DS3695N-NOPB TI1 | Alldatasheet

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DS3695,DS3695T,DS3696,DS3697 www.ti.com SNLS072C –MAY 1998–REVISED APRIL 2013 MultipointRS485/RS422Transceivers/Repeaters Check forSamples: DS3695 ,DS3695T ,DS3696 ,DS3697 1FEATURES DESCRIPTION The DS3695, DS3696, and DS3697 are highspeed 2• Meets EIA standardRS485 forMultipointBus differential TRI-STATE bus/lineTransmissionand isCompatible withRS-422 transceivers/repeatersdesigned to meet the• 15 ns DriverPropagationDelays with2 ns requirementsof EIA standardRS485 withextended Skew (Typical) common mode range (+12V to −7V), formultipoint datatransmission.• Single+5V supply

  • −7V to+12V Bus Common Mode Range The driverand receiveroutputsfeatureTRI-STATE Permits±7V Ground DifferenceBetween capability.The driveroutputsremain in TRI-STATE Devices on theBus overtheentirecommon mode rangeof+12V to−7V. Bus faultsthatcause excessivepower dissipation• Thermal Shutdown Protection withinthe devicetriggera thermalshutdown circuit,• High Impedance toBus withDriverinTRI- which forces the driveroutputs into the highSTATE or withPower Off,Over theEntire impedance state.The DS3696 providesan outputpin Common Mode Range Allows theUnused TS (thermalshutdown)which reportstheoccurrence Devices on theBus tobe Powered Down of the thermalshutdown of the device.This is an “open collector” pin withan internal10 kΩ pull-up• Combined Impedance ofa DriverOutput and resistor.Thisallowsthe linefaultoutputsof severalReceiverInputisLess than one RS485 Unit devicestobe wireOR-ed.Load, Allowingup to32 Transceiverson the Bus Both AC and DC specificationsarespecifiedoverthe 0°C to70°C temperatureand 4.75V to5.25V supply• 70 mV TypicalReceiverHysteresis voltagerange. Connection and Logic Diagrams Figure1.PDIP (Top View) Figure2.PDIP (Top View) See Package Number P (R-PDIP-T8) See Package Number P (R-PDIP-T8) Figure3.PDIP (Top View) See Package Number P (R-PDIP-T8) TS pinwas LF (LineFault)inpreviousdatasheetsand reportstheoccurrenceofa thermalshutdownofthedevice. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1998–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

DS3695,DS3695T,DS3696,DS3697 SNLS072C –MAY 1998–REVISED APRIL 2013 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings (1)(2) VALUE UNIT SupplyVoltage,VCC 7 V ControlInputVoltages 7 V DriverInputVoltage 7 V DriverOutputVoltages +15/−10 V ReceiverInputVoltages(DS3695,DS3696) +15/−10 V ReceiverCommon Mode Voltage(DS3697) ±25 V ReceiverOutputVoltage 5.5 V ContinuousPower Dissipation@ 25°C -N Package(3) 1.07 W StorageTemperatureRange −65 to+150 °C Lead Temperature(Soldering,4 sec.) 260 °C (1) “AbsoluteMaximum Ratings”arethosebeyond whichthesafetyofthedevicecannotbe verified.They arenotmeant toimplythatthe deviceshouldbe operatedattheselimits.The tablesof“ElectricalCharacteristics”provideconditionsforactualdeviceoperation. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityand specifications. (3) AlltypicalsaregivenforVCC = 5V and TA = 25°C. Recommended OperatingConditions Min Max Units SupplyVoltage,VCC 4.75 5.25 V Bus Voltage −7 +12 V OperatingFreeAirTemp. (TA) Commercial 0 +70 °C Industrial −40 +85 °C ElectricalCharacteristics(1)(2) 0°C ≤ TA ≤ +70°C, 4.75V< VCC < 5.25Vunlessotherwisespecified Symbol Parameter Conditions Min Typ Max Units VOD1 DifferentialDriverOutputVoltage(Unloaded) IO = 0 5 V VOD2 DifferentialDriverOutputVoltage(withLoad) See Figure4 R = 50Ω;(RS-422)(3) 2 V ΔVOD Change inMagnitudeofDriver See Figure4 R = 27Ω 0.2 V DifferentialOutputVoltagefor ComplementaryOutputStates VOC DriverCommon Mode OutputVoltage 3.0 V Δ|VOC | Change inMagnitudeofDriver 0.2 V Common Mode OutputVoltagefor ComplementaryOutputStates VIH InputHighVoltage DI,DE, RE ,E,RE /DE 2 V VIL InputLow Voltage 0.8 V VCL InputClamp Voltage IIN = −18 mA −1.5 V IIL InputLow Current VIL= 0.4V −200 μA IIH InputHighCurrent VIH = 2.4V 20 μA IIN InputCurrent DO/RI,DO /RI RI,RI VCC = 0V or5.25V VIN = 12V +1.0 mA RE /DE orDE = 0V VIN = −7V −0.8 mA (1) Allcurrentsintodevicepinsarepositive;allcurrentsoutofdevicepinsarenegative.Allvoltagesarereferencedtodevicegroundunless otherwisespecified. (2) AlltypicalsaregivenforVCC = 5V and TA = 25°C. (3) Alllimitsforwhichderatelinearlyat11.1mW/ °C to570 mW at70°C isappliedmust be deratedby 10% forDS3695T and DS3696T. Otherparametersremainthesame forthisextendedtemperaturerangedevice(−40°C ≤ TA ≤ +85°C).

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DS3695,DS3695T,DS3696,DS3697 www.ti.com SNLS072C –MAY 1998–REVISED APRIL 2013 ElectricalCharacteristics(1)(2)(continued) 0°C ≤ TA ≤ +70°C, 4.75V< VCC < 5.25Vunlessotherwisespecified Symbol Parameter Conditions Min Typ Max Units IOZD TRI-STATE Current DO, DO VCC = 0V or5.25V,E = 0V ±100 μADS3697 & DS3698 −7V < VO < +12V VTH DifferentialInputThreshold −7V ≤ VCM ≤ +12V −0.2 +0.2 VVoltageforReceiver ΔVTH ReceiverInputHysteresis VCM = 0V 70 mV VOH ReceiverOutputHighVoltage IOH = −400 μA 2.4 V VOL OutputLow Voltage RO IOL = 16 mA (3) 0.5 V TS IOL = 8 mA 0.45 V IOZR OFF-State(HighImpedance) VCC = Max ±20 μAOutputCurrentatReceiver 0.4V≤ VO ≤ 2.4V R IN ReceiverInputResistance −7V ≤ VCM ≤ +12V 12 kΩ ICC SupplyCurrent No Load (3) DriverOutputsEnabled 42 60 mA DriverOutputsDisabled 27 40 mA IOSD DriverShort-CircuitOutputCurrent VO = −7V (3) −250 mA VO = +12V (3) +250 mA IOSR ReceiverShort-CircuitOutputCurrent VO = 0V −15 −85 mA ReceiverSwitchingCharacteristics(1)(2) 0°C ≤ TA ≤ +70°C, 4.75V< VCC < 5.25Vunlessotherwisespecified(Figure5,Figure6,Figure7) Symbol Conditions Min Typ Max Units tPLH C L = 15 pF 15 25 37 ns tPHL S1 and S2 15 25 37 ns |tPLH –tPHL | Closed 0 ns tPLZ C L = 15 pF,S2 Open 5 12 16 ns tPHZ C L = 15 pF,S1 Open 5 12 16 ns tPZL C L = 15 pF,S2 Open 7 15 20 ns tPZH C L = 15 pF,S1 Open 7 15 20 ns (1) AlltypicalsaregivenforVCC = 5V and TA = 25°C. (2) SwitchingCharacteristicsapplyforDS3695, DS3695T, DS3696, DS3697 only. DriverSwitchingCharacteristics 0°C ≤ TA ≤ +70°C, 4.75V< VCC < 5.25Vunlessotherwisespecified Symbol Conditions Min Typ Max Units SINGLE ENDED CHARACTERISTICS (Figure8,Figure9,Figure10) tPLH R LDIFF = 60Ω 9 15 22 ns tPHL C L1 = C L2 = 100 pF 9 15 22 ns tSKEW |tPLH –tPHL | 2 8 ns tPLZ C L = 15 pF,S2 Open 7 15 30 ns tPHZ C L = 15 pF,S1 Open 7 15 30 ns tPZL C L = 100 pF,S2 Open 30 35 50 ns tPZH C L = 100 pF,S1 Open 30 35 50 ns DIFFERENTIAL CHARACTERISTICS (Figure8 Figure11) tr,tf R LDIFF = 60Ω 6 10 18 nsC L1 = C L2 = 100 pF Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS3695 DS3695T DS3696 DS3697

DS3695,DS3695T,DS3696,DS3697 SNLS072C –MAY 1998–REVISED APRIL 2013 www.ti.com AC TestCircuitsand SwitchingWaveforms Figure4. DriverVOD and VOC Figure5. ReceiverPropagationDelay TestCircuit Note:Differentialinputvoltagemay be realizedby groundingRI and pulsingRI between +2.5V and −2.5V. Figure6. ReceiverInput-to-OutputPropagationDelay Timing Figure7. ReceiverEnable/DisablePropagationDelay Timing Note:Unlessotherwisespecifiedtheswitchesareclosed.

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DS3695,DS3695T,DS3696,DS3697 www.ti.com SNLS072C –MAY 1998–REVISED APRIL 2013 Figure8. DriverPropagationDelay and TransitionTime TestCircuits Note:tPLH and tPHL aremeasured totherespective50% points.tSKEW isthedifferencebetween propagationdelaysof thecomplementaryoutputs. Figure9. DriverInput-to-OutputPropagationDelay Timing (Single-Ended) Figure10. DriverEnable/DisablePropagationDelay Timing Figure11. DriverDifferentialTransitionTiming Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS3695 DS3695T DS3696 DS3697

DS3695,DS3695T,DS3696,DS3697 SNLS072C –MAY 1998–REVISED APRIL 2013 www.ti.com FunctionTables Table1.DS3695/DS3696 Transmitting(1) Inputs Outputs Thermal TS *ShutdownRE DE DI DO DO (DS3696 Only) X 1 1 OFF 0 1 H X 1 0 OFF 1 0 H X 0 X OFF Z Z H X 1 X ON Z Z L (1) X— Don 'tcarecondition Z— Highimpedance state *TS isan “open collector”outputwithan on-chip10 kΩ pull-upresistorthatreportstheoccurrenceofa thermalshutdownofthedevice. Table2.DS3695/DS3696 Receiving(1) Inputs Outputs TS *RE DE RI–RI RO (DS3696 Only) 0 0 ≥ +0.2V 1 H 0 0 ≤ −0.2V 0 H 1 0 X Z H (1) X— Don 'tcarecondition Z— Highimpedance state *TS isan “open collector”outputwithan on-chip10 kΩ pull-upresistorthatreportstheoccurrenceofa thermalshutdownofthedevice. Table3.DS3697 (1) Inputs Outputs Thermal ROShutdownE RI-RI DO DO (DS3697 Only) 1 ≥ +0.2V OFF 0 1 1 1 ≤ −0.2V OFF 1 0 0

0 X OFF Z Z Z

1 ≥ +0.2V ON Z Z 1 1 ≤ −0.2V ON Z Z 0 (1) X— Don 'tcarecondition Z— Highimpedance state *TS isan “open collector”outputwithan on-chip10 kΩ pull-upresistorthatreportstheoccurrenceofa thermalshutdownofthedevice. TypicalApplication Note:Repeatercontrollogicnotshown

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DS3695,DS3695T,DS3696,DS3697 www.ti.com SNLS072C –MAY 1998–REVISED APRIL 2013 TypicalPerformance Characteristics DriverVOH DriverVOH vs vs IOH IOH vs VCC DriverVOH vs vs IOH Temperature vs VCC Figure12. Figure13. DriverVOL vs IOL DriverVOH vs vs IOH Temperature vs VCC Figure14. Figure15. DriverDifferential DriverDifferential PropagationDelay PropagationDelay vs vs Temperature VCC Figure16. Figure17. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS3695 DS3695T DS3696 DS3697

DS3695,DS3695T,DS3696,DS3697 SNLS072C –MAY 1998–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristics(continued) DriverSingle-Ended DriverSingle-Ended PropagationDelay PropagationDelay vs vs Temperature VCC Figure18. Figure19. DriverTransitionTime DriverTransitionTime vs vs Temperature VCC Figure20. Figure21. Cable Length Supply Current vs vs Data Rate Temperature Figure22. Figure23.

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DS3695,DS3695T,DS3696,DS3697 www.ti.com SNLS072C –MAY 1998–REVISED APRIL 2013 TypicalPerformance Characteristics(continued) Supply Current DriverICC vs vs Power Supply Voltage SwitchingFrequency Figure24. Figure25. ReceiverVOH vs DriverShortCircuitCurrent IOH vs vs Temperature Temperature Figure26. Figure27. ReceiverVOH vs IOH DriverShortCircuitCurrent vs vs VCC Temperature Figure28. Figure29. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:DS3695 DS3695T DS3696 DS3697

DS3695,DS3695T,DS3696,DS3697 SNLS072C –MAY 1998–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristics(continued) ReceiverVOH ReceiverVOH vs vs IOH IOH vs vs Temperature VCC Figure30. Figure31. ReceiverVOL ReceiverVOL vs vs IOL IOL vs vs Temperature VCC Figure32. Figure33. ReceiverDifferential ReceiverDifferential PropagationDelay PropagationDelay vs vs Temperature VCC Figure34. Figure35.

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DS3695,DS3695T,DS3696,DS3697 www.ti.com SNLS072C –MAY 1998–REVISED APRIL 2013 TypicalPerformance Characteristics(continued) ReceiverShort ReceiverShort CircuitCurrent CircuitCurrent vs vs Temperature Power Supply Figure36. Figure37. ReceiverNon-Inverting ReceiverNon-Inverting InputCurrent InputCurrent vs vs Temperature Power Supply Voltage Figure38. Figure39. ReceiverInverting ReceiverInverting InputCurrent InputCurrent vs vs Temperature Power Supply Voltage Figure40. Figure41. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:DS3695 DS3695T DS3696 DS3697

DS3695,DS3695T,DS3696,DS3697 SNLS072C –MAY 1998–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristics(continued) Hysteresisand Hysteresisand Differential DifferentialTransition TransitionVoltage Voltage vs vs Temperature VCC Figure42. Figure43.

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DS3695,DS3695T,DS3696,DS3697 www.ti.com SNLS072C –MAY 1998–REVISED APRIL 2013

REVISION HISTORY

Changes from RevisionB (April2013)toRevisionC Page Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:DS3695 DS3695T DS3696 DS3697

www.ti.com 1-Nov-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples DS3695N NRND PDIP P 8 40 TBD Call TI Call TI 0 to 70 DS3695N DS3695N/NOPB ACTIVE PDIP P 8 40 Green (RoHS & no Sb/Br) SN | CU SN Level-1-NA-UNLIM 0 to 70 DS3695N DS3695TN NRND PDIP P 8 40 TBD Call TI Call TI -40 to 85 DS 3695TN DS3695TN/NOPB ACTIVE PDIP P 8 40 Green (RoHS & no Sb/Br) SN | CU SN Level-1-NA-UNLIM -40 to 85 DS 3695TN (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.

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