DS30BA101 TI | Alldatasheet
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150 Mbps
3.125 Gbps
100: Differential Cable or 75: Coaxial Cable Max Cable Loss ~ 50 dB @ 1.5 GHz DS30BA101 www.ti.com SNLS403A –FEBRUARY 2012–REVISED APRIL 2013 DS30BA1013.125GbpsDifferentialBuffer Check forSamples: DS30BA101 1FEATURES DESCRIPTION The DS30BA101 isa high-speeddifferentialbufferfor 2• Data Rates from DC to3.125Gbps cabledriving,signalbuffering,and signalrepeating• Supports SD and HD Video Resolutions applications.Itsfullydifferentialsignalpath ensures
- Power Consumption: 165 mW Typical exceptionalsignalintegrityand noiseimmunity.The DS30BA101 drivesbothdifferentialand single-ended• IndustrialTemperature Range: -40°C to+85°C transmissionlinesatdataratesup to3.125Gbps. APPLICATIONS The outputvoltageamplitudeis adjustablevia a singleexternalresistorforcabledrivingapplications• Cable Extension into75Ω single-endedand 100Ω differentialmode• SignalBufferingand Repeating impedances.
- Securityand Surveillance The DS30BA101 is powered from a single3.3V supplyand consumes 165 mW (typical).Itoperates overthefullindustrialtemperaturerange of-40°C to +85°C and isavailableina 4 x 4 mm 16-pinWQFN package. TypicalApplication Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2012–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
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(top view) 85 6 7 1316 15 14 IN+ IN- OUT+ OUT- VCC NC VCC DAP = VEE R VO VEE NC NC NC NC NC NC VEE DS30BA101 SNLS403A –FEBRUARY 2012–REVISED APRIL 2013 www.ti.com Connection Diagram The exposed dieattachpad isa negativeelectricalterminalforthisdevice.Itshouldbe connectedtothenegative power supplyvoltage. Figure1. 16-PinWQFN Package See Package Number RUM0016A PIN DESCRIPTIONS Pin Name I/O,Type Description 1 IN+ I,CML Non-invertinginput. 2 IN- I,CML Invertinginput. 3 VEE Ground Negativepower supply(ground). 4 R VO I,Analog Outputvoltagelevelcontrol.Connecta resistorbetween thispinand VCC tosettheoutput voltage. 5 NC N/A No connect.Not bonded internally. 6 VCC Power Positivepower supply(+3.3V). 7 NC N/A No connect.Not bonded internally. 8 NC N/A No connect.Not bonded internally. 9 VCC Power Positivepower supply(+3.3V). 10 VEE Ground Negativepower supply(ground). 11 OUT- O, Data Invertingoutput. 12 OUT+ O, Data Non-invertingoutput. 13 NC N/A No connect.Not bonded internally. 14 NC N/A No connect.Not bonded internally. 15 NC N/A No connect.Not bonded internally. 16 NC N/A No connect.Not bonded internally. DAP VEE Ground Connectexposed DAP tonegativepower supply(ground). These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates.
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www.ti.com SNLS403A –FEBRUARY 2012–REVISED APRIL 2013 AbsoluteMaximum Ratings(1) SupplyVoltage: 3.6V InputVoltage(allinputs) −0.3VtoVCC +0.3V OutputCurrent 28 mA StorageTemperatureRange −65°C to+150°C JunctionTemperature +125°C Package ThermalResistance θJA 16-pinWQFN +58°C/W θJC 16-pinWQFN +21°C/W ESD Rating(HBM) ≥±4.5kV ESD Rating(MM) ≥±250V ESD Rating(CDM) ≥±2 kV (1) “AbsoluteMaximum Ratings”indicatelimitsbeyond whichdamage tothedevicemy occur,includinginoperabilityand degradationof devicereliabilityand/orperformance.Functionaloperationofthedeviceand/ornon-degradationattheAbsoluteMaximum Ratingsor otherconditionsbeyond thoseindicatedintheRecommended OperatingConditionsisnotimplied.The Recommended Operating Conditionsindicateconditionsatwhichthedeviceisfunctionaland thedeviceshouldnotbe operatedbeyond such conditions. Recommended OperatingConditions SupplyVoltage(VCC ): 3.3V±5% OperatingFreeAirTemperature(TA) -40°C to+85°C DC ElectricalCharacteristics Over recommended supplyvoltageand operatingtemperatureranges,unlessotherwisespecified.(1)(2) Parameter TestConditions Reference Min Typ Max Units VICM InputCommon Mode Voltage IN+,IN- 1.1+ VCC – V VID/2 VID/2 VID InputVoltageSwing Differential 100 2200 mV P−P VOCM OutputCommon Mode Voltage OUT+, OUT- VCC – V VOUT VOUT OutputVoltage Single-ended,75Ω load, 800 mV P-PR VO = 750Ω Single-ended,50Ω load, 400 mV P-PR VO = 953Ω ICC SupplyCurrent 50 59 mA (1) The ElectricalCharacteristicstableslistensuredspecificationsunderthelistedRecommended OperatingConditionsexceptas otherwisemodifiedorspecifiedby theElectricalCharacteristicsConditionsand/orNotes.Typicalspecificationsareestimationsonlyand arenotensured. (2) Typicalvaluesrepresentmost likelyparametricnorms atVCC = +3.3V,TA = +25°C, and attheRecommended OperatingConditionsat thetimeofproductcharacterizationand arenotensured. AC ElectricalCharacteristics Over recommended supplyvoltageand operatingtemperatureranges,unlessotherwisespecified.(1)(2) Parameter TestConditions Reference Min Typ Max Units DR IN InputData Rate IN+,IN- 3125 Mbps tTLH TransitionTime Low toHigh 20% -80% (3) OUT+, 90 130 ps OUT-tTHL TransitionTime HightoLow 90 130 ps (1) The ElectricalCharacteristicstableslistensuredspecificationsunderthelistedRecommended OperatingConditionsexceptas otherwisemodifiedorspecifiedby theElectricalCharacteristicsConditionsand/orNotes.Typicalspecificationsareestimationsonlyand arenotensured. (2) Typicalvaluesrepresentmost likelyparametricnorms atVCC = +3.3V,TA = +25°C, and attheRecommended OperatingConditionsat thetimeofproductcharacterizationand arenotensured. (3) Specificationisensuredby characterizationand isnottestedinproduction. Copyright© 2012–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS30BA101
0.1 PF50:50:953:
100: 1 PF 1 PF 1 PF 1 PF DS30EA101 IN+ IN- 100: OUT+ OUT- VCC 100: Differential TP CableR VO DS30BA101 SNLS403A –FEBRUARY 2012–REVISED APRIL 2013 www.ti.com DEVICE OPERATION INPUT INTERFACING The DS30BA101 acceptseitherdifferentialor single-endedinput.DC-coupled inputsmust be keptwithinthe specifiedcommon-mode range. OUTPUT INTERFACING The DS30BA101 uses currentmode outputs.Single-endedoutputlevelsare 800 mV P-P into75Ω AC-coupled coaxialcablewithan R VO resistorof750Ω,or400 mV P-P (800mV P-P differential)into100Ω differentialcablewith an R VO resistorof 953Ω. The outputvoltageleveliscontrolledby the valueof the R VO resistorconnected between theR VO pinand VCC . The R VO resistorshouldbe placedas closeas possibletotheR VO pin.Inaddition,thecopperintheplanelayers belowtheR VO networkshouldbe removed tominimizeparasiticcapacitance. Figure2 and Figure3 show thetypicalconfigurationsfordifferentialoutputand single-endedoutput,respectively. Forsingle-endedoutput,theunused outputmust be properlyterminatedas shown.
APPLICATION INFORMATION
CABLE EXTENDER APPLICATION The DS30BA101 togetherwiththeDS30EA101 forma cableextenderchipsetoptimizedforextendingserialdata streamsfrom serializer/deseralizer(SerDes)pairsand FPGAs over 100Ω differentialcablesand 75Ω coaxial cables.SettingthecorrectDS30BA101 outputamplitudeand propercableterminationare essentialforoptimal operation.Figure2 shows therecommended chipsetconfigurationfor100Ω differentialcableand Figure3 shows therecommended chipsetconfigurationfor75Ω coaxialcable. Figure2. Cable ExtenderChipsetApplicationCircuitfor100Ω DifferentialCable
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0.1 PF75:75:750:
100:
1 PF 1 PF
75: OUT+ OUT- VCC 37.4: R VO 75: Coaxial Cable 1 PF 75: DS30BA101 www.ti.com SNLS403A –FEBRUARY 2012–REVISED APRIL 2013 Figure3. Cable ExtenderChipsetApplicationCircuitfor75Ω CoaxialCable Copyright© 2012–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS30BA101
SNLS403A –FEBRUARY 2012–REVISED APRIL 2013 www.ti.com
REVISION HISTORY
Changes from Original(April2013)toRevisionA Page
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www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) DS30BA101SQ/NOPB Active Production WQFN (RUM) | 16 1000 | SMALL T&R Yes SN Level-3-260C-168 HR -40 to 85 30BA101 DS30BA101SQ/NOPB.A Active Production WQFN (RUM) | 16 1000 | SMALL T&R Yes SN Level-3-260C-168 HR -40 to 85 30BA101 DS30BA101SQE/NOPB Active Production WQFN (RUM) | 16 250 | SMALL T&R Yes SN Level-3-260C-168 HR -40 to 85 30BA101 DS30BA101SQE/NOPB.A Active Production WQFN (RUM) | 16 250 | SMALL T&R Yes SN Level-3-260C-168 HR -40 to 85 30BA101 DS30BA101SQX/NOPB Active Production WQFN (RUM) | 16 4500 | LARGE T&R Yes SN Level-3-260C-168 HR -40 to 85 30BA101 DS30BA101SQX/NOPB.A Active Production WQFN (RUM) | 16 4500 | LARGE T&R Yes SN Level-3-260C-168 HR -40 to 85 30BA101 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
www.ti.com 23-May-2025 Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 13-May-2024 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 13-May-2024 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS30BA101SQ/NOPB WQFN RUM 16 1000 208.0 191.0 35.0 DS30BA101SQE/NOPB WQFN RUM 16 250 208.0 191.0 35.0 DS30BA101SQX/NOPB WQFN RUM 16 4500 356.0 356.0 36.0 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE C 4.1 3.9 4.1 3.9 0.8 0.70.05 0.00 2X 1.95 12X 0.65 2X 1.95 16X 0.5 0.3 16X 0.35 0.25 2.6 0.1 (DIM A) TYP WQFN - 0.8 mm max heightRUM0016A PLASTIC QUAD FLATPACK - NO LEAD 4214998/A 11/2021 DIM A OPT 1 OPT 2 0.2 0.1 0.08 C
0.1 C A B
0.05 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. PIN 1 INDEX AREA SEATING PLANE PIN 1 ID (45 X 0.3) SYMM EXPOSED THERMAL PAD SYMM 5 8 1316 SCALE 3.000 AB
www.ti.com EXAMPLE BOARD LAYOUT 12X (0.65) (1.05) (1.05) (R0.05) TYP
0.07 MAX
0.07 MIN
16X (0.6) 16X (0.3) (3.8) (3.8) ( 2.6) ( 0.2) TYP VIA WQFN - 0.8 mm max heightRUM0016A PLASTIC QUAD FLATPACK - NO LEAD 4214998/A 11/2021 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 20X SEE SOLDER MASK DETAIL 5 8 1316 METAL EDGE SOLDER MASK OPENING EXPOSED METAL METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METAL NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS
www.ti.com EXAMPLE STENCIL DESIGN 16X (0.6) 16X (0.3) 12X (0.65) (3.8) (3.8) (0.675) TYP (0.675) TYP 4X ( 1.15) (R0.05) TYP WQFN - 0.8 mm max heightRUM0016A PLASTIC QUAD FLATPACK - NO LEAD 4214998/A 11/2021 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SOLDER PASTE EXAMPLE BASED ON 0.125 MM THICK STENCIL SCALE: 20X EXPOSED PAD 17 78% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SYMM SYMM 5 8 1316
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