsforwhichthisnoteisappliedmust be deratedby 10% forDS3695AT. Otherparametersremainthesame forthisextended temperaturerangedevice(−40°C ≤ TA ≤ +85°C).
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DS3695A,DS3695AT,DS3696A www.ti.com SNLS353C –FEBRUARY 1996–REVISED APRIL 2013 ElectricalCharacteristics(1)(2)(continued) 0°C ≤ TA ≤ 70°C, 4.75V < VCC < 5.25Vunlessotherwisespecified Parameter TestConditions Min Typ Max Units IIN InputCurrent RI,RI,DO/RI, VCC = 0V or5.25V, VIN = 12V +1.0 mA DO/RI DE orR E /DE = 0V VIN = −7V −0.8 mA VTH DifferentialInputThresholdVoltageforReceiver −7V ≤ VCM ≤ +12V −0.2 +0.2 V ΔVTH ReceiverInputHysteresis VCM = 0V 70 mV VOH ReceiverOutputHighVoltage IOH = −400 μA 2.4 V VOL OutputLow Voltage RO IOL = 16 mA (3) 0.5 V TS IOL = 8 mA 0.45 V IOZR OutputCurrentatReceiverOFF-State(High 0.4V≤ VO ≤ 2.4V,VCC = Max, ±20 μAImpedance) R IN ReceiverInputResistance −7V ≤ VCM ≤ +12V 12 kΩ ICC SupplyCurrent DriverOutputs 42 60 mA Enabled No Load(3) DriverOutputs 27 40 mA Disabled IOSD VO = −7V (3) −250 mA OutputCurrentDriverShort-Circuit VO = +12V (3) +250 mA IOSR OutputCurrentReceiverShort-Circuit VO = 0V −15 −85 mA ReceiverSwitchingCharacteristics 0°C ≤ TA ≤ 70°C, 4.75V < VCC < 5.25Vunlessotherwisespecified(4) Symbol TestConditions Min Typ Max Units tPLH C L = 15 pF 15 28 42 ns tPHL S1 and S2 15 28 42 ns |tPLH –tPHL | Closed 0 3 ns tPLZ C L = 15 pF,S2 Open 5 29 35 ns tPHZ C L = 15 pF,S1 Open 5 12 16 ns tPZL C L = 15 pF,S2 Open 7 15 28 ns tPZH C L = 15 pF,S1 Open 7 15 20 ns (4) AlltypicalsaregivenforVCC = 5V and TA = 25°C. DriverSwitchingCharacteristics 0°C ≤ TA ≤ 70°C, 4.75V < VCC < 5.25Vunlessotherwisespecified(1) Symbol TestConditions Min Typ Max Units SINGLE ENDED CHARACTERISTICS (Figure7,Figure8,and Figure10) tPLH R LDIFF = 60Ω 9 15 22 ns tPHL C L1 = C L2 = 100 pF 9 15 22 ns tSKEW |tPLH –tPHL | 0 2 8 ns tPLZ C L = 15 pF,S2 Open 7 15 30 ns tPHZ C L = 15 pF,S1 Open 7 15 30 ns tPZL C L = 100 pF,S2 Open 30 35 50 ns tPZH C L = 100 pF,S1 Open 30 35 50 ns DIFFERENTIAL SWITCHING CHARACTERISTICS (Figure10) tr,tf R LDIFF = 60Ω 6 10 18 nsC L1 = C L2 = 100 pF (1) AlltypicalsaregivenforVCC = 5V and TA = 25°C. Copyright© 1996–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS3695A DS3695AT DS3696A
DS3695A,DS3695AT,DS3696A SNLS353C –FEBRUARY 1996–REVISED APRIL 2013 www.ti.com AC TEST CIRCUITS AND SWITCHING WAVEFORMS Figure3. ReceiverPropagationDelay TestCircuit Differentialinputvoltagemay be realizedby groundingRI and pulsingRI between +2.5V and −2.5V Figure4. ReceiverInput-to-OutputPropagationDelay Timing Figure5. ReceiverEnable/DisablePropagationDelay Timing Figure6. Unless OtherwiseSpecifiedtheSwitches areClosed
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DS3695A,DS3695AT,DS3696A www.ti.com SNLS353C –FEBRUARY 1996–REVISED APRIL 2013 Figure7. DriverPropagationDelay TestCircuits tPLH and tPHL aremeasured totherespective50% points.tSKEW isthedifferencebetween propagationdelaysofthe complementaryoutputs. Figure8. DriverInput-to-OutputPropagationDelay Timing (Single-Ended) Figure9. DriverEnable/DisablePropagationDelay Timing Figure10. DriverDifferentialTransitionTiming Copyright© 1996–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS3695A DS3695AT DS3696A
DS3695A,DS3695AT,DS3696A SNLS353C –FEBRUARY 1996–REVISED APRIL 2013 www.ti.com Table1.FunctionTablesDS3695A/DS3696A Transmitting(1) Inputs Line Outputs RE DE DI Condition DO DO TS *(DS3696A Only) X 1 1 No Fault 0 1 H X 1 0 No Fault 1 0 H X 0 X X Z Z H X 1 X Fault Z Z L Table2.FunctionTablesDS3695A/DS3696A Receiving(1) Inputs Outputs RE DE RI–RI RO TS *(DS3696A Only) 0 0 ≥+0.2V 1 H 0 0 ≤−0.2V 0 H 0 0 InputsOpen** 1 H 1 0 X Z H (1) X — Don 'tcarecondition Z — Highimpedance state Fault— Improperlineconditionscausingexcessivepower dissipationinthedriver,such as shortsorbus contentionsituations *TS isan “open collector”outputwithan on-chip10 kΩ pull-upresistor. **Thisisa failsafecondition (1) X — Don 'tcarecondition Z — Highimpedance state Fault— Improperlineconditionscausingexcessivepower dissipationinthedriver,such as shortsorbus contentionsituations *TS isan “open collector”outputwithan on-chip10 kΩ pull-upresistor. **Thisisa failsafecondition TypicalApplication Repeatercontrollogicnotshown. Figure11.
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DS3695A,DS3695AT,DS3696A www.ti.com SNLS353C –FEBRUARY 1996–REVISED APRIL 2013
REVISION HISTORY
Changes from RevisionB (April2013)toRevisionC Page Copyright© 1996–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS3695A DS3695AT DS3696A
www.ti.com 12-Jul-2014 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples DS3695AM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 DS36 95AM DS3695AM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS36 95AM DS3695AMX NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 70 DS36 95AM DS3695AMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS36 95AM DS3695ATM NRND SOIC D 8 95 TBD Call TI Call TI -40 to 85 DS369 5ATM DS3695ATM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS369 5ATM DS3695ATMX NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 85 DS369 5ATM DS3695ATMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS369 5ATM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
www.ti.com 12-Jul-2014 Addendum-Page 2 (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS3695AMX SOIC D 8 2500 367.0 367.0 35.0 DS3695AMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 DS3695ATMX SOIC D 8 2500 367.0 367.0 35.0 DS3695ATMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 Pack Materials-Page 2
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