DS3680_16 TI1 | Alldatasheet
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QUAD TELEPHONE RELAY DRIVER SLRS014C – MARCH 1986 – REVISED SEPTEMBER 1995 Copyright 1995, Texas Instruments Incorporated 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
- Designed for –52-V Battery Operation
- 50-mA Output Current Capability
- Input Compatible With TTL and CMOS
- High Common-Mode Input Voltage Range
- Very Low Input Current
- Fail-Safe Disconnect Feature
- Built-in Output Clamp Diode
- Direct Replacement for National DS3680 and Fairchild mA3680
description
The DS3680 telephone relay driver is a monolithic integrated circuit designed to interface –48-V relay systems to TTL or other systems in telephone applications. It is capable of sourcing up to 50 mA from standard –52-V battery power. To reduce the effects of noise and IR drop between logic ground and battery ground, these drivers are designed to operate with a common-mode input range of ± 20 V referenced to battery ground. The common-mode input voltages for the four drivers can be different, so a wide range of input elements can be accommodated. The high-impedance inputs are compatible with positive TTL and CMOS levels or negative logic levels. A clamp network is included in the driver outputs to limit high-voltage transients generated by the relay coil during switching. The complementary inputs ensure that the driver output is off as a fail-safe condition when either output is open. The DS3680 is characterized for operation from 0°C to 70°C. IN + IN – 15 kW OUT BAT GND BAT NEG schematic diagram (each driver)
1 IN+
1 IN–
2 IN–
2 IN+
3 IN+
3 IN–
4 IN–
1 OUT
2 OUT
3 OUT
4 OUT
4 IN+
(TOP VIEW) symbol (each driver) BAT GND OUT BAT NEG IN + IN – All resistor values shown are nominal. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
QUAD TELEPHONE RELAY DRIVER SLRS014C – MARCH 1986 – REVISED SEPTEMBER 1995
2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted) NOTES: 1. All voltages are with respect to BAT GND, unless otherwise specified. 2. Differential input voltages are at the noninverting input terminal IN+ with respect to the inverting input terminal IN–. DISSIPATION RATING TABLE PACKAGE TA ≤ 25°C DERATING FACTOR TA = 70°CPACKAGE A POWER RATING ABOVE T A = 25°C A POWER RATING D 950 mW 7.6 mW/°C 608 mW N 1150 mW 9.2 mW/°C 736 mW recommended operating conditions MIN MAX UNIT Supply voltage, VBAT– –10 –60 V Input voltage, either input –20† 20 V High-level differential input voltage, VIDH 2 20 V Low-level differential input voltage, VIDL –20† 0.8 V Operating free-air temperature, TA 0 70 °C † The algebraic convention, in which the less positive (more negative) limit is designated minimum, is used in this data sheet for input voltage levels. electrical characteristics over recommended operating free-air temperature range, VBAT– = –52 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP ‡ MAX UNIT IIH High level input current (into IN+) VID = 2 V 40 100 mAIIH High-level input current (into IN+ ) VID = 7 V 375 1000 mA IIL Low level input current (into IN+) VID = 0.4 V 0.01 5 mAIIL Low-level input current (into IN+ ) VID = – 7 V –1 –100 mA VO(on) On-stage output voltage IO = 50 mA, VID = 2 V –1.6 –2.1 V IO( ff) Off stage output current VO =V BAT VID = 0.8 V –2 –100 mAIO(off) Off-stage output current VO = VBAT– Inputs open –2 –100 mA IR Clamp diode reverse current VO = 0 2 100 mA VOK Output clamp voltage IO = 50 mA 0.9 1.2 VVOK O utput clamp voltage IO = –50 mA, VBAT– = 0 –0.9 –1.2 V IBAT(on) On-state battery current All drivers on –2 –4.4 mA IBAT(off) Off-state battery current All drivers off –1 –100 mA ‡ All typical values are at TA = 25°C.
QUAD TELEPHONE RELAY DRIVER SLRS014C – MARCH 1986 – REVISED SEPTEMBER 1995
4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
3 IN –
3 IN +
4 IN –
4 IN +
2 IN –
2 IN +
1 IN –
9 DS3680
K1 – K4 50-V Relay Coils – 50 mA MAX BAT GND BAT NEG Figure 3. Relay Driver
www.ti.com 30-Jan-2016 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples DS3680D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 DS3680 DS3680DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 DS3680 DS3680N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 DS3680N (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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