DS34C86TMX TI | Alldatasheet
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www.ti.com SNLS379C –MAY 1998–REVISED APRIL 2013 DS34C86TQuadCMOS DifferentialLineReceiver Check forSamples: DS34C86T 1FEATURES DESCRIPTION The DS34C86T is a quad differentiallinereceiver 2• CMOS Design forLow Power designedto meet the RS-422, RS-423, and Federal• ±0.2VSensitivityOver theInputCommon Standards 1020 and 1030 for balanced andMode VoltageRange unbalanceddigitaldata transmission,whileretaining
- TypicalPropagationDelays:19 ns thelowpower characteristicsofCMOS.
- TypicalInputHysteresis:60 mV The DS34C86T has an inputsensitivityof 200 mV over the common mode inputvoltagerange of ±7V.• InputsWon't Load Linewhen VCC = 0V Hysteresisisprovidedto improvenoisemargin and• Meets theRequirements ofEIA Standard RS- discourageoutputinstabilityforslowlychanginginput422 waveforms.
- TRI-STATE Outputs forSystem Bus The DS34C86T featuresinternalpull-upand pull-Compatibility down resistorswhich preventoutputoscillationon• AvailableinSurfaceMount unused channels.
- Open InputFailsafeFeature,Output High for Separate enable pins allowindependentcontrolofOpen Input receiverpairs.The TRI-STATE outputshave 6 mA source and sink capability.The DS34C86T is pin compatiblewiththeDS3486. Logic Diagram Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1998–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SNLS379C –MAY 1998–REVISED APRIL 2013 www.ti.com Connection Diagram Top View Figure1. PDIP Package See Package Numbers D0016A or NFG0016E TruthTable(1) Enable Input Output L X Z H VID ≥ VTH (Max) H H VID ≤ VTH (Min) L H Open* H (1) Open, notterminated.Z = TRI-STATE These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings(1)(2)(3)(4) SupplyVoltage(VCC ) 7V InputCommon Mode Range (V CM ) ±14V DifferentialInputVoltage(V DIFF) ±14V EnableInputVoltage(V IN) 7V StorageTemperatureRange (TSTG ) −65°C to+150°C Lead Temperature(Soldering4 sec) 260°C Maximum Power Dissipationat25°C (5) CurrentPer Output ±25 mA Thisdevicedoes notmeet 2000V ESD rating(1) (1) ESD Rating;HBM (1.5kΩ,100 pF) Inputs≥ 2000V Allotherpins≥ 1000V EIAJ (0Ω,200 pF)≥ 350V (2) Unlessotherwisespecified,allvoltagesarereferencedtoground. (3) AbsoluteMaximum Ratingsarevaluesbeyond whichthesafetyofthedevicecannotbe specified.They arenotmeant toimplythatthe deviceshouldbe operatedattheselimits.The “ElectricalCharacteristics”provideconditionsforactualdeviceoperation. (4) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityand specifications. (5) Ratingsapplytoambienttemperatureat25°C. Above thistemperaturederateNFG0016E Package 13.16mW/ °C, and D0016A Package 9.52mW/ °C.
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www.ti.com SNLS379C –MAY 1998–REVISED APRIL 2013 OperatingConditions Min Max Unit SupplyVoltage(VCC ) 4.50 5.50 V OperatingTemperatureRange (TA) −40 +85 °C EnableInputRiseorFallTimes 500 ns DC ElectricalCharacteristics(1) VCC = 5V ±10% (unlessotherwisespecified) Parameter TestConditions Min Typ Max Units VTH Minimum Differential VOUT = V OH orVOL −200 35 +200 mV InputVoltage −7V < VCM < +7V R IN InputResistance VIN = −7V,+7V 5.0 6.8 10 kΩ (OtherInput= GND) IIN InputCurrent VIN = +10V, OtherInput= GND +1.1 +1.5 mA (UnderTest) VIN = −10V,OtherInput= GND −2.0 −2.5 mA VOH Minimum HighLevel VCC = Min.,V(DIFF)= +1V 3.8 4.2 V OutputVoltage IOUT = −6.0mA VOL Maximum Low Level VCC = Max.,V(DIFF)= −1V 0.2 0.3 V OutputVoltage IOUT = 6.0mA VIH Minimum EnableHigh 2.0 V InputLevelVoltage VIL Maximum EnableLow 0.8 V InputLevelVoltage IOZ Maximum TRI-STATE VOUT = V CC orGND, ±0.5 ±5.0 μA OutputLeakage Current TRI-STATE Control= VIL II Maximum EnableInput VIN = V CC orGND ±1.0 μA Current ICC QuiescentPower VCC = Max.,V(DIFF)= +1V 16 23 mA SupplyCurrent VHYST InputHysteresis VCM = 0V 60 mV (1) Unlessotherwisespecified,Min/Max limitsapplyacrosstheoperatingtemperaturerange. AlltypicalsaregivenforVCC = 5V and TA = 25°C. AC ElectricalCharacteristics(1) VCC = 5V ±10% (unlessotherwisespecified)(Figure2,Figure3,Figure4) Parameter TestConditions Min Typ Max Units tPLH , PropagationDelay C L = 50 pF 19 30 ns tPHL InputtoOutput VDIFF = 2.5V VCM = 0V tRISE, OutputRiseand C L = 50 pF 4 9 ns tFALL FallTimes VDIFF = 2.5V VCM = 0V tPLZ , PropagationDelay C L = 50 pF 13 18 ns tPHZ ENABLE toOutput R L = 1000Ω VDIFF = 2.5V tPZL , PropagationDelay C L = 50 pF 13 21 ns tPZH ENABLE toOutput R L = 1000Ω VDIFF = 2.5V (1) Unlessotherwisespecified,Min/Max limitsapplyacrosstheoperatingtemperaturerange. AlltypicalsaregivenforVCC = 5V and TA = 25°C. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS34C86T
SNLS379C –MAY 1998–REVISED APRIL 2013 www.ti.com Comparison TableofSwitchingCharacteristicsinto“LS-Type” Load (1) VCC = 5V,TA = 25°C (Figure5,Figure6) DS34C86 DS3486 Parameter Units Typ Max Typ Max tPHL(D) PropagationDelayTime 17 19 ns OutputHightoLow tPLH(D) PropagationDelayTime 19 19 ns OutputLow toHigh tPLZ OutputLow toTRI-STATE 13 23 ns tPHZ OutputHightoTRI-STATE 12 25 ns tPZH OutputTRI-STATE toHigh 13 18 ns tPZL OutputTRI-STATE toLow 13 20 ns (1) Thistableisprovidedforcomparisonpurposesonly.The valuesinthistablefortheDS34C86 reflecttheperformanceofthedevicebut arenottestedorspecified. TEST AND SWITCHING WAVEFORMS Figure2. PropagationDelays C L Includesloadand testjigcapacitance. S1 = VCC fortPZL ,and tPLZ measurements. S1 = GND fortPZH ,and tPHZ measurements. Figure3. TestCircuitforTRI-STATE Output Tests
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www.ti.com SNLS379C –MAY 1998–REVISED APRIL 2013 Figure4. TRI-STATE Output Enable and DisableWaveforms AC TestCircuitsand SwitchingTime Waveforms InputPulseCharacteristics: tTLH = tTHL = 6 ns (10% to90%) PRR = 1 MHz, 50% dutycycle Figure5. PropagationDelay DifferentialInputtoOutput for“LS-Type” Load Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS34C86T
SNLS379C –MAY 1998–REVISED APRIL 2013 www.ti.com 1.5VfortPHZ and tPLZ −1.5VfortPLZ and tPZL InputPulseCharacteristics: tTLH = tTHL = 6 ns (10% to90%) PRR = 1 MHz, 50% dutycycle tPLZ tPHZ tPZH tPZL Figure6. PropagationDelay TRI-STATE ControlUnittoOutput for“LS-Type” Load
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www.ti.com SNLS379C –MAY 1998–REVISED APRIL 2013
REVISION HISTORY
Changes from RevisionB (April2013)toRevisionC Page Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS34C86T
www.ti.com 15-Apr-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Top-Side Markings (4) Samples DS34C86TM ACTIVE SOIC D 16 48 TBD Call TI Call TI -40 to 85 DS34C86TM DS34C86TM/NOPB ACTIVE SOIC D 16 48 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS34C86TM DS34C86TMX ACTIVE SOIC D 16 2500 TBD Call TI Call TI -40 to 85 DS34C86TM DS34C86TMX/NOPB ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS34C86TM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS34C86TMX SOIC D 16 2500 367.0 367.0 35.0 DS34C86TMX/NOPB SOIC D 16 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 Pack Materials-Page 2
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