DS3486MX TI1 | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 12
Technical content
www.ti.com SNLS354D –MAY 1998–REVISED APRIL 2013 DS3486QuadRS-422,RS-423LineReceiver Check forSamples: DS3486 1FEATURES DESCRIPTION Texas Instruments'quad RS-422, RS-423 receiver 2• Four IndependentReceivers featuresfour independentreceiverswhich comply• TRI-STATE Outputs withEIA Standardsfortheelectricalcharacteristicsof
- InternalHysteresis−140 mV (typ) balanced/unbalancedvoltagedigitalinterfacecircuits. Receiveroutputsare 74LS compatible,TRI-STATE• FastPropagationTimes −19 ns (typ) structureswhichareforcedtoa highimpedance state• TTL Compatible Outputs when the appropriateoutputcontrolpin reaches a
- 5V Supply logiczero condition.A PNP device bufferseach outputcontrolpin to assure minimum loadingfor• Pin Compatible and Interchangeablewith eitherlogicone orlogiczeroinputs.Inaddition,eachMC3486 receiverhas internalhysteresiscircuitryto improve noise margin and discourageoutputinstabilityfor slowlychanginginputwaveforms. Block and Connection Diagrams Figure1. Dual-In-LinePackage Top View D-16 (SOIC)Package or NFG0016E (PDIP) Package Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1998–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SNLS354D –MAY 1998–REVISED APRIL 2013 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings(1)(2) Power SupplyVoltage,VCC 8V InputCommon-Mode Voltage,VICM ±25V InputDifferentialVoltage,VID ±25V TRI-STATE ControlInputVoltage,VI 8V OutputSinkCurrent,IO 50 mA StorageTemperature,TSTG −65°C to+150°C Maximum Power Dissipation(3)at25°C Molded PDIP Package 1362 mW θJA +124.5°C/W θJC +41.2°C/W (1) “AbsoluteMaximum Ratings”arethosevaluesbeyond whichthesafetyofthedevicecannotbe ensured.They arenotmeant toimply thatthedevicesshouldbe operatedattheselimits.The tableof“ElectricalCharacteristics”providesconditionsforactualdevice operation. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityand specifications. (3) DeratePDIP molded package 10.2mW/ °C above 25°C. DerateSOIC package 8.01mW/ °C above 25°C. OperatingConditions Max Min Units Power SupplyVoltage,VCC 4.75 5.25 V OperatingTemperature,TA 0 70 °C InputCommon-Mode Voltage −7.0 7.0 V Range, VICR ElectricalCharacteristics(1) (Unlessotherwisenoted,minimum and maximum limitsapplyoverrecommended temperatureand power supplyvoltage ranges.TypicalvaluesareforTA = 25°C, VCC = 5V and VIC = 0V.) Symbol Parameter Conditions Min Typ Max Units VIH InputVoltage— HighLogicState 2.0 V(TRI-STATE Control) VIL InputVoltage— Low LogicState 0.8 V(TRI-STATE Control) VTH(D) DifferentialInputThresholdVoltage −7V ≤ VIC ≤ 7V,VIH TRI-STATE = 2V 0.070 0.2 VIO = −0.4mA, VOH ≥ 2.7V IO = 8 mA, VOL ≥ 0.5V 0.070 −0.2 V IIB (D) InputBiasCurrent VCC = 0V or5.25V,OtherInputsat0V VI= −10V −3.25 mA VI= −3V −1.50 mA VI= 3V 1.50 mA VI= 10V 3.25 mA InputBalance −7V ≤ VIC ≤ 7V,VIH(3C)= 2V, (2) VOH IO = −0.4mA, VID = 0.4V 2.7 V VOL IO = 8 mA, VID = −0.4V 0.5 V (1) Allcurrentsintodevicepinsareshown as positive,outofdevicepinsarenegative.Allvoltagesreferencedtogroundunlessotherwise noted. (2) RefertoEIA RS-422/3forexactconditions.
2 SubmitDocumentationFeedback Copyright© 1998–2013,Texas InstrumentsIncorporated
ProductFolderLinks:DS3486
www.ti.com SNLS354D –MAY 1998–REVISED APRIL 2013 ElectricalCharacteristics(1)(continued) (Unlessotherwisenoted,minimum and maximum limitsapplyoverrecommended temperatureand power supplyvoltage ranges.TypicalvaluesareforTA = 25°C, VCC = 5V and VIC = 0V.) Symbol Parameter Conditions Min Typ Max Units IOZ OutputTRI-STATE Leakage Current VI(D)= 3V,VIL= 0.8V,VOL = 0.5V −40 μA VI(D)= −3V,VIL= 0.8V,VOH = 2.7V 40 μA IOS OutputShort-CircuitCurrent VI(D)= 3V,VIHTRI-STATE = 2V, −15 −100 mA VO = 0V, (3) IIL InputCurrent— Low LogicState VIL= 0.5V −100 μA(TRI-STATE Control) IIH InputCurrent— HighLogicState VIH = 2.7V 20 μA (TRI-STATE Control) VIH = 5.25V 100 μA VIC InputClamp DiodeVoltage IIN = −10 mA −1.5 V(TRI-STATE Control) ICC Power SupplyCurrent AllInputsVIL= 0V 85 mA (3) Onlyone outputata timeshouldbe shorted. SwitchingCharacteristics (Unlessotherwisenoted,VCC = 5V and TA = 25°C.) Symbol Parameter Min Typ Max Units tPHL(D) PropagationDelayTime— DifferentialInputstoOutput 19 35 ns OutputHightoLow tPLH(D) OutputLow toHigh 19 30 ns tPLZ TRI-STATE ControltoOutput 23 35 ns OutputLow toTRI-STATE tPHZ OutputHightoTRI-STATE 25 35 ns tPZH OutputTRI-STATE toHigh 18 30 ns tPZL OutputTRI-STATE toLow 20 30 ns AC TEST CIRCUIT AND SWITCHING TIME WAVEFORMS Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS3486
SNLS354D –MAY 1998–REVISED APRIL 2013 www.ti.com Inputpulsecharacteristics: tTLH = tTHL = 6 ns (10% to90%) PRR = 1 MHz, 50% dutycycle Figure2. PropagationDelay DifferentialInputtoOutput 1.5VfortPHZ and tPLZ 1.5VfortPLZ and tPZL Inputpulsecharacteristics: tTLH = tTHL = 6 ns (10% to90%) PRR = 1 MHz, 50% dutycycle tPLZ
4 SubmitDocumentationFeedback Copyright© 1998–2013,Texas InstrumentsIncorporated
ProductFolderLinks:DS3486
www.ti.com SNLS354D –MAY 1998–REVISED APRIL 2013 tPHZ tPZH tPZL Figure3. PropagationDelay TRI-STATE ControlInputtoOutput Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS3486
SNLS354D –MAY 1998–REVISED APRIL 2013 www.ti.com
REVISION HISTORY
Changes from RevisionC (April2013)toRevisionD Page
6 SubmitDocumentationFeedback Copyright© 1998–2013,Texas InstrumentsIncorporated
ProductFolderLinks:DS3486
www.ti.com 7-Oct-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples DS3486M ACTIVE SOIC D 16 48 TBD Call TI Call TI 0 to 70 DS3486M DS3486M/NOPB ACTIVE SOIC D 16 48 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS3486M DS3486MX/NOPB ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS3486M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
www.ti.com 7-Oct-2013 Addendum-Page 2
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS3486MX/NOPB SOIC D 16 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 2
Texas InstrumentsIncorporatedand itssubsidiaries(TI)reservetherighttomake corrections,enhancements,improvementsand other changes toitssemiconductorproductsand servicesperJESD46, latestissue,and todiscontinueany productorserviceperJESD48, latest issue.Buyersshouldobtainthelatestrelevantinformationbeforeplacingordersand shouldverifythatsuch informationiscurrentand complete.Allsemiconductorproducts(alsoreferredtohereinas “components”)aresoldsubjecttoTI’s termsand conditionsofsale suppliedatthetimeoforderacknowledgment. TIwarrantsperformanceofitscomponents tothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI’s terms and conditionsofsaleofsemiconductorproducts.Testingand otherqualitycontroltechniquesareused totheextentTIdeems necessary tosupportthiswarranty.Exceptwhere mandated by applicablelaw,testingofallparametersofeach component isnotnecessarily performed. TIassumes no liabilityforapplicationsassistanceorthedesignofBuyers’products.Buyersareresponsiblefortheirproductsand applicationsusingTIcomponents.To minimizetherisksassociatedwithBuyers’productsand applications,Buyersshouldprovide adequatedesignand operatingsafeguards. TIdoes notwarrantorrepresentthatany license,eitherexpressorimplied,isgrantedunderany patentright,copyright,mask work right,or otherintellectualpropertyrightrelatingtoany combination,machine,orprocessinwhichTIcomponents orservicesareused.Information publishedby TIregardingthird-partyproductsorservicesdoes notconstitutea licensetouse such productsorservicesora warrantyor endorsementthereof.Use ofsuch informationmay requirea licensefroma thirdpartyunderthepatentsorotherintellectualpropertyofthe thirdparty,ora licensefromTIunderthepatentsorotherintellectualpropertyofTI. ReproductionofsignificantportionsofTIinformationinTIdatabooks ordatasheetsispermissibleonlyifreproductioniswithoutalteration and isaccompaniedby allassociatedwarranties,conditions,limitations,and notices.TIisnotresponsibleorliableforsuch altered documentation.Informationofthirdpartiesmay be subjecttoadditionalrestrictions. ResaleofTIcomponents orserviceswithstatementsdifferentfromorbeyond theparametersstatedby TIforthatcomponent orservice voidsallexpressand any impliedwarrantiesfortheassociatedTIcomponent orserviceand isan unfairand deceptivebusinesspractice. TIisnotresponsibleorliableforany such statements. Buyeracknowledgesand agreesthatitissolelyresponsibleforcompliancewithalllegal,regulatoryand safety-relatedrequirements concerningitsproducts,and any use ofTIcomponents initsapplications,notwithstandingany applications-relatedinformationorsupport thatmay be providedby TI.Buyerrepresentsand agreesthatithas allthenecessaryexpertisetocreateand implementsafeguardswhich anticipatedangerousconsequencesoffailures,monitorfailuresand theirconsequences,lessenthelikelihoodoffailuresthatmightcause harm and takeappropriateremedialactions.BuyerwillfullyindemnifyTIand itsrepresentativesagainstany damages arisingoutoftheuse ofany TIcomponents insafety-criticalapplications. Insome cases,TIcomponents may be promotedspecificallytofacilitatesafety-relatedapplications.Withsuch components,TI’s goalisto helpenablecustomerstodesignand createtheirown end-productsolutionsthatmeet applicablefunctionalsafetystandardsand requirements.Nonetheless,such components aresubjecttotheseterms. No TIcomponents areauthorizedforuse inFDA ClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersoftheparties have executeda specialagreementspecificallygoverningsuch use. OnlythoseTIcomponents whichTIhas specificallydesignatedas militarygradeor“enhanced plastic”aredesignedand intendedforuse in military/aerospaceapplicationsorenvironments.Buyeracknowledgesand agreesthatany militaryoraerospaceuse ofTIcomponents whichhave not been so designatedissolelyattheBuyer's risk,and thatBuyerissolelyresponsibleforcompliancewithalllegaland regulatoryrequirementsinconnectionwithsuch use. TIhas specificallydesignatedcertaincomponents as meetingISO/TS16949 requirements,mainlyforautomotiveuse.Inany case ofuse of non-designatedproducts,TIwillnotbe responsibleforany failuretomeet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotiveand Transportationwww.ti.com/automotive Amplifiers amplifier.ti.com Communicationsand Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP ® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energyand Lighting www.ti.com/energy Clocksand Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space,Avionicsand Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Videoand Imaging www.ti.com/video RFID www.ti-rfid.com OMAP ApplicationsProcessors www.ti.com/omap TIE2E Community e2e.ti.com WirelessConnectivity www.ti.com/wirelessconnectivity MailingAddress:Texas Instruments,PostOfficeBox 655303,Dallas,Texas 75265 Copyright© 2013,Texas InstrumentsIncorporated