DS26C32AMQML TI | Alldatasheet

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www.ti.com SNOSAS3A –OCTOBER 2010–REVISED APRIL 2013 DS26C32AMQMLQuadDifferentialLineReceiver Check forSamples: DS26C32AMQML 1FEATURES DESCRIPTION The DS26C32A is a quad differentiallinereceiver 2• CMOS Design forLow Power designedto meet the RS-422, RS-423, and Federal• ±0.2VSensitivityOver InputCommon Mode Standards 1020 and 1030 for balanced andVoltageRange unbalanceddigitaldata transmission,whileretaining

  • InputFail-SafeCircuitry thelowpower characteristicsofCMOS.
  • InputsWon't Load LineWhen VCC = 0V The DS26C32A has an inputsensitivityof 200 mV over the common mode inputvoltagerange of ±7V.• Meets theRequirements ofEIA Standard RS- The DS26C32A featuresinternalpull-upand pull-422 down resistorswhich preventoutputoscillationon• TRI-STATE Outputs forConnection toSystem unused channels.Buses The DS26C32A providesan enable and disable functioncommon to allfourreceivers,and features TRI-STATE outputswith 6 mA source and sink capability.This productis pin compatiblewith the DS26LS32A and theAM26LS32. CONNECTION DIAGRAMS Figure1. CDIP and CLGA Packages-Top View See Package Numbers NFE0016A, NAC0016A, or NAD0016A Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2010–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SNOSAS3A –OCTOBER 2010–REVISED APRIL 2013 www.ti.com Figure2. 20-Lead LCCC Package-Top View See Package Number NAJ0020A Logic Diagram TruthTable (1) ENABLE ENABLE Input Output L H X Z AllOther VID ≥ V Th (Max) H Combinationsof VID ≤ V Th (Min) LEnableInputs Open H (1) Z = TRI-STATE These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates.

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www.ti.com SNOSAS3A –OCTOBER 2010–REVISED APRIL 2013 AbsoluteMaximum Ratings(1)(2) SupplyVoltage(VCC ) 7V Common Mode Range (VCM ) ±14V DifferentialInputVoltage(VDiff) ±14V EnableInputVoltage(V I) 7V StorageTemperatureRange (TStg) −65°C ≤ TA ≤ +150°C Lead Temperature(Soldering4 sec.) 260°C (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisfunctional,butdo notverifyspecificperformancelimits.Forverifiedspecificationsand testconditions,see the ElectricalCharacteristics.The verifiedspecificationsapplyonlyforthetestconditionslisted.Some performancecharacteristicsmay degradewhen thedeviceisnotoperatedunderthelistedtestconditions. (2) Unlessotherwisespecified,allvoltagesarereferencedtoground. Recommended OperatingConditions Min Max Units SupplyVoltage(VCC ) 4.50 5.50 V OperatingTemperatureRange (TA) −55 +125 °C QualityConformance Inspection Table1.Mil-Std-883,Method 5005 -Group A Subgroup Description Temp °C

1 Statictestsat +25

2 Statictestsat +125

3 Statictestsat -55

4 Dynamic testsat +25

5 Dynamic testsat +125

6 Dynamic testsat -55

7 Functionaltestsat +25

9 Switchingtestsat +25

10 Switchingtestsat +125

11 Switchingtestsat -55

12 Settlingtimeat +25

13 Settlingtimeat +125

14 Settlingtimeat -55

DS26C32AM ElectricalCharacteristicsDC Parameters Sub-Parameter TestConditions Notes Min Max Unit groups VTH Minimum DifferentialInput VCC = 5V,VO = VOH orVOL , -200 +200 mV 1,2,3 Voltage -7< VCM < +7 R I InputResistance VCC = 5V,-7< VCM < +7, 4.5 11 KΩ 1,2,3 One inputAC Gnd II InputCurrent VCC = 5V,VI= +10V, +1.8 mA 1,2,3 OtherInput= Gnd VCC = 5V,VI= -10V, -2.7 mA 1,2,3 OtherInput= Gnd VOH Logical"1"OutputVoltage VCC = 4.5V,VDiff= +1V, 3.8 V 1,2,3 IO = -6.0mA VOL Logical"0"OutputVoltage VCC = 5.5V,VCC = Max, 0.3 V 1,2,3 VDiff= -1V,IO = 6.0mA Copyright© 2010–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS26C32AMQML

SNOSAS3A –OCTOBER 2010–REVISED APRIL 2013 www.ti.com DS26C32AM ElectricalCharacteristicsDC Parameters (continued) Sub-Parameter TestConditions Notes Min Max Unit groups VIH Minimum EnableHighLevel (1) 2.0 V 1,2,3 Voltage VIL Maximum EnableLow Level (1) 0.8 V 1,2,3 Voltage IOZ Maximum TRI-STATE Output VO = VCC orGnd, ±5.0 µA 1,2,3 Leakage Current Enable= VIL,Enable= VIH II Maximum EnableInputCurrent VI= VCC orGnd ±1.0 µA 1,2,3 ICC QuiescentPower SupplyCurrent VDiff= +1V, VCC = 5.5V 25 mA 1,2,3 (1) ParametertestedGo-No-Go only. DS26C32AM ElectricalCharacteristicsAC Parameters -PropagationDelay Time The followingconditionsapply,unlessotherwisespecified.VCC = 5V ±10%, C CL = 50pF,VDiff= 2.5V Sub-Parameter TestConditions Notes Min Max Unit groups tPLH InputtoOutputProp Delay VCM = 0V 35 ns 9,10,11 tPHL InputtoOutputProp Delay VCM = 0V 35 ns 9,10,11 tRise OutputRiseTime VCM = 0V 9 ns 9,10,11 tFall OutputFallTime VCM = 0V 9 ns 9,10,11 tPLZ OutputDisableTime R L = 1000Ω 29 ns 9,10,11 tPZL OutputEnableTime R L = 1000Ω 29 ns 9,10,11 tPHZ OutputDisableTime R L = 1000Ω 29 ns 9,10,11 tPZH OutputEnableTime R L = 1000Ω 29 ns 9,10,11

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www.ti.com SNOSAS3A –OCTOBER 2010–REVISED APRIL 2013 TypicalPerformance Characteristics DifferentialPropagationDelay DifferentialPropagationDelay vs Temperature vs Power Supply Voltage Figure3. Figure4. DifferentialSkew vs DifferentialSkew vs Power Temperature Supply Voltage Figure5. Figure6. Output High Voltagevs Output High Voltagevs Output High Current Output High Current Figure7. Figure8. Copyright© 2010–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS26C32AMQML

SNOSAS3A –OCTOBER 2010–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristics(continued) Output Low Voltagevs Output Low Voltagevs Output Low Current Output Low Current Figure9. Figure10. InputCurrent vs InputResistancevs Power InputVoltage Supply Voltage Figure11. Figure12. Hysteresis& Differential Hysteresis& Differential TransitionVoltagevs TransitionVoltagevs Temperature Power Supply Voltage Figure13. Figure14.

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www.ti.com SNOSAS3A –OCTOBER 2010–REVISED APRIL 2013 TypicalPerformance Characteristics(continued) Supply Currentvs DisabledSupply Currentvs Temperature Power Supply Voltage Figure15. Figure16. Supply Currentvs Data Rate Figure17. Copyright© 2010–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS26C32AMQML

SNOSAS3A –OCTOBER 2010–REVISED APRIL 2013 www.ti.com AC TEST CIRCUIT AND SWITCHING TIME WAVEFORMS C L includesloadand testjigcapacitance. S1 = VCC fortPZL,and tPLZ measurements. S1 = Gnd fortPZH ,and tPHZ measurements. Figure18. TestCircuitforTRI-STATE Output Tests Figure19. PropagationDelay Figure20. TRI-STATE Output Enable and DisableWaveforms TYPICAL APPLICATIONS Figure21. Two-Wire Balanced Systems, RS-422

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www.ti.com SNOSAS3A –OCTOBER 2010–REVISED APRIL 2013

REVISION HISTORY

Released Revision Section Changes 10/26/2010 * New Release,Corporateformat MDS datasheetsconvertedintoone Corp.datasheet format.MNDS26C32AM-X Rev 0B0 willbe archived. 4/15/2013 A Changed layoutofNationalData SheettoTIformat Copyright© 2010–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:DS26C32AMQML

www.ti.com 29-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) 5962-9164001M2A Active Production LCCC (NAJ) | 20 50 | TUBE Yes Call TI Level-1-NA-UNLIM -55 to 125 DS26C32AME /883 Q 5962-91640 01M2A ACO 01M2A >T 5962-9164001MEA Active Production CDIP (NFE) | 16 25 | TUBE No Call TI Level-1-NA-UNLIM -55 to 125 DS26C32AMJ/883 5962-9164001MEA Q 5962-9164001MFA Active Production CFP (NAD) | 16 19 | TUBE No Call TI Level-1-NA-UNLIM -55 to 125 DS26C32AMW /883 Q 5962-91640 01MFA ACO 01MFA >T 5962-9164001MXA Active Production CFP (NAC) | 16 88 | JEDEC TRAY (5+1) No Call TI Level-1-NA-UNLIM -55 to 125 DS26C32AMWG /883 Q 5962-91640 01MXA ACO 01MXA >T DS26C32A MD8 Active Production DIESALE (Y) | 0 100 | JEDEC TRAY (5+1) Yes Call TI Level-1-NA-UNLIM -55 to 125 DS26C32A-MD8.A Active Production DIESALE (Y) | 0 100 | JEDEC TRAY (5+1) Yes Call TI Level-1-NA-UNLIM -55 to 125 DS26C32AME/883 Active Production LCCC (NAJ) | 20 50 | TUBE Yes Call TI Level-1-NA-UNLIM -55 to 125 DS26C32AME /883 Q 5962-91640 01M2A ACO 01M2A >T DS26C32AME/883.A Active Production LCCC (NAJ) | 20 50 | TUBE Yes Call TI Level-1-NA-UNLIM -55 to 125 DS26C32AME /883 Q 5962-91640 01M2A ACO 01M2A >T DS26C32AMJ/883 Active Production CDIP (NFE) | 16 25 | TUBE No Call TI Level-1-NA-UNLIM -55 to 125 DS26C32AMJ/883 5962-9164001MEA Q DS26C32AMJ/883.A Active Production CDIP (NFE) | 16 25 | TUBE No Call TI Level-1-NA-UNLIM -55 to 125 DS26C32AMJ/883 5962-9164001MEA Q Addendum-Page 1

www.ti.com 29-May-2025 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) DS26C32AMW/883 Active Production CFP (NAD) | 16 19 | TUBE No Call TI Level-1-NA-UNLIM -55 to 125 DS26C32AMW /883 Q 5962-91640 01MFA ACO 01MFA >T DS26C32AMW/883.A Active Production CFP (NAD) | 16 19 | TUBE No Call TI Level-1-NA-UNLIM -55 to 125 DS26C32AMW /883 Q 5962-91640 01MFA ACO 01MFA >T DS26C32AMWG/883 Active Production CFP (NAC) | 16 88 | JEDEC TRAY (5+1) No Call TI Level-1-NA-UNLIM -55 to 125 DS26C32AMWG /883 Q 5962-91640 01MXA ACO 01MXA >T DS26C32AMWG/883.A Active Production CFP (NAC) | 16 88 | JEDEC TRAY (5+1) No Call TI Level-1-NA-UNLIM -55 to 125 DS26C32AMWG /883 Q 5962-91640 01MXA ACO 01MXA >T (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Addendum-Page 2

www.ti.com 29-May-2025 Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3

PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) 5962-9164001M2A NAJ LCCC 20 50 470 11 3810 0 5962-9164001MEA NFE CDIP 16 25 506.98 15.24 13440 NA 5962-9164001MFA NAD CFP 16 19 502 23 9398 9.78 DS26C32AME/883 NAJ LCCC 20 50 470 11 3810 0 DS26C32AME/883.A NAJ LCCC 20 50 470 11 3810 0 DS26C32AMJ/883 NFE CDIP 16 25 506.98 15.24 13440 NA DS26C32AMJ/883.A NFE CDIP 16 25 506.98 15.24 13440 NA DS26C32AMW/883 NAD CFP 16 19 502 23 9398 9.78 DS26C32AMW/883.A NAD CFP 16 19 502 23 9398 9.78 Pack Materials-Page 1

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www.ti.com PACKAGE OUTLINE 14X .050 .002 [1.27 0.0508] .250+.020 -.005 [6.35+0.508 -0.127 .410 .010 [10.414 0.254] .010 .002 [0.254 0.0508] .00 MIN TYP [0.0] 16X .017 .002 [0.4318 0.0508] R.015 .002 [0.381 0.0508] .040 .003 [1.016 0.0762]0 -4 .070+.010 -.020 [1.778+0.254 -0.508 .008 .004 TYP [0.2032 0.1016] .018 MAX TYP [0.46] .006 .002 TYP [0.1524 0.0508] .3870 .0030 [9.83 0.076] CFP - 2.33mm max height NAC0016A CERAMIC FLATPACK NOTES: 1. Controlling dimension is Inch. Values in [ ] are milimeters. Dimensions in ( ) for reference only. 2. For solder thickness and composition, see the "Lead Finish Composition/Thickness" link in the packaging section of the Texas Instruments website 3. Lead 1 identification shall be: a) A notch or other mark within this area b) A tab on lead 1, either side 4. No JEDEC registration as of December 2021 4215198/C 08/2022 8 9 NOTE 3 LEAD 1 ID SUPPLIER OPTION NOTE 3 .004 [0.1] SEE DETAIL A SEATING PLANE SCALE:12.000[ DETAIL A DETAIL A TYPICAL SCALE 1.500

www.ti.com EXAMPLE BOARD LAYOUT (14X .050 ) [1.27] R.002 TYP [0.05] .003 MIN [0.07] ALL AROUND .003 MAX [0.07] ALL AROUND (16X .090 ) [2.29] (16X .027 ) [0.69] (.37 ) [9.4] CFP - 2.33mm max height NAC0016A CERAMIC FLATPACK RECOMMENDED LAND PATTERN SYMM SYMM 4215198/C 08/2022 NON SOLDERMASK DEFINED METAL OPENING SOLDERMASK SOLDERMASK DEFINED SOLDERMASK OPENING SOLDER MASK METAL UNDER

A SIZESCALE PAGE 4 OF REVISIONS BY/APP'DDATEE.C.N.DESCRIPTIONREV TINA TRAN / ANIS FAUZI12/30/20212197879RELEASE TO DOCUMENT CONTROLA K. SINCERBOX02/15/20222198832NO CHANGE TO DRAWING; REVISION FOR YODA RELEASE;B 4215198 REV C

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