DS1631 NSC | Alldatasheet
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Y High impedance inputs PNP’s Y High output voltage breakdown 56V min Y High output current capability 300 mA max Y Same pin-outs and logic functions as DS75451 and DS75461 series circuits Y Low V CC power dissipation (28 mW both outputs ‘‘ON’’ at 5V) Connection Diagrams (Dual-In-Line and Metal Can Packages) TL/F/5816–1 Top View Order Number DS1631J-8 or DS3631N TL/F/5816–2 Top View Order Number DS1632J-8 or DS3632N TL/F/5816–3 Top View Order Number DS1633J-8 or DS3633N TL/F/5816–4 Top View Order Number DS1634J-8 or DS3634N See NS Package Number J08A or N08E TL/F/5816–5 Top View (Pin 4 is electrically connected to the case.) Order Number DS1631H TL/F/5816–6 Top View (Pin 4 is electrically connected to the case.) Order Number DS1632H TL/F/5816–7 Top View (Pin 4 is electrically connected to the case.) Order Number DS1633H TL/F/5816–8 Top View (Pin 4 is electrically connected to the case.) Order Number DS1634H See NS Package Number H08C C1995 National Semiconductor Corporation RRD-B30M105/Printed in U. S. A.
Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Supply Voltage 16V Voltage at Inputs b0.3V to V CC a 0.3V Output Voltage 56V Storage Temperature Range b65§Ct o a150§C Maximum Power Dissipation * at 25 §C Cavity Package 1133 mW Molded Package 1022 mW Lead Temperature (Soldering, 4 sec. 260 *Derate cavity package 7.6 mW/ §C above 25 §C; derate molded package 8.2 mW/ §C above 25 §C; derate TO-5 package 5.2 mW/ §C above 25 §C. Operating Conditions Min Max Units Supply Voltage, V CC DS1631/DS1632/ 4.5 15 V DS1633/DS1634 DS3631/DS3632/ 4.75 15 V DS3633/DS3634 Temperature, T A DS1631/DS1632/ b55 a125 §C DS1633/DS1634 DS3631/DS3632/ 0 a70 §C DS3633/DS3634 Electrical Characteristics (Notes 2 and 3) Symbol Parameter Conditions Min Typ Max Units ALL CIRCUITS VIH Logical ‘‘1’’ Input Voltage ( Figure 1 )V CC e 5V 3.5 2.5 V VCC e 10V 8.0 5 V VCC e 15V 12.5 7.5 V VIL Logical ‘‘0’’ Input Voltage ( Figure 1 )V CC e 5V 2.5 1.5 V VCC e 10V 5.5 2.0 V VCC e 15V 7.5 2.5 V IIH Logical ‘‘1’’ Input Current V CC e 15V, V IN e 15V, (Figure 2 ) 0.1 10 mA IIL Logical ‘‘0’’ Input Current V IN e 0.4V, (Figure 3 )V CC e 5V b50 b120 mA VCC e 15V b200 b360 mA VOH Output Breakdown Voltage V CC e 15V, I OH e 250 mA, (Figure 1 )5 6 6 5 V VOL Output Low Voltage V CC e Min, (Figure 1 ), DS1631, DS1632, I OL e 100 mA 0.85 1.1 V DS1633, DS1634 IOL e 300 mA 1.1 1.4 V VCC e Min, (Figure 1 ), DS3631, DS3632, I OL e 100 mA 0.85 1.0 V DS3633, DS3634 IOL e 300 mA 1.1 1.3 V DS1631/DS3631 ICC(0) Supply Currents V IN e 0V, (Figure 4) VCC e 5V Output Low 7 11 mA VCC e 15V Both Drivers 14 20 mA ICC(1) (Figure 4 )V CC e 5V, V IN e 5V Output High 2 3 mA VCC e 15V, V IN e 15V Both Drivers 7.5 10 mA tPD1 Propagation to ‘‘1’’ V CC e 5V, T A e 25§C, C L e 15 pF, R L e 50X,V L e 10V, 500 ns(Figure 5 ) tPD0 Propagation to ‘‘0’’ V CC e 5V, T A e 25§C, C L e 15 pF, R L e 50X,V L e 10V, 750 ns(Figure 5 ) DS1632/DS3632 ICC(0) Supply Currents ( Figure 4 )V CC e 5V, V IN e 5V Output Low 81 2 m A VCC e 15V, V IN e 15V 18 23 mA ICC(1) VIN e 0V, (Figure 4 )V CC e 5V Output High 2.5 3.5 mA VCC e 15V 9 14 mA tPD1 Propagation to ‘‘1’’ V CC e 5V, T A e 25§C, C L e 15 pF, R L e 50X,V L e 10V, 500 ns(Figure 5 ) tPD0 Propagation to ‘‘0’’ V CC e 5V, T A e 25§C, C L e 15 pF, R L e 50X,V L e 10V, 750 ns(Figure 5 )
across the 0 §Ct o a70§C range for the DS3631, DS3632, DS3633 and DS3634. All typical values are for T A e 25§C. as max or min on absolute value basis. Note: Each input is tested separately. FIGURE 1. V IH ,V IL ,V OH ,V OL
FIGURE 5. Switching Times
Physical Dimensions inches (millimeters) Metal Can Package (H) Order Number DS1631H, DS1632H, DS1633H or DS1634H
Physical Dimensions inches (millimeters) (Continued) Ceramic Dual-In-Line Package (J) Order Number DS1631J-8, DS1632J-8, DS1633J-8 or DS1634J-8
DS1631/DS3631/DS1632/DS3632/DS1633/DS3633/DS1634/DS3634 CMOS Dual Peripheral Drivers Physical Dimensions inches (millimeters) (Continued) Molded Dual-In-Line Package (N) Order Number DS3631N, DS3632N, DS3633N and DS3634N LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant support device or system whose failure to perform can into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life failure to perform, when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can effectiveness. be reasonably expected to result in a significant injury to the user. National Semiconductor National Semiconductor National Semiconductor National Semiconductor Corporation Europe Hong Kong Ltd. Japan Ltd.
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