DS280DF810ABVT

DS280DF810 TI1 | Alldatasheet

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CAL_CLK_IN CAL_CLK_OUT ADDR0 ADDR1 TEST SDC (1) READ_EN_N ALL_DONE_N SDA (1) INT_N TX0P TX0N TX7P TX7N GND (1) SMBus signals need to be pulled up elsewhere in the system.

25 MHz

7RQH[WGHYLFH¶V CAL_CLK_IN Float for SMBus Slave mode, or connect to next GHYLFH¶V5($'_EN_N for SMBus Master mode 2.5V or 3.3V To other open-drain interrupt pinsVDD F (2x) 0.1 F (4x) SMBus Slave mode SMBus Slave mode 2.5V EN_SMB Address straps (pull-up, pull- down, or float) 1 NŸ To system SMBus ADVANCE□INFORMATION An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for pre-production products; subject to change without notice. DS280DF810 SNLS533 – JUNE 2016 DS280DF81028GbpsMulti-Rate8-ChannelRetimer

1 Features

1• Octal-Channel Multi-Rate Retimer with Integrated Signal Conditioning

• All Channels Lock Independently from 20.2 to 28.4 Gbps (Including Sub-Rates Like 10.1376 Gbps, 10.3125 Gbps, 12.5 Gbps, and More)
• Ultra-Low Latency: <500 ps typical for 28.4 Gbps data rate
• Single Power Supply, No Low-Jitter Reference Clock Required, and Integrated AC Coupling Capacitors to Reduce Board Routing Complexity and BOM Cost
• Integrated 2×2 Cross Point
• Adaptive Continuous Time Linear Equalizer (CTLE)
• Adaptive Decision Feedback Equalizer (DFE)
• Low-Jitter Transmitter with 3-Tap FIR Filter
• Combined Equalization Supporting 35+ dB Channel Loss at 12.9 GHz; 30+ dB Channel Loss at 14 GHz
• Adjustable Transmit Amplitude: 205 mVppd to 1225 mVppd (typical)
• On-Chip Eye Opening Monitor (EOM), PRBS Pattern Checker/Generator
• Small 8 mm × 13 mm BGA Package with Easy Flow-Through Routing
• Unique Pinout Allows Routing High-Speed Signals Underneath the Package
• Pin-Compatible Repeater Available
• Extended Temperature Range: -40 ºC to 85 ºC

2 Applications

• Backplane/Mid-plane Reach Extension
• Jitter Cleaning for Front-Port Optical
• IEEE802.3bj 100GbE, Infiniband EDR, and OIF- CEI-25G-LR/MR/SR/VSR Electrical Interfaces
• SFP28, QSFP28, CFP2/CFP4, CDFP

3 Description

The DS280DF810 is an eight-channel multi-rate Retimer with integrated signal conditioning. It is used to extend the reach and robustness of long, lossy, crosstalk-impaired high-speed serial links while achieving a bit error rate (BER) of 10-15 or less. Each channel of the DS280DF810 independently locks to serial data rates in a continuous range from 20.2 Gbps to 28.4 Gbps or to any supported sub-rate (÷2 and ÷4), including key data rates such as 10.1376 Gbps, 10.3125 Gbps, and 12.5 Gbps, which allows the DS280DF810 to support individual lane Forward Error Correction (FEC) pass-through. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) DS280DF810 135-pin fcBGA (135) 8.0 mm × 13.0 mm (1) For all available packages, see the orderable addendum at the end of the data sheet.

4 Simplified Schematic

ADVANCE□INFORMATION DS280DF810 SNLS533 – JUNE 2016 www.ti.com Product Folder Links: DS280DF810 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated

5 Description (Continued)

Integrated physical AC coupling capacitors (TX and RX) eliminate the need for external capacitors on the PCB. The DS280DF810 has a single power supply and minimal need for external components. These features reduce PCB routing complexity and BOM cost. The advanced equalization features of the DS280DF810 include a low-jitter 3-tap transmit finite impulse response (FIR) filter, an adaptive continuous-time linear equalizer (CTLE), and an adaptive decision feedback equalizer (DFE). This enables reach extension for lossy interconnect and backplanes with multiple connectors and crosstalk. The integrated CDR function is ideal for front-port optical module applications to reset the jitter budget and retime the high-speed serial data. The DS280DF810 implements 2x2 cross-point on each channel pair, providing the host with both lane crossing and fanout options. The DS280DF810 can be configured either via the SMBus or through an external EEPROM. Up to 16 devices can share a single EEPROM. A non-disruptive on-chip eye monitor and a PRBS generator/checker allow for in- system diagnostics.

ADVANCE□INFORMATION DS280DF810 www.ti.com SNLS533 – JUNE 2016 Product Folder Links: DS280DF810 Submit Documentation FeedbackCopyright © 2016, Texas Instruments Incorporated Table of Contents

8 Mechanical, Packaging, and Orderable

6 Revision History

June 2016 * Initial release.

ADVANCE□INFORMATION DS280DF810 SNLS533 – JUNE 2016 www.ti.com Product Folder Links: DS280DF810 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated

7 Device and Documentation Support

7.1 Documentation Support

7.1.1 Related Documentation

For related documentation see the following:

• SNLU182 25G/28G Retimer Programmer's Guide

7.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

7.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

7.4 Trademarks

E2E is a trademark of Texas Instruments.

7.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

7.6 Glossary

SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.

ADVANCE□INFORMATION DS280DF810 www.ti.com SNLS533 – JUNE 2016 Product Folder Links: DS280DF810 Submit Documentation FeedbackCopyright © 2016, Texas Instruments Incorporated

8 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com 30-Jul-2016 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples DS280DF810ABVR PREVIEW FCBGA ABV 135 1000 TBD Call TI Call TI -40 to 85 DS280DF8 DS280DF810ABVT PREVIEW FCBGA ABV 135 250 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 DS280DF8 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

www.ti.com 30-Jul-2016 Addendum-Page 2 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

www.ti.com PACKAGE OUTLINE C2.51 MAX TYP0.405 0.325 6.4 TYP

11.2 TYP

0.8 TYP

135X 0.51 0.41 (0.58) B 13.2 12.9 A 8.2 7.9 (0.9) TYP (0.8) TYP (11) (6) (0.5) 2X (2.8) 2X (1) 2X (2.6) FCBGA - 2.51 mm max heightABV0135A BALL GRID ARRAY 4221740/B 02/2016 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. BALL A1 CORNER SEATING PLANE BALL TYP 0.2 C

0.2 C A B

0.08 C SYMM SYMM BALL A1 CORNER J C D E F G H 1 2 3 4 155 6 7 8 9 10 A B 11 12 13 14 SCALE 1.300

www.ti.com EXAMPLE BOARD LAYOUT 135X ( )0.4 (0.8) TYP (0.8) TYP ( ) METAL 0.4 0.05 MAX SOLDER MASK OPENING METAL UNDER SOLDER MASK ( ) SOLDER MASK OPENING 0.4

0.05 MIN

FCBGA - 2.51 mm max heightABV0135A BALL GRID ARRAY 4221740/B 02/2016 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For information, see Texas Instruments literature number SPRU811 (www.ti.com/lit/spru811). SYMM SYMM LAND PATTERN EXAMPLE SCALE:8X A B C D E F G H J 1 2 4 5 6 7 8 9 10 11 12 13 14 15 NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS NOT TO SCALE SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN (0.8) TYP (0.8) TYP ( ) TYP0.4 FCBGA - 2.51 mm max heightABV0135A BALL GRID ARRAY 4221740/B 02/2016 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. SYMM SYMM SOLDER PASTE EXAMPLE BASED ON 0.15 mm THICK STENCIL SCALE:8X A B C D E F G H J 1 2 4 5 6 7 8 9 10 11 12 13 14 15

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