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www.ti.com SNLS077C –JULY 1998–REVISED APRIL 2013 DS36954QuadDifferentialBusTransceiver Check forSamples: DS36954 1FEATURES DESCRIPTION The DS36954 is a low power, quad EIA-485 2• PinoutforSCSI Interface differentialbus transceiverespeciallysuitedforhigh• Compact 20-PinPLCC or SOIC Package speed, parallel,multipoint,I/O bus applications.A
- Meets EIA-485Standard forMultipointBus compact 20-pin surface mount PLCC or SOIC Transmission package provideshightransceiverintegrationand a verysmallPC boardfootprint.• Greaterthan 60 mA Source/SinkCurrents Propagationdelayskew between devicesisspecified• Thermal Shutdown Protection to aid in parallelinterfacedesigns— limitson• Glitch-FreeDriverOutputs on Power Up and maximum and minimum delaytimesareverified.Down Fivedevicescan implementa completeSCSI initiator or targetinterface.Three transceiversina package are pinnedout fordata bus connections.The fourth transceiver,with the flexibilityprovided by its individualenables, can serve as a controlbus transceiver. Connection Diagram Logic Diagram See Package Number FN (S-PQCC-J20) See Package Number DW (R-PDSO-G20) Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1998–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SNLS077C –JULY 1998–REVISED APRIL 2013 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings (1)(2) SupplyVoltage 7V ControlInputVoltage VCC + 0.5V DriverInputVoltage VCC + 0.5V DriverOutputVoltage/ReceiverInputVoltage −10V to+15V ReceiverOutputVoltage 5.5V ContinuousPower Dissipation@ +25°C DerateFN Package 13.9mW/ °C above +25°C DerateDW Package 13.7mW/ °C above +25°C StorageTemperatureRange −65°C to+150°C Lead Temperature(Soldering4 Sec.) 260°C (1) “AbsoluteMaximum Ratings”arethosevaluesbeyond whichthesafetyofthedevicecannotbe verified.They arenotmeant toimply thatthedevicesshouldbe operatedattheselimits.The tablesof“ElectricalCharacteristics”specifyconditionsfordeviceoperation. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentSalesOffice/Distributorsforavailabilityand specifications. Recommended OperatingConditions Min Max Units SupplyVoltage,VCC 4.75 5.25 V Bus Voltage −7 +12 V OperatingFreeAirTemperature(TA) 0 +70 °C ElectricalCharacteristics(1)(2) Over SupplyVoltageand OperatingTemperatureranges,unlessotherwisespecified Symbol Parameter Conditions Min Typ Max Units DRIVER CHARACTERISTICS VODL DifferentialDriverOutputVoltage(FullIL = 60 mA 1.5 1.9 V Load) VCM = 0V VOD DifferentialDriverOutputVoltage R L = 100Ω (EIA-422) 2.0 2.25 V (TerminationLoad) R L = 54Ω (EIA-485) 1.5 2.0 V ΔIVODI Change inMagnitudeofDriver R L = 54 or100Ω (3)(Figure1 )(EIA-422/485) 0.2 V DifferentialOutputVoltagefor ComplementaryOutputStates VOC DriverCommon Mode OutputVoltage R L = 54Ω (Figure1 )(EIA-485) 3.0 V(4) ΔIVOCI Change inMagnitudeofCommon (3)(Figure1 )(EIA-422/485) 0.2 VMode OutputVoltage VOH OutputVoltageHigh IOH = −55 mA 2.7 3.2 V VOL OutputVoltageLow IOL = 55 mA 1.4 1.7 V VIH InputVoltageHigh 2.0 V VIL InputVoltageLow 0.8 V VCL InputClamp Voltage ICL = −18 mA −1.5 V (1) Currentintodevicepinsisdefinedas positive.Currentoutofdevicepinsisdefinedas negative.Allvoltagesarereferencedtoground unlessotherwisespecified. (2) AlltypicalsaregivenforVCC = 5V and TA = 25°C. (3) Δ IVODI and Δ IVOCI arechanges inmagnitudeofVOD and VOC ,respectively,thatoccurwhen theinputchanges state. (4) InEIA StandardsEIA-422and EIA-485,VOC ,whichistheaverageofthetwo outputvoltageswithrespecttoground,iscalledoutput offsetvoltage,VOS .
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www.ti.com SNLS077C –JULY 1998–REVISED APRIL 2013 ElectricalCharacteristics(1)(2)(continued) Over SupplyVoltageand OperatingTemperatureranges,unlessotherwisespecified Symbol Parameter Conditions Min Typ Max Units IIH InputHighCurrent VIN = 2.4V (5) 20 μA IIL InputLow Current VIN = 0.4V (5) −20 μA IOSC DriverShort-CircuitOutputCurrent(6) VO = −7V (EIA-485) −130 −250 mA VO = 0V (EIA-422) −90 −150 mA VO = +12V (EIA-485) 130 250 mA RECEIVER CHARACTERISTICS IOSR ShortCircuitOutputCurrent VO = 0V (6) −15 −28 −75 mA IOZ TRI-STATE OutputCurrent VO = 0.4Vto2.4V 20 μA VOH OutputVoltageHigh VID = 0.2V,IOH = 0.4mA 2.4 3.0 V VOL OutputVoltageLow VID = −0.2V,IOL = 4 mA 0.35 0.5 V VTH DifferentialInputHighThreshold VO = VOH ,IO = −0.4mA (EIA-422/485) 0.03 0.2 VVoltage VTL DifferentialInputLow Threshold VO = VOL ,IO = 4.0mA (EIA-422/485) −0.2 −0.03 VVoltage(7) 0 VHST Hysteresis(8) VCM = 0V 35 60 mV DRIVER AND RECEIVER CHARACTERISTICS VIH EnableInputVoltageHigh 2.0 V VIL EnableInputVoltageLow 0.8 V VCL EnableInputClamp Voltage ICL = −18 mA −1.5 V IIN LineInputCurrent(9) OtherInput= 0V VI= +12V 0.5 1.0 mA DE/RE = 0.8V VI= −7V −0.45 −0.8 mADE4 = 0.8V IING LineInputCurrent(9) OtherInput= 0V VI= +12V 1.0 mA DE/RE and DE4 = 2V VI= −7VVCC = 3.0V −0.8 mA TA = +25°C IIH EnableInputCurrentHigh VIN = 2.4V VCC = 3.0V 1 40 μA DE/RE VCC = 4.75V 1 μA VCC = 5.25V 1 40 μA VIN = 2.4V VCC = 3.0V 1 20 μA DE4 orRE4 VCC = 5.25V 1 20 μA IIL EnableInputCurrentLow VIN = 0.8V VCC = 3.0V −6 −40 μA DE/RE VCC = 4.75V −12 μA VCC = 5.25V −14 −40 μA VIN = 0.8V VCC = 3.0V −3 −20 μA DE4 orRE4 VCC = 5.25V −7 −20 μA ICCD SupplyCurrent(10) No Load,DE/RE and DE4 = 2.0V 75 90 mA ICCR SupplyCurrent(10) No Load,DE/RE and RE4 = 0.8V 50 70 mA (5) IIH and IILincludedriverinputcurrentand receiverTRI-STATE leakagecurrenton DR(1–3). (6) Shortone outputata time. (7) Thresholdparameterlimitsspecifiedas an algebraicvalueratherthanby magnitude. (8) Hysteresisdefinedas VHST = V TH − VTL. (9) IIN includesthereceiverinputcurrentand driverTRI-STATE leakagecurrent. (10) Totalpackage supplycurrent. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS36954
SNLS077C –JULY 1998–REVISED APRIL 2013 www.ti.com SwitchingCharacteristics Over SupplyVoltageand OperatingTemperatureranges,unlessotherwisespecified. Symbol Parameter Conditions Min Typ Max Units DRIVER SINGLE-ENDED CHARACTERISTICS tPZH OutputEnableTime toHighLevel R L = 110Ω (Figure6 ) 35 40 ns tPZL OutputEnableTime toLow Level (Figure8 ) 25 40 ns tPHZ OutputDisableTime toHighLevel (Figure6 ) 15 25 ns tPLZ OutputDisableTime toLow Level (Figure8 ) 35 40 ns DRIVER DIFFERENTIAL CHARACTERISTICS tr,tf Riseand FallTime R L = 54Ω 13 16 ns C L = 50 pFtPLHD DifferentialPropagation 9 15 19 nsC D = 15 pF tPHLD Delays(2) 9 12 19 ns(Figure3 Figure4 (1)) tSKD |tPLHD − tPHLD |Diff.Skew 3 6 ns RECEIVER CHARACTERISTICS tPLHD DifferentialPropagationDelays C L = 15 pF 9 14 19 ns VCM = 2.0VtPHLD 9 13 19 ns(Figure10 ) tSKD |tPLHD − tPHLD |Diff.ReceiverSkew 1 3 ns tPZH OutputEnableTime toHighLevel C L = 15 pF 15 22 ns (Figure15 )tPZL OutputEnableTime toLow Level 20 30 ns tPHZ OutputDisableTime fromHighLevel 20 30 ns tPLZ OutputDisableTime fromLow Level 17 25 ns (1) PropagationDelayTimingforCalculationsofDriverDifferentialPropagationDelays (2) Differentialpropagationdelaysarecalculatedfromsingle-endedpropagationdelaysmeasured fromdriverinputtothe20% and 80% levelson thedriveroutputs(Figure16).
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(1) (1) (2) DS36954 www.ti.com SNLS077C –JULY 1998–REVISED APRIL 2013 PARAMETER MEASUREMENT INFORMATION Figure1. DriverVOD and VOC (3) Figure2. ReceiverVOH and VOL (1) The inputpulseissuppliedby a generatorhavingthefollowingcharacteristics:f= 1.0MHz, 50% dutycycle,trandtf< 6.0ns,ZO = 50Ω (2) C L includesprobeand straycapacitance. Figure3. DriverDifferentialPropagationDelay Load Circuit (1) Differentialpropagationdelaysarecalculatedfromsingle-endedpropagationdelaysmeasured fromdriverinputtothe 20% and 80% levelson thedriveroutputs(Figure16). Figure4. DriverDifferentialPropagationDelays and TransitionTimes (3) C L includesprobeand straycapacitance. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS36954
(1) (2) (1) (2) DS36954 SNLS077C –JULY 1998–REVISED APRIL 2013 www.ti.com S1 toOA forDI = 3V S1 toOB forDI = 0V (1) The inputpulseissuppliedby a generatorhavingthefollowingcharacteristics:f= 1.0MHz, 50% dutycycle,trandtf< 6.0ns,ZO = 50Ω. (2) C L includesprobeand straycapacitance. Figure5. Figure6. DriverEnable and DisableTiming (tPZH ,tPHZ ) S1 toOA forDI = 0V S1 toOB forDI = 3V (1) The inputpulseissuppliedby a generatorhavingthefollowingcharacteristics:f= 1.0MHz, 50% dutycycle,trandtf< 6.0ns,ZO = 50Ω. (2) C L includesprobeand straycapacitance. Figure7.
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(1) (2) (3)(4) (1) (2) DS36954 www.ti.com SNLS077C –JULY 1998–REVISED APRIL 2013 Figure8. DriverEnable and DisableTiming (tPZL ,tPLZ ) (1) The inputpulseissuppliedby a generatorhavingthefollowingcharacteristics:f= 1.0MHz, 50% dutycycle,trandtf< 6.0ns,ZO = 50Ω. (2) C L includesprobeand straycapacitance. Figure9. Figure10. ReceiverDifferentialPropagationDelay Timing (1) The inputpulseissuppliedby a generatorhavingthefollowingcharacteristics:f= 1.0MHz, 50% dutycycle,trandtf< 6.0ns,ZO = 50Ω. (2) C L includesprobeand straycapacitance. (3) Diodesare1N916 orequivalent. (4) On transceivers1–3 the driverisloaded withreceiverinputconditionswhen DE/RE ishigh.Do not exceed the package power dissipationlimitwhen testing. Figure11. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS36954
SNLS077C –JULY 1998–REVISED APRIL 2013 www.ti.com S1 1.5V S2 Open S3 Closed Figure12. S1 −1.5V S2 Closed C3 Open Figure13. S1 1.5V S2 Closed C3 Closed Figure14. S1 −1.5V S2 Closed C3 Closed Figure15. ReceiverEnable and DisableTiming
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www.ti.com SNLS077C –JULY 1998–REVISED APRIL 2013 Tra,Trb,Tfaand Tfbarepropagationdelaymeasurements tothe20% and 80% levels. TCP = CrossingPoint Figure16. PropagationDelay Timing forCalculationsofDriverDifferentialPropagationDelays Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:DS36954
SNLS077C –JULY 1998–REVISED APRIL 2013 www.ti.com
REVISION HISTORY
Changes from RevisionB (April2013)toRevisionC Page
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www.ti.com 1-Nov-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples DS36954M NRND SOIC DW 20 36 TBD Call TI Call TI 0 to 70 DS36954 M DS36954M/NOPB ACTIVE SOIC DW 20 36 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR 0 to 70 DS36954 M DS36954MX/NOPB ACTIVE SOIC DW 20 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR 0 to 70 DS36954 M DS36954VX NRND PLCC FN 20 TBD Call TI Call TI 0 to 70 DS36954V DS36954VX/NOPB ACTIVE PLCC FN 20 1000 Green (RoHS & no Sb/Br) CU SN Level-2A-250C-4 WEEK 0 to 70 DS36954V (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
www.ti.com 1-Nov-2015 Addendum-Page 2 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS36954MX/NOPB SOIC DW 20 1000 367.0 367.0 45.0 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE C TYP10.63 9.97
2.65 MAX
18X 1.27 20X 0.51 0.31 11.43 TYP0.33 0.10 0 - 8 0.3 0.1 0.25 GAGE PLANE 1.27 0.40 A NOTE 3 13.0 12.6 B 7.6 7.4 4220724/A 05/2016 SOIC - 2.65 mm max heightDW0020A SOIC NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side. 5. Reference JEDEC registration MS-013. 1 20
0.25 C A B
0.1 C SEE DETAIL A DETAIL A TYPICAL SCALE 1.200
www.ti.com EXAMPLE BOARD LAYOUT (9.3)
0.07 MAX
0.07 MIN
20X (2) 20X (0.6) 18X (1.27) (R ) TYP 0.05 4220724/A 05/2016 SOIC - 2.65 mm max heightDW0020A SOIC SYMM SYMM LAND PATTERN EXAMPLE SCALE:6X 10 11 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METALSOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED
www.ti.com EXAMPLE STENCIL DESIGN (9.3) 18X (1.27) 20X (0.6) 20X (2) 4220724/A 05/2016 SOIC - 2.65 mm max heightDW0020A SOIC NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SYMM SYMM 10 11 SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:6X
MPLC004A – OCTOBER 1994 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 FN (S-PQCC-J**) PLASTIC J-LEADED CHIP CARRIER 4040005/B 03/95
20 PIN SHOWN
0.026 (0,66) 0.032 (0,81) D2/E2 0.020 (0,51) MIN 0.180 (4,57) MAX 0.120 (3,05) 0.090 (2,29) D2/E2 0.013 (0,33) 0.021 (0,53) Seating Plane MAX D2/E2 0.219 (5,56) 0.169 (4,29) 0.319 (8,10) 0.469 (11,91) 0.569 (14,45) 0.369 (9,37) MAX 0.356 (9,04) 0.456 (11,58) 0.656 (16,66) 0.008 (0,20) NOM 1.158 (29,41) 0.958 (24,33) 0.756 (19,20) 0.191 (4,85) 0.141 (3,58) MIN 0.441 (11,20) 0.541 (13,74) 0.291 (7,39) 0.341 (8,66) D E1E MINMAXMIN PINS 0.385 (9,78) 0.485 (12,32) 0.685 (17,40) 84 1.185 (30,10) 0.985 (25,02) 0.785 (19,94) D/E 0.395 (10,03) 0.495 (12,57) 1.195 (30,35) 0.995 (25,27) 0.695 (17,65) 0.795 (20,19) NO. OF D1/E1 0.350 (8,89) 0.450 (11,43) 1.150 (29,21) 0.950 (24,13) 0.650 (16,51) 0.750 (19,05) 0.004 (0,10) M0.007 (0,18) 0.050 (1,27) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-018
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