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www.ti.com SNLS355C –MAY 1998–REVISED APRIL 2013 DS3487QuadTRI-STATELineDriver Check forSamples: DS3487 1FEATURES DESCRIPTION The DS3487 quad RS-422 driverfeaturesfour 2• Four IndependentDrivers independentdriverswhichcomplywithEIA Standards• TRI-STATE Outputs forthe electricalcharacteristicsof balancedvoltage
- FastPropagationTimes (typ10 ns) digitalinterfacecircuits.The outputsare TRI-STATE structureswhichareforcedtoa highimpedance state• TTL Compatible when the appropriateoutputcontrolpin reaches a• 5V Supply logiczero condition.Allinputpinsare PNP buffered
- Output Rise and FallTimes Less than 15 ns tominimizeinputloadingforeitherlogicone or logic zeroinputs.• Pin Compatible withDS8924 and MC3487 Block and Connection Diagrams Figure1.Block Diagram Figure2.PDIP Package- Top View See Package Number D0016A or NFG0016E TruthTable(1) Input Control Non-Inverting Inverting Input Output Output H H H L L H L H X L Z Z (1) L = Low logicstate H = Highlogicstate X = Irrelevant Z = TRI-STATE (highimpedance) Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1998–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SNLS355C –MAY 1998–REVISED APRIL 2013 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings(1)(2) SupplyVoltage 8V InputVoltage 5.5V StorageTemperature −65°C to+150°C Maximum Power Dissipation(3)at25°C Lead Temperature (Soldering,4 seconds) 260°C (1) “AbsoluteMaximum Ratings”arethosevaluesbeyond whichthesafetyofthedevicecannotbe verified.They arenotmeant toimply thatthedevicesshouldbe operatedattheselimits.The tableof“ElectricalCharacteristics”providesconditionsforactualdevice operation. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityand specifications. (3) DeratePDIP molded package 11.9mW/ °C above 25°C. DerateSOIC package 8.41mW/ °C above 25°C. OperatingConditions Min Max Units SupplyVoltage,VCC DS3487 4.75 5.25 V Temperature(TA) DS3487 0 +70 °C ElectricalCharacteristics(1)(2)(3)(4) Parameter TestConditions Min Typ Max Units VIL InputLow Voltage 0.8 V VIH InputHighVoltage 2.0 V IIL InputLow Current V IL= 0.5V −200 μA IIH InputHighCurrent VIH = 2.7V 50 μA VIH = 5.5V 100 μA VCL InputClamp Voltage ICL = −18 mA −1.5 V VOL OutputLow Voltage IOL = 48 mA 0.5 V VOH OutputHighVoltage IOH = −20 mA 2.5 V IOS OutputShort-CircuitCurrent −40 −140 mA IOZ OutputLeakage Current VO = 0.5V −100 μA (TRI-STATE) VO = 5.5V 100 μA IOFF OutputLeakage CurrentPower OFF VO = 6V 100 μA VCC = 0V VO = −0.25V −100 μA |VOS – VOS | DifferenceinOutputOffsetVoltage 0.4 V VT DifferentialOutputVoltage 2.0 V |VT|– VT| DifferenceinDifferentialOutputVoltage 0.4 V ICC Power SupplyCurrent Active 50 80 mA TRI-STATE 35 60 mA (1) Unlessotherwisespecifiedmin/max limitsapplyacrossthe0°C to+70°C rangefortheDS3487. AlltypicalsaregivenforVCC = 5V and TA = 25°C. (2) Allcurrentsintodevicepinsarepositive,allcurrentsoutofdevicepinsas negative.Allvoltagesarereferencedtogroundunless otherwisespecified. (3) Onlyone outputata timeshouldbe shorted. (4) Symbols and definitionscorrespondtoEIA RS-422,where applicable.
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www.ti.com SNLS355C –MAY 1998–REVISED APRIL 2013 SwitchingCharacteristics VCC = 5V,TA = 25°C Parameter TestConditions Min Typ Max Units tPHL InputtoOutput 10 15 ns tPLH InputtoOutput 10 15 ns tTHL DifferentialFallTime 10 15 ns tTLH DifferentialRiseTime 10 15 ns tPHZ EnabletoOutput R L = 200Ω,C L = 50 pF 17 25 ns tPLZ EnabletoOutput R L = 200Ω,C L = 50 pF 15 25 ns tPZH EnabletoOutput R L = ∞,C L = 50 pF,S1 Open 11 25 ns tPZL EnabletoOutput R L = 200Ω,C L = 50 pF,S2 Open 15 25 ns AC TEST CIRCUITS AND SWITCHING TIME WAVEFORMS Inputpulse:f= MHz, 50%; tr = tf≤ 15 ns. Figure3. PropagationDelays S1 and S2 closedexceptas noted. C L includesprobeand jigcapacitance. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS3487
SNLS355C –MAY 1998–REVISED APRIL 2013 www.ti.com Inputpulse:f= MHz, 50%; tr = tf≤ 15 ns. S1 = open fortPZH S2 = open fortPZL Figure4. TRI-STATE Enable and DisableDelays Inputpulse:f= MHz, 50%; tr = tf≤ 15 ns. Figure5. DifferentialRise and FallTimes
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REVISION HISTORY
Changes from RevisionB (April2013)toRevisionC Page Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS3487
www.ti.com 1-Nov-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples DS3487M/NOPB ACTIVE SOIC D 16 48 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS3487M DS3487MX NRND SOIC D 16 2500 TBD Call TI Call TI 0 to 70 DS3487M DS3487MX/NOPB ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS3487M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
www.ti.com 1-Nov-2013 Addendum-Page 2 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS3487MX SOIC D 16 2500 367.0 367.0 35.0 DS3487MX/NOPB SOIC D 16 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 Pack Materials-Page 2
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