DS3691M | DigiCamel IC Datasheet

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DS1691A,DS3691 www.ti.com SNLS357E –JULY 1998–REVISED APRIL 2013 DS3691(RS-422/RS-423)LineDriverswithTRI-STATEOutputs Check forSamples: DS1691A ,DS3691 1FEATURES DESCRIPTION The DS3691 isa low power SchottkyTTL linedriver 2• Dual RS-422 LineDriverwithMode Pin Low, or designedtomeet therequirementsofEIA standardsQuad RS-423 LineDriverwithMode Pin High RS-422 and RS-423. Itfeatures4 bufferedoutputs• TRI-STATE Outputs inRS-422 Mode with high source and sink currentcapabilitywith

ShortCircuitProtectionforBoth Source and internalshortcircuitprotection.A mode controlinput providesa choiceof operationeitheras 4 single-Sink Outputs ended linedriversor 2 differentiallinedrivers.A rise• Outputs WillNot Clamp LinewithPower Offor time controlpin allows the use of an externalInTRI-STATE capacitortoslowtherisetimeforsuppressionofnear
100Ω TransmissionLineDriveCapability end crosstalkto otherreceiversin the cable.Rise time capacitors are primarily intended for• Low ICC and IEE Power Consumption waveshapingoutputsignalsinthesingle-endeddriver– RS-422:ICC = 9 mA/driverTyp mode. Multipointapplicationsindifferentialmode with– RS-423:ICC = 4.5mA/driverTyp waveshapingcapacitorsisnotallowed. – IEE = 2.5mA/driverTyp With themode selectpinlow,theDS3691 are dual-
Low CurrentPNP InputsCompatible withTTL, differentiallinedriverswithTRI-STATE outputs.They MOS and CMOS feature±10V outputcommon-mode range in TRI- STATE mode and 0V output unbalance when• Pin Compatible withAM26LS30 operatedwith±5V supply. Connection Diagrams With Mode SelectLOW With Mode SelectHIGH (RS-422Connection) (RS-423Connection) Figure1.SOIC Package Figure2.SOIC Package See Package Number D0016A See Package Number D0016A Top View Top View These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1998–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

DS1691A,DS3691 SNLS357E –JULY 1998–REVISED APRIL 2013 www.ti.com AbsoluteMaximum Ratings(1)(2) SupplyVoltage VCC 7V VEE −7V Maximum Power Dissipationat25°C SOIC Package(3) 1051 mW InputVoltage 15V OutputVoltage(PowerOFF) ±15V StorageTemperature −65°C to+ 150°C Lead Temperature(Soldering,4 seconds) 260°C (1) “AbsoluteMaximum Ratings”arethosevaluesbeyond whichthesafetyofthedevicecannotbe verified.They arenotmeant toimply thatthedevicesshouldbe operatedattheselimits.The tablesof“ElectricalCharacteristics”provideconditionsforactualdevice operation. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) DerateSOIC package 8.41mW/ °C above 25°C. OperatingConditions Min Max Units SupplyVoltage VCC 4.75 5.25 V VEE −4.75 −5.25 V Temperature,TA 0 +70 °C

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DS1691A,DS3691 www.ti.com SNLS357E –JULY 1998–REVISED APRIL 2013 DC ElectricalCharacteristics(1)(2)(3)(4) Parameter TestConditions Min Typ Max Units RS-422 CONNECTION, VEE CONNECTION TO GROUND, MODE SELECT ≤ 0.8V VIH HighLevelInputVoltage 2 V VIL Low LevelInputVoltage 0.8 V IIH HighLevelInputCurrent VIN = 2.4V 1 40 μA VIN ≤ 15V 10 100 μA IIL Low LevelInputCurrent VIN = 0.4V −30 −200 μA VI InputClamp Voltage IIN = −12 mA −1.5 V VO DifferentialOutputVoltage VIN = 2V 3.6 6.0 V R L = ∞VO VA,B VIN = 0.8V −3.6 −6.0 V VT DifferentialOutputVoltage R L = 100Ω VIN = 2V 2 2.4 V VT VA,B VCC ≥ 4.75V VIN = 0.8V −2 −2.4 V VOS ,VOS Common-Mode OffsetVoltage R L = 100Ω 2.5 3 V |VT|− |VT | DifferenceinDifferentialOutputVoltage R L = 100Ω 0.05 0.4 V |VOS |− |VOS | DifferenceinCommon-Mode OffsetVoltage R L = 100Ω 0.05 0.4 V VSS |VT − VT | R L = 100Ω,VCC ≥ 4.75V 4.0 4.8 V VCMR OutputVoltageCommon-Mode Range VDISABLE = 2.4V ±10 V IXA OutputLeakage Current VCC = 0V VCMR = 10V 100 μA IXB Power OFF VCMR = −10V −100 μA IOX TRI-STATE OutputCurrent VCC = Max VCMR ≤ 10V 100 μA VEE = 0V and −5V VCMR ≥ −10V −100 μA ISA OutputShortCircuitCurrent VIN = 0.4V VOA = 6V 80 150 mA VOB = 0V −80 −150 mA ISB OutputShortCircuitCurrent VIN = 2.4V VOA = 0V −80 −150 mA VOB = 6V 80 150 mA ICC SupplyCurrent 18 30 mA (1) Unlessotherwisespecified,min/max limitsapplyacrossthe−55°C to+125°C temperaturerangefortheDS1691A and acrossthe0°C to +70°C rangefortheDS3691. AlltypicalsaregivenforV CC = 5V and TA = 25°C. VCC and VEE as listedinoperatingconditions. (2) Allcurrentsintodevicepinsarepositive;allcurrentsoutofdevicepinsarenegative.Allvoltagesarereferencedtogroundunless otherwisespecified. (3) Onlyone outputata timeshouldbe shorted. (4) Symbols and definitionscorrespondtoEIA RS-422 and/orRS-423 where applicable. AC ElectricalCharacteristics(1) TA = 25°C Parameter TestConditions Min Typ Max Units RS-422 CONNECTION, VCC = 5V,MODE SELECT = 0.8V tr OutputRiseTime R L = 100Ω,C L = 500 pF Figure3 120 200 ns tf OutputFallTime R L = 100Ω,C L = 500 pF Figure3 120 200 ns tPDH OutputPropagationDelay R L = 100Ω,C L = 500 pF Figure3 120 200 ns tPDL OutputPropagationDelay R L = 100Ω,C L = 500 pF Figure3 120 200 ns tPZL TRI-STATE Delay R L = 450Ω,C L = 500 pF,C C = 0 pF Figure6 250 350 ns tPZH TRI-STATE Delay R L = 450Ω,C L = 500 pF,C C = 0 pF Figure6 180 300 ns tPLZ TRI-STATE Delay R L = 450Ω,C L = 500 pF,C C = 0 pF Figure6 180 300 ns tPHZ TRI-STATE Delay R L = 450Ω,C L = 500 pF,C C = 0 pF Figure6 250 350 ns (1) Symbols and definitionscorrespondtoEIA RS-422 and/orRS-423 where applicable. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS1691A DS3691

DS1691A,DS3691 SNLS357E –JULY 1998–REVISED APRIL 2013 www.ti.com DC ElectricalCharacteristics(1)(2)(3)(4) Parameter TestConditions Min Typ Max Units RS-423 CONNECTION, |VCC |= |VEE |,MODE SELECT ≥ 2V VIH HighLevelInputVoltage 2 V VIL Low LevelInputVoltage 0.8 V IIH HighLevelInputCurrent VIN = 2.4V 1 40 μA VIN ≤ 15V 10 100 μA IIL Low LevelInputCurrent VIN = 0.4V −30 −200 μA VI InputClamp Voltage IIN = −12 mA −1.5 V VO OutputVoltage R L = ∞,See (5) VIN = 2V 4.0 4.4 6.0 V VT OutputVoltage R L = 450Ω VIN = 2.4V 3.6 4.1 V VT VCC ≥ 4.75V VIN = 0.4V −3.6 −4.1 V |VT|− |VT | OutputUnbalance |VCC |= |VEE |= 4.75V,R L = 450Ω 0.02 0.4 V IX+ OutputLeakage Power OFF VCC = V EE = 0V VO = 6V 2 100 μA IX− OutputLeakage Power OFF VCC = V EE = 0V VO = −6V −2 −100 μA IS + OutputShortCircuitCurrent VO = 0V VIN = 2.4V −80 −150 mA IS − OutputShortCircuitCurrent VO = 0V VIN = 0.4V 80 150 mA ISLEW Slew ControlCurrent ±140 μA ICC PositiveSupplyCurrent V IN = 0.4V,R L = ∞ 18 30 mA IEE NegativeSupplyCurrent V IN = 0.4V,R L = ∞ −10 −22 mA (1) Unlessotherwisespecified,min/max limitsapplyacrossthe−55°C to+125°C temperaturerangefortheDS1691A and acrossthe0°C to +70°C rangefortheDS3691. AlltypicalsaregivenforV CC = 5V and TA = 25°C. VCC and VEE as listedinoperatingconditions. (2) Allcurrentsintodevicepinsarepositive;allcurrentsoutofdevicepinsarenegative.Allvoltagesarereferencedtogroundunless otherwisespecified. (3) Onlyone outputata timeshouldbe shorted. (4) Symbols and definitionscorrespondtoEIA RS-422 and/orRS-423 where applicable. (5) At−55°C, theoutputvoltageis+3.9V minimum and −3.9Vminimum. AC ElectricalCharacteristics(1) TA = 25°C Parameter TestConditions Min Typ Max Units RS-423 CONNECTION, VCC = 5V,VEE −5V,MODE SELECT = 2.4V tr RiseTime R L = 450Ω,C L = 500 pF,C C = 0 Figure4 120 300 ns tf FallTime R L = 450Ω,C L = 500 pF,C C = 0 Figure4 120 300 ns tr RiseTime R L = 450Ω,C L = 500 pF C C = 50 pF Figure5 3.0 μs tf FallTime R L = 450Ω,C L = 500 pF C C = 50 pF Figure5 3.0 μs trc RiseTime Coefficient R L = 450Ω,C L = 500 pF,C C = 50 pF Figure5 0.06 μs/pF tPDH OutputPropagationDelay R L = 450Ω,C L = 500 pF,C C = 0 Figure4 180 300 ns tPDL OutputPropagationDelay R L = 450Ω,C L = 500 pF,C C = 0 Figure4 180 300 ns (1) Symbols and definitionscorrespondtoEIA RS-422 and/orRS-423 where applicable.

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DS1691A,DS3691 www.ti.com SNLS357E –JULY 1998–REVISED APRIL 2013 AC TestCircuitsand SwitchingTime Waveforms Figure3. DifferentialConnection Figure4. RS-423 Connection Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS1691A DS3691

DS1691A,DS3691 SNLS357E –JULY 1998–REVISED APRIL 2013 www.ti.com Figure5. Rise Time ControlforRS-423 Figure6. TRI-STATE Delays SWITCHING WAVEFORMS Figure7. TypicalOutput Voltage

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DS1691A,DS3691 www.ti.com SNLS357E –JULY 1998–REVISED APRIL 2013 TruthTable Inputs Outputs Operation Mode A (D) B (C) A (D) B (C) RS-422 0 0 0 0 1 0 0 1 TRI-STATE TRI-STATE 0 1 0 1 0 0 1 1 TRI-STATE TRI-STATE RS-423 1 0 0 0 0 1 0 1 0 1 1 1 0 1 0 1 1 1 1 1 TYPICAL APPLICATION INFORMATION Figure8. FullyLoaded RS-422 Interface Figure9. RS-422 PointtoPointApplication Figure10. FullyLoaded RS-423 Interface Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS1691A DS3691

DS1691A,DS3691 SNLS357E –JULY 1998–REVISED APRIL 2013 www.ti.com *Note:Controllededge allowslongerstublengths.MultipleDriversareNOT allowed. Figure11. DifferentialApplicationwithRise Time Control Figure12. Dual RS-423 InvertingDriver TypicalRise Time ControlCharacteristics (RS-423Mode) Rise Time vs ExternalCapacitor Figure13.

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DS1691A,DS3691 www.ti.com SNLS357E –JULY 1998–REVISED APRIL 2013

REVISION HISTORY

www.ti.com 9-Mar-2016 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples DS3691M LIFEBUY SOIC D 16 48 TBD Call TI Call TI 0 to 70 DS3691M AM26LS30SC DS3691M/NOPB ACTIVE SOIC D 16 48 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS3691M AM26LS30SC DS3691MX/NOPB ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS3691M AM26LS30SC (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

www.ti.com 9-Mar-2016 Addendum-Page 2 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS3691MX/NOPB SOIC D 16 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 2

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Product Information

DS3691M specifications and overview.

Summary

Line Drivers with TRI-STATE Outputs

Description

Line Drivers with TRI-STATE Outputs

Source title DS3691M Datasheet(PDF) - Texas Instruments

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